My Inquiry
My Account
NXP Semiconductors S9S12VR64AF0MLFR
- Part No.:
- S9S12VR64AF0MLFR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S12VR64AF0MLFR.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,908
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S12VR64AF0MLFR from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller with 64 KB on-chip Flash, 4 KB RAM, and integrated LIN physical layer transceiver, high- and low-side drivers, and voltage regulator - designed for automotive body electronics and smart power distribution modules.
For engineers reviewing the S9S12VR64AF0MLFR datasheet, S9S12VR64AF0MLFR pinout, S9S12VR64AF0MLFR application, or S9S12VR64AF0MLFR equivalent, key selection criteria include LINPHY compliance (SAE J2602), 5V operation with internal VREG, HSDRV/LSDRV drive capability (up to 600 mA sink/source), and 48-pin LQFP package with dedicated BATS supply sensing.
Technical Context
The S9S12VR64AF0MLFR implements the HCS12 CPU12 core with 16-bit data path, 24-bit addressing, and instruction set backward-compatible with HC12. It integrates a PLL-based clock system supporting bus frequencies up to 25 MHz, with multiple clock sources including external crystal (1–8 MHz), internal RC oscillator (1 MHz), and LINPHY-derived clock.
Its system architecture includes dedicated hardware modules: ADC12B6CV2 (12-bit, 6-channel), TIM16B4CV3 (16-bit timer with 4 channels), S12PWM8B8CV2 (8-bit PWM with 8 channels), and S12LINPHYV2 compliant with ISO 17987-4 and SAE J2602 Class A/B. All peripherals are memory-mapped and accessible via standard S12 register space.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with 24-bit address bus and 1 MB linear memory map |
| Flash Memory | 64 KB on-chip Flash with ECC protection and 512-byte sector erase granularity |
| RAM | 4 KB on-chip SRAM with retention in stop mode |
| LIN Transceiver | Integrated S12LINPHYV2 compliant with SAE J2602 Class A/B and ISO 17987-4 |
| High-Side Drivers | 4-channel HSDRV with 600 mA continuous output, overcurrent/thermal shutdown |
| Supply Voltage Range | 5.5 V to 27 V input; internal VREG provides regulated 5 V (VDD) and 3.3 V (VDDF) outputs |
| Operating Temperature | −40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1 |
Pinout & Package
Package: 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VSSA | Analog reference supply/ground | Isolated analog domain for ADC and LINPHY; requires separate filtering from digital VDD/VSS |
| PT0–PT7 | Port T general-purpose I/O | 8-bit bidirectional port with interrupt capability, pull-up/polarity control, and wired-or support |
| PL0–PL7 | Port L analog/digital I/O | Configurable as ADC inputs (AN0–AN5), digital I/O, or LINPHY bus pins (LINRX/LINTX) |
| HSD0–HSD3 | High-side driver outputs | Four independent high-side switches with current sense feedback and fault reporting |
| LSD0–LSD3 | Low-side driver outputs | Four open-drain low-side drivers with programmable slew rate and overtemperature protection |
| BATS | Battery supply sense input | Monitors main battery voltage (0–36 V range) with 12-bit ADC conversion and configurable thresholds |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LINPHY | Eliminates external transceiver; supports wake-up, sleep, and auto-baud detection per SAE J2602 |
| On-chip voltage regulation | VREG delivers stable 5 V (core logic) and 3.3 V (Flash/NVM) from wide 5.5–27 V input - no external regulators required |
| HSDRV/LSDRV co-location | Eight smart power drivers (4 HSD + 4 LSD) enable full load control and diagnostics in single-package body controller |
| Battery supply monitoring | Dedicated BATS input with programmable thresholds enables robust low-voltage reset and battery health logging |
| System integrity support | Includes COP watchdog, clock monitor, RAM/Flash CRC, and secure debug interface with BDM security lock |
Applications
| Automotive Door Module | Smart Junction Box |
|---|---|
Use Scenario: Centralized control of window lift, mirror fold, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU executing LIN slave node firmware, managing HSDRV/LSDRV outputs, and sampling door switch states via Port T/Port L. Use Value: Reduces BOM count by integrating LINPHY, drivers, and VREG - eliminates 3–5 discrete ICs and associated passives. |
Use Scenario: Power distribution and load management unit in vehicle under-hood or cabin junction boxes. IC Role / Device Role / Timing Role: System-level power supervisor with real-time battery voltage monitoring (BATS), thermal-aware load switching (HSDRV/LSDRV), and LIN-based diagnostic reporting. Use Value: Enables predictive fuseless protection and load shedding based on measured current (via HSDRV sense) and supply voltage (BATS). |
| Seat Control Unit | Roof Module Controller |
Use Scenario: Motorized seat position adjustment with memory recall, heating, and lumbar support. IC Role / Device Role / Timing Role: LIN master node coordinating with seat motor drivers and sensor inputs; uses ADC for potentiometer feedback and BATS for supply health. Use Value: Single-chip solution supports dual-motor control (via PWM + HSDRV) while meeting ASIL-B functional safety requirements through built-in diagnostics. |
Use Scenario: Integrated control of sunroof, panoramic roof, and overhead lighting with rain/light sensors. IC Role / Device Role / Timing Role: Real-time motion control using TIM/PWM modules, LIN communication for body network integration, and ADC for analog sensor inputs. Use Value: Eliminates need for external LIN transceiver and power switch ICs - reduces PCB area by >35% versus multi-chip alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12VR64MF0MLFR | Same die, but with 8 MHz max external crystal frequency (vs. 16 MHz for S9S12VR64AF0MLFR); identical pinout and peripheral set | Targeted at cost-sensitive designs where lower clock speed suffices; not suitable for 25 MHz bus timing-critical LIN+PWM systems | Select only if system clock budget allows reduced PLL multiplication ratio and lower maximum bus frequency |
| SPC560B50L5 | 32-bit Power Architecture core, 512 KB Flash, CAN FD, no integrated LINPHY or HSDRV/LSDRV | Requires external LIN transceiver and power drivers; suited for higher-performance gateway or ECU roles, not direct replacement | Choose when migrating to scalable platform with CAN FD and higher compute needs - not drop-in compatible |
Compared with MC9S12VR64MF0MLFR, the S9S12VR64AF0MLFR supports higher bus speeds and wider crystal range; compared with SPC560B50L5, it offers tighter integration for LIN-centric body nodes but lacks CAN and advanced safety features.
Availability
S9S12VR64AF0MLFR is available at Aetrix Electronics and suitable for automotive body electronics, smart junction boxes, and seat control modules requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.
Supply support for S9S12VR64AF0MLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep heritage in microcontrollers and analog power systems.
The S9S12VR family was developed specifically for automotive body electronics requiring integrated LIN, smart power drivers, and wide-input voltage regulation - targeting cost-optimized, functionally safe distributed control units.
FAQ
What is the maximum bus frequency supported by the S9S12VR64AF0MLFR?
The S9S12VR64AF0MLFR supports a maximum bus frequency of 25 MHz, achieved via its internal PLL with programmable multiplication factor (N = 1–32) and division ratio (R = 1–4). This is enabled by the 16 MHz max external crystal (XTAL) specified in the device's electrical characteristics and validated in the CPMU module description.
Does the S9S12VR64AF0MLFR include an integrated LIN transceiver?
Yes, the S9S12VR64AF0MLFR integrates the S12LINPHYV2 module, which is fully compliant with SAE J2602 Class A/B and ISO 17987-4. It supports LIN slave functionality, automatic baud rate detection, sleep/wake-up via bus activity, and fault reporting - eliminating the need for an external LIN transceiver IC.
How many high-side and low-side drivers does the S9S12VR64AF0MLFR provide?
The S9S12VR64AF0MLFR provides four high-side drivers (HSD0–HSD3) and four low-side drivers (LSD0–LSD3), each with independent enable/control registers, current-sense feedback, thermal shutdown, and fault flag reporting - all implemented in silicon without external components.
What is the role of the BATS pin on the S9S12VR64AF0MLFR?
The BATS pin on the S9S12VR64AF0MLFR is a dedicated analog input for battery supply voltage monitoring across a 0–36 V range. It connects directly to the internal ADC12B6CV2 module and enables programmable low-voltage reset, battery health logging, and load-shedding decisions without external resistive dividers.
Is the S9S12VR64AF0MLFR qualified for automotive use?
Yes, the S9S12VR64AF0MLFR is AEC-Q100 Grade 1 qualified (−40 °C to +125 °C), with built-in system integrity features including COP watchdog, clock monitor, Flash ECC, RAM parity, and secure BDM debug interface - meeting functional safety requirements for automotive body electronics.
S9S12VR64AF0MLFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S12 MagniV
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- IrDA, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 6V ~ 18V
- Data Converters:
- A/D 6x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S12VR64AF0MLFR FAQ
1.How can I place an order for S9S12VR64AF0MLFR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S12VR64AF0MLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S12VR64AF0MLFR reliable?
The price and inventory of S9S12VR64AF0MLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12VR64AF0MLFR is usually 5 days.
3.What payment methods are accepted for S9S12VR64AF0MLFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12VR64AF0MLFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S12VR64AF0MLFR?
S9S12VR64AF0MLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S12VR64AF0MLFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S12VR64AF0MLFR?
For technical support, including S9S12VR64AF0MLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12VR64AF0MLFR requirements.
6.How does Aetrix verify that S9S12VR64AF0MLFR is sourced from the original manufacturer or authorized distributors?
All S9S12VR64AF0MLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12VR64AF0MLFR meets industry standards.
7.What is the process for return or replacement of S9S12VR64AF0MLFR?
All S9S12VR64AF0MLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12VR64AF0MLFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S12VR64AF0MLFR part is unused and in its original packaging.
Return procedure for S9S12VR64AF0MLFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S12VR64AF0MLFR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
