NXP Semiconductors S9S12VR64AF0MLC
- Part No.:
- S9S12VR64AF0MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S12VR64AF0MLC.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S12VR64AF0MLC from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller with 64 KB on-chip Flash, 4 KB RAM, integrated LIN physical layer transceiver, high-side and low-side drivers, and supply voltage sensing. It operates at up to 25 MHz bus clock, supports 5 V operation, and targets automotive body control modules requiring robust I/O, embedded power switching, and LIN communication.
For engineers reviewing the S9S12VR64AF0MLC datasheet, S9S12VR64AF0MLC pinout, S9S12VR64AF0MLC application, or S9S12VR64AF0MLC equivalent, key selection criteria include its integrated HSDRV/LSDRV driver outputs, LINPHY compliance per ISO 17987-4, 10-bit ADC with 8 channels, on-chip voltage regulator (VREG), and BDM debug interface - all in a 48-pin LQFP package rated for -40°C to +125°C.
Technical Context
The S9S12VR64AF0MLC implements the HCS12 CPU12 core with 16-bit data path and von Neumann architecture, executing instructions from internal Flash or external memory via expanded addressing. Its CPMU unit manages multiple clock sources including internal RC oscillator (IRC), external crystal (XOSCLCP), and PLL-based system clock generation with programmable dividers.
Integrated analog and power peripherals include an 8-channel 10-bit ADC with external trigger support, dual independent PWM modules (8-bit and 16-bit), and dedicated high-side (HSDRV) and low-side (LSDRV) driver blocks with overcurrent protection and thermal shutdown. The LINPHY module provides full ISO 17987-4 compliant physical layer with wake-up capability and bus fault detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 16 MB linear address space and 24-bit program counter |
| Flash Memory | 64 KB on-chip Flash with ECC, supporting in-application programming and 100K write/erase cycles |
| RAM | 4 KB on-chip SRAM with retention in stop modes |
| Bus Clock Speed | Up to 25 MHz - determines instruction execution rate and peripheral timing resolution |
| ADC Resolution | 10-bit successive approximation with 8 input channels and configurable sample-and-hold |
| LINPHY Compliance | Fully compliant with ISO 17987-4:2016, supporting 10–20 kbps data rates and bus wake-up |
| Operating Temperature | -40°C to +125°C - qualified for under-hood automotive applications |
| Supply Voltage | 5.0 V ±10% - single-supply operation with integrated VREG for core logic and NVM |
Pinout & Package
Package: 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD powers core logic; VSS is common reference for digital and analog sections |
| PORTP[7:0] | General-purpose I/O with reduced drive | Configurable as inputs/outputs; RDRP register enables 10 mA sink/source for LED or relay driving |
| HSDRV[3:0] | High-side driver outputs | Four integrated N-channel MOSFET drivers with current limiting, thermal shutdown, and diagnostic feedback |
| LSDRV[3:0] | Low-side driver outputs | Four integrated N-channel MOSFET drivers with open-load detection and short-circuit protection |
| LINRX/LINTX | LIN bus interface pins | Dedicated differential receiver and transmitter pins compliant with LIN PHY electrical specifications |
| AD0–AD7 | Analog input channels | Eight single-ended inputs shared with PORTL pins; support internal reference (VDDA) or external reference |
| BKGD | Background Debug pin | Single-wire BDM interface for flash programming, breakpoint debugging, and real-time register access |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LIN Physical Layer | Eliminates need for external LIN transceiver IC, reducing BOM count and PCB area in body electronics nodes |
| On-chip High-Side Drivers | Four 12 V-tolerant drivers with built-in current sense and thermal foldback - suitable for solenoid, lamp, and motor control |
| Supply Voltage Sensing (BATS) | Monitors battery voltage with 10-bit ADC resolution and programmable thresholds for low-voltage warning and shutdown |
| Background Debug Module (BDM) | Enables in-circuit flash programming and real-time debugging without halting CPU operation |
| On-Chip Voltage Regulator (VREG) | Generates stable 2.5 V core supply and 5 V NVM supply from single 5 V input - simplifies power design |
Applications
| Automotive Door Module | Seat Control Unit |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main controller executing LIN slave protocol, managing HSDRV/LSDRV outputs for motor direction and lamp switching, and monitoring switch inputs via PORTP/PORTL. Use Value: Reduces component count by integrating LIN PHY, drivers, and ADC - enabling compact 48-pin LQFP implementation with no external transceiver or driver ICs. | Use Scenario: Position and heating control for driver/passenger seats using motors, potentiometers, and resistive heaters. IC Role / Device Role / Timing Role: LIN slave node coordinating with body control module; uses ADC for position feedback, PWM for heater duty cycle, and LSDRV for motor H-bridge control. Use Value: On-chip 10-bit ADC and dual PWM modules enable precise closed-loop seat positioning and thermal regulation without external signal conditioning. |
| Roof Module (Sunroof/Convertibles) | Trunk/Liftgate Actuation |
Use Scenario: Motorized sunroof or convertible top actuation with obstacle detection and soft-stop functionality. IC Role / Device Role / Timing Role: LIN slave controlling bidirectional DC motors via LSDRV outputs; monitors current sense feedback and hall sensor inputs using ADC and PORTT. Use Value: Integrated overcurrent protection and thermal shutdown in LSDRV blocks prevent damage during jam conditions - critical for safety-critical motion systems. | Use Scenario: Power-assisted liftgate or trunk opening/closing with anti-pinch and position tracking. IC Role / Device Role / Timing Role: LIN-connected controller using HSDRV outputs to drive latching solenoids and LSDRV to control motor direction; ADC reads potentiometer for absolute position. Use Value: Single-chip solution eliminates discrete high-side switches and external LIN transceivers - improving reliability and reducing EMI from external signal routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller-with-integrated-drivers applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12VR64MF0MLC | Same die, but with 64 KB Flash programmed with mask ROM boot code instead of user-programmable Flash | Not suitable for field firmware updates; used in cost-sensitive, fixed-function modules | Select only if boot code is fixed and Flash reprogramming is unnecessary |
| SPC560B50L5 | 32-bit Power Architecture core, 512 KB Flash, no integrated LINPHY or HSDRV/LSDRV; requires external transceiver and driver ICs | Targets higher-performance body domain controllers with CAN/LIN gateway functionality | Choose when scalability beyond 64 KB Flash or CAN integration is required |
Compared with MC9S12VR64MF0MLC and SPC560B50L5, the S9S12VR64AF0MLC uniquely combines user-programmable Flash, integrated LINPHY, and four-channel HSDRV/LSDRV in a single 48-pin package - delivering lowest BOM cost and smallest footprint for entry-level automotive LIN nodes.
