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NXP Semiconductors S9S12VRP64F0MLF

Part No.:
S9S12VRP64F0MLF
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS9S12VRP64F0MLF.pdf
Description:
IC MCU 16BIT 64KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,178

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Product details

Overview

S9S12VRP64F0MLF from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller with integrated LIN physical layer transceiver, 64 KB on-chip Flash, 4 KB SRAM, and high-side/low-side driver support - designed for automotive body electronics and smart sensor nodes requiring robust local control and LIN bus communication. It operates at up to 25 MHz core frequency, supports 5 V operation, and integrates voltage regulation, ADC, PWM, and BDM debug interface.

For engineers reviewing the S9S12VRP64F0MLF datasheet, S9S12VRP64F0MLF pinout, S9S12VRP64F0MLF application, or S9S12VRP64F0MLF equivalent, key selection criteria include LINPHY compliance (SAE J2602), 64 KB ECC-protected Flash endurance, 10-bit ADC with 8 channels, HSDRV/LSDRV drive capability (up to 500 mA per channel), and 48-pin LQFP package compatibility with automotive thermal and EMI requirements.

Technical Context

The S9S12VRP64F0MLF implements the HCS12 CPU12 core with 16-bit data path and von Neumann architecture, executing instructions from internal Flash or external memory via expanded address space. Its clock system combines an internal RC oscillator (1–8 MHz), external crystal input (1–8 MHz), and PLL-based frequency multiplication to generate stable bus clocks up to 25 MHz.

System-level integration includes dedicated LINPHY module compliant with ISO 17987-4 and SAE J2602, supporting wake-up via dominant timeout and automatic baud rate detection. The on-chip voltage regulator supplies VDD (core) and VDDF (Flash) from a single 5 V rail, while BATS monitors supply voltage with ±1% accuracy over temperature.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture HCS12 16-bit CPU with 16 MB linear address space and 25 MHz max bus clock
Memory 64 KB on-chip Flash with ECC protection; 4 KB SRAM; 512 B EEPROM emulation
ADC 10-bit successive approximation ADC with 8 input channels, 12 µs conversion time
LIN Interface Integrated LINPHY v2.2 compliant with SAE J2602, including wake-up detection and auto-baud
Drivers 4-channel high-side drivers (HSDRV) and 4-channel low-side drivers (LSDRV), each rated 500 mA sink/source
Supply & Regulation Single 5 V nominal supply; on-chip VREG delivers 2.5 V (VDD) and 3.3 V (VDDF); BATS monitors VSUP with ±1% accuracy
Package 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade (-40°C to +125°C)

Pinout & Package

48-pin LQFP package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad; pinout defined in MC9S12VR Family Reference Manual Rev. 3.11, Section 1.8.1. Includes dedicated LINRX/LINTX pins, HSDRV/LSDRV output terminals, ADC inputs (AN0–AN7), and dual power domains (VDDA/VSSA for analog, VDDX/VSSX for I/O).

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Core logic power/ground Supplies 2.5 V core logic; requires local 100 nF decoupling
VDDF, VSS Flash memory power/ground Supplies 3.3 V for Flash programming and read operations
VDDA, VSSA Analog reference supply/ground Isolated analog domain for ADC and BATS; must be filtered separately
LINRX, LINTX LIN bus receive/transmit Dedicated differential-capable pins for LINPHY; no external transceiver needed
HSD0–HSD3 High-side driver outputs Open-drain NMOS outputs with current limiting and thermal shutdown
LSD0–LSD3 Low-side driver outputs Ground-switching NMOS outputs with diagnostics and short-circuit protection

Key Features

Feature Design Value
Integrated LINPHY Eliminates external LIN transceiver; reduces BOM cost and PCB area by ~30% in body control modules
ECC-protected Flash Enables ASIL-B compliance per ISO 26262; detects and corrects single-bit errors during runtime
HSDRV/LSDRV diagnostics Real-time open-load, short-to-battery, short-to-ground, and overtemperature reporting via status registers
Background Debug (BDM) Single-wire debug interface enables flash programming and real-time debugging without halting CPU operation
Supply voltage sensing (BATS) Monitors VSUP with 10-bit resolution and ±1% accuracy across -40°C to +125°C for fail-safe system monitoring

Applications

Automotive Door Module Smart Seat Control Unit

Use Scenario: Centralized control of window lift, mirror adjustment, and door lock actuators in OEM door modules.

IC Role / Device Role / Timing Role: Primary MCU managing LIN slave communication with mirror/window ECUs and driving HSDRV/LSDRV loads directly.

Use Value: Reduces component count by integrating LINPHY and drivers; eliminates need for discrete transceivers and external driver ICs.

Use Scenario: Local seat position memory, heater control, and lumbar adjustment in premium vehicle seating systems.

IC Role / Device Role / Timing Role: Standalone LIN node with ADC monitoring seat sensor feedback and PWM-controlled heater elements.

Use Value: Enables precise 10-bit position sensing and closed-loop thermal control using on-chip ADC and PWM modules.

Body Control Gateway LED Lighting Driver Node

Use Scenario: Low-speed gateway aggregating signals from LIN sensors (rain sensor, ambient light) and forwarding via CAN to main BCM.

IC Role / Device Role / Timing Role: LIN master coordinating multiple slaves while providing diagnostic reporting via SCI/CAN bridge.

Use Value: On-chip LINPHY and SCI enable seamless protocol translation without external level-shifting or timing compensation.

Use Scenario: Adaptive LED headlight dimming and sequential turn signal control in exterior lighting clusters.

IC Role / Device Role / Timing Role: PWM generator with synchronized channel outputs driving LED strings via external MOSFETs.

Use Value: 8-channel PWM with dead-time insertion and fault shutdown ensures safe, flicker-free LED modulation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12VR64MFAE Same core and peripheral set but uses 32-pin LQFP package; lacks 4 LSDRV channels and 2 HSDRV channels Suitable for space-constrained nodes with fewer driver requirements (e.g., simple sensor interfaces) Select when board layout limits I/O count and driver demand is ≤2 HSDRV + 2 LSDRV
S912ZVL64F0MLF Z-series derivative with S12Z core, enhanced PLL, and improved ADC linearity (±1 LSB INL); same 48-pin LQFP footprint Higher precision sensing and faster interrupt response required in next-gen body control units Choose for new designs needing extended temperature stability and tighter ADC specs without PCB redesign

Compared with S9S12VRP64F0MLF, MC9S12VR64MFAE reduces driver count and package size for simpler nodes, while S912ZVL64F0MLF upgrades core performance and analog accuracy within identical mechanical constraints - enabling migration paths without layout changes.

Availability

S9S12VRP64F0MLF is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based sensor networks, and smart actuator control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S9S12VRP64F0MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating to Motorola's HCS12 lineage.

The S9S12VRP64F0MLF belongs to the MC9S12VR family - engineered specifically for cost-sensitive, function-integrated automotive body control applications where LIN communication, local actuation, and robust diagnostics are essential.

FAQ

What is the maximum operating frequency of the S9S12VRP64F0MLF?

The S9S12VRP64F0MLF achieves a maximum bus clock frequency of 25 MHz using its internal PLL, derived from either the external crystal (1–8 MHz) or internal RC oscillator (1–8 MHz). This frequency governs instruction execution speed, peripheral timing, and ADC sampling rate - all verified across the full -40°C to +125°C automotive temperature range. The S9S12VRP64F0MLF maