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NXP Semiconductors S9S12VR64AF0MLF

Part No.:
S9S12VR64AF0MLF
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS9S12VR64AF0MLF.pdf
Description:
IC MCU 16BIT 64KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,690

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Product details

Overview

S9S12VR64AF0MLF from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller optimized for automotive body electronics and industrial control. It integrates 64 KB on-chip Flash with ECC, 4 KB SRAM, LIN physical layer transceiver, 8-channel PWM, 10-bit ADC with 8 inputs, high- and low-side drivers, and an internal voltage regulator - enabling single-chip control of lighting, motor actuation, and sensor interfacing in 12 V vehicle systems.

For engineers reviewing the S9S12VR64AF0MLF datasheet, S9S12VR64AF0MLF pinout, S9S12VR64AF0MLF application, or S9S12VR64AF0MLF equivalent, key selection criteria include its LINPHY compliance, integrated HSDRV/LSDRV driver outputs, 5 V tolerant I/O, 16 MHz bus clock capability, and qualification to AEC-Q100 Grade 2 (−40 °C to +105 °C).

Technical Context

The S9S12VR64AF0MLF implements the HCS12 CPU12 core with 16-bit data path and von Neumann architecture, executing instructions at up to 25 MIPS. Its CPMU unit supports multiple clock modes including PLL-enabled high-speed operation (up to 25 MHz core clock), stop mode with wake-up via LIN or external interrupt, and low-power wait modes with selective peripheral gating.

System integrity is enforced via COP watchdog timer, flash CRC checking, and memory protection logic. The integrated LINPHY v2.0 module complies with ISO 17987-4 and supports auto-baud detection, sleep/wake framing, and direct connection to 12 V bus without external level-shifting components.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS12 16-bit CPU with 25 MIPS peak performance at 25 MHz core clock
Flash Memory64 KB on-chip Flash with ECC and 512-byte sector erase - enables robust firmware updates and runtime error correction
SRAM4 KB on-chip SRAM with retention during stop mode - supports real-time context preservation
LIN InterfaceIntegrated LINPHY v2.0 compliant with ISO 17987-4 - eliminates need for external transceiver in LIN slave nodes
Driver Outputs4 high-side and 4 low-side drivers with current limiting and thermal shutdown - directly drives bulbs, solenoids, and relays up to 600 mA per channel
ADC10-bit successive approximation ADC with 8 input channels and internal reference - measures battery voltage, temperature, and analog sensors without external reference
Operating TempAEC-Q100 Grade 2: −40 °C to +105 °C ambient - qualified for under-hood and cabin-mounted automotive modules
Supply Voltage5.5 V to 27 V wide-input VSUP range - accepts direct connection to automotive battery with load-dump tolerance

Pinout & Package

Package: 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VSUPMain power supply inputAccepts 5.5–27 V automotive battery input; powers internal regulators and drivers
VDD, VSSDigital core supply/groundInternal 5 V regulator output (VDD) and ground return for MCU logic
VLINLIN bus interfaceDirect connection to LIN bus line; includes integrated pull-up, slew-rate control, and fault protection
HSD0–HSD3High-side driver outputsFour open-drain, current-limited outputs (600 mA max) for driving loads to VSUP
LSD0–LSD3Low-side driver outputsFour N-channel MOSFET outputs (600 mA max) for grounding loads
AD0–AD7Analog input channelsEight 10-bit ADC inputs with programmable gain and internal reference selection
PT0–PT7General-purpose I/O port8-bit bidirectional port with configurable pull-up/down, interrupt-on-change, and 5 V tolerance

Key Features

FeatureDesign Value
Integrated LINPHY v2.0Eliminates external transceiver; supports auto-synchronization, sleep/wake frames, and bus fault recovery per ISO 17987-4
On-chip voltage regulatorGenerates stable 5 V core supply from 5.5–27 V input - removes need for external DC/DC converter in cost-sensitive nodes
HSDRV + LSDRV comboEight fully protected driver channels enable direct control of lamps, valves, and motors without discrete FETs or protection ICs
Flash ECC and securitySingle-bit error correction and double-bit error detection protect firmware integrity; BDM security prevents unauthorized code readout
Wide-temp AEC-Q100 Grade 2Validated for continuous operation from −40 °C to +105 °C - suitable for engine bay, headlight, and HVAC control units

Applications

Automotive Lighting ControlBody Control Module (BCM) Node

Use Scenario: Controlling LED headlamps, turn signals, and interior lighting in modern vehicles with LIN communication.

IC Role / Device Role / Timing Role: Central LIN slave node managing PWM dimming, thermal monitoring, and fault reporting.

Use Value: Integrated HSDRV/LSDRV drives LEDs directly; LINPHY enables plug-and-play integration into existing LIN networks without protocol translation.

Use Scenario: Localized control of door locks, window lifts, and mirror adjustment in distributed BCM architectures.

IC Role / Device Role / Timing Role: Standalone LIN endpoint executing local actuation logic and status feedback.

Use Value: 64 KB Flash stores complex state machines; 4 KB SRAM retains configuration across sleep cycles; wide VSUP range tolerates battery fluctuations during cranking.

Engine Bay Sensor InterfaceIndustrial Motor Actuation

Use Scenario: Monitoring coolant temperature, battery voltage, and intake air pressure in under-hood ECUs.

IC Role / Device Role / Timing Role: Analog front-end and signal conditioner with LIN-based telemetry reporting.

Use Value: 10-bit ADC with internal reference and 8-channel multiplexing replaces external signal conditioning; AEC-Q100 Grade 2 ensures reliability at 105 °C ambient.

Use Scenario: Driving 12 V solenoid valves and small DC motors in factory automation panels.

IC Role / Device Role / Timing Role: Compact motor driver controller with overcurrent and thermal protection.

Use Value: Integrated HSDRV/LSDRV deliver 600 mA per channel with automatic shutdown on fault - reduces BOM count and PCB area vs. discrete driver solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller-with-integrated-drivers applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12VR64MF0MLFSame die, but with 128 KB Flash and identical peripherals - larger code space for complex diagnostics or OTA updatesPreferred where future firmware expansion or dual-bank Flash update is requiredSelect when >64 KB application code size is anticipated or safe firmware rollback is mandated
SPC560B50L532-bit Power Architecture core, 512 KB Flash, CAN+LIN, no integrated drivers - requires external half-bridge driversBetter suited for higher-performance gateway or central ECU roles requiring CAN backbone connectivityChoose when CAN interface, higher processing throughput, or ASIL-B functional safety compliance is needed

Compared with MC9S12VR64MF0MLF and SPC560B50L5, the S9S12VR64AF0MLF delivers optimal cost/performance balance for dedicated LIN slave nodes with integrated actuation - offering driver consolidation, AEC-Q100 qualification, and minimal external component count without sacrificing diagnostic capability or thermal robustness.

Availability

S9S12VR64AF0MLF is available at Aetrix Electronics and suitable for automotive lighting control, body electronics modules, and industrial motor actuation requiring stable component supply across extended product lifecycles.

Supply support for S9S12VR64AF0MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The S9S12VR family was designed specifically for cost-sensitive, functionally safe automotive body electronics - integrating LIN, drivers, and power regulation to replace multi-chip solutions in lamp control units, seat modules, and HVAC actuators.

FAQ

What is the maximum bus clock frequency supported by the S9S12VR64AF0MLF?

The S9S12VR64AF0MLF supports a maximum bus clock frequency of 25 MHz, achieved using the internal PLL with external crystal or ceramic resonator. This allows the HCS12 CPU to execute at up to 25 MIPS. The PLL lock time and startup sequence are fully documented in Chapter 4 of the MC9S12VR Family Reference Manual, Rev. 3.11. The S9S12VR64AF0MLF maintains timing compliance across its full operating temperature and voltage range.

Does the S9S12VR64AF0MLF include hardware support for LIN communication?

Yes, the S9S12VR64AF0MLF integrates a full LINPHY v2.0 physical layer compliant with ISO 17987-4. It supports automatic baud rate detection, LIN sleep/wake frame handling, dominant timeout detection, and bus fault recovery - eliminating the need for an external LIN transceiver. The S9S12VR64AF0MLF's VLIN pin connects directly to the LIN bus, and its firmware stack can be implemented using standard LIN protocol APIs.

What driver capabilities does the S9S12VR64AF0MLF provide?

The S9S12VR64AF0MLF includes four high-side drivers (HSD0–HSD3) and four low-side drivers (LSD0–LSD3), each rated for 600 mA continuous output with overcurrent, overtemperature, and open-load protection. These drivers operate directly from the VSUP rail (5.5–27 V) and are controlled via dedicated I/O registers. No external gate drivers or protection circuitry is required for typical 12 V automotive loads such as incandescent lamps or solenoids.

Is the S9S12VR64AF0MLF qualified for automotive use?

Yes, the S9S12VR64AF0MLF is qualified to AEC-Q100 Grade 2 (−40 °C to +105 °C), making it suitable for under-hood and cabin-mounted automotive applications. It meets stringent requirements for thermal cycling, humidity resistance, mechanical shock, and electromagnetic compatibility. The device also includes built-in system integrity features such as flash ECC, COP watchdog, and memory protection - supporting functional safety goals in ASIL-A/B systems.

What development tools are supported for the S9S12VR64AF0MLF?

The S9S12VR64AF0MLF is supported by NXP's CodeWarrior Development Studio for HCS12, including full BDM debug capability via the BKGD pin. Evaluation is enabled through the DEMO9S12VR64 demonstration board, which provides access to all I/O, LIN bus interface, and driver outputs. Production programming uses standard BDM interfaces compatible with third-party programmers like PE Micro Cyclone Pro and SEGGER J-Link with HCS12 add-ons.

S9S12VR64AF0MLF Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
S12 MagniV
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12VR64AF0MLF FAQ

1.How can I place an order for S9S12VR64AF0MLF through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12VR64AF0MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12VR64AF0MLF reliable?

The price and inventory of S9S12VR64AF0MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12VR64AF0MLF is usually 5 days.

3.What payment methods are accepted for S9S12VR64AF0MLF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12VR64AF0MLF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S12VR64AF0MLF?

S9S12VR64AF0MLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12VR64AF0MLF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12VR64AF0MLF?

For technical support, including S9S12VR64AF0MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12VR64AF0MLF requirements.

6.How does Aetrix verify that S9S12VR64AF0MLF is sourced from the original manufacturer or authorized distributors?

All S9S12VR64AF0MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12VR64AF0MLF meets industry standards.

7.What is the process for return or replacement of S9S12VR64AF0MLF?

All S9S12VR64AF0MLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S12VR64AF0MLF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12VR64AF0MLF part is unused and in its original packaging.

Return procedure for S9S12VR64AF0MLF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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