Availability
S9S12VR64AF0MLC is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based sensor nodes, and embedded power switching applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S12VR64AF0MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in MCU, RF, and analog technologies.
The S9S12VR64AF0MLC belongs to the MC9S12VR family - designed specifically for cost-sensitive, function-integrated automotive body control units where LIN communication, embedded power switching, and robust analog sensing are required in a single chip.
FAQ
What is the maximum bus clock frequency supported by the S9S12VR64AF0MLC?
The S9S12VR64AF0MLC supports a maximum bus clock frequency of 25 MHz. This is achieved using the internal Phase-Locked Loop (IPLL) with external crystal or internal RC oscillator as source. The 25 MHz bus clock directly governs instruction execution speed, timer resolution, and peripheral timing - making it suitable for real-time control tasks in automotive body electronics. All timing specifications in the reference manual assume this maximum operating condition.
Does the S9S12VR64AF0MLC include a hardware LIN physical layer?
Yes, the S9S12VR64AF0MLC integrates a fully compliant LIN physical layer (LINPHY) module that meets ISO 17987-4:2016 requirements. It supports standard LIN data rates (10–20 kbps), bus wake-up via dominant timeout, and fault detection including short-to-battery and short-to-ground. No external LIN transceiver is required, reducing system cost and board space - a key differentiator of the S9S12VR64AF0MLC within the MC9S12VR family.
How many high-side and low-side drivers does the S9S12VR64AF0MLC provide?
The S9S12VR64AF0MLC provides four integrated high-side drivers (HSDRV[3:0]) and four integrated low-side drivers (LSDRV[3:0]). Each driver includes overcurrent protection, thermal shutdown, and diagnostic feedback capability. These drivers are electrically isolated from the core logic and rated for 12 V automotive battery operation, enabling direct control of lamps, solenoids, and small DC motors without external driver ICs - a defining feature of the S9S12VR64AF0MLC's system-on-chip architecture.
What debug interface does the S9S12VR64AF0MLC support?
The S9S12VR64AF0MLC supports the Background Debug Mode (BDM) interface via the BKGD pin. This single-wire, synchronous serial interface enables non-intrusive flash programming, real-time register and memory access, and hardware breakpoint debugging without halting CPU execution. BDM is fully compatible with standard Freescale/NXP BDM tools and is essential for development and field firmware updates of the S9S12VR64AF0MLC in automotive production environments.
Is the S9S12VR64AF0MLC qualified for automotive temperature ranges?
Yes, the S9S12VR64AF0MLC is qualified for the extended automotive temperature range of -40°C to +125°C. This qualification covers all integrated functions - including Flash memory retention, ADC linearity, HSDRV/LSDRV driver performance, and LINPHY electrical characteristics - ensuring reliable operation in under-hood and cabin-mounted automotive modules. The device meets AEC-Q100 Grade 1 stress test requirements, confirming its suitability for production automotive applications.
S9S12VR64AF0MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S12 MagniV
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- 12V1
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.13V ~ 5.5V
- Data Converters:
- A/D 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12VR64AF0MLC FAQ
1.How can I place an order for S9S12VR64AF0MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12VR64AF0MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12VR64AF0MLC reliable?
The price and inventory of S9S12VR64AF0MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12VR64AF0MLC is usually 5 days.
3.What payment methods are accepted for S9S12VR64AF0MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12VR64AF0MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12VR64AF0MLC?
S9S12VR64AF0MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12VR64AF0MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12VR64AF0MLC?
For technical support, including S9S12VR64AF0MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12VR64AF0MLC requirements.
6.How does Aetrix verify that S9S12VR64AF0MLC is sourced from the original manufacturer or authorized distributors?
All S9S12VR64AF0MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12VR64AF0MLC meets industry standards.
7.What is the process for return or replacement of S9S12VR64AF0MLC?
All S9S12VR64AF0MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S12VR64AF0MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12VR64AF0MLC part is unused and in its original packaging.
Return procedure for S9S12VR64AF0MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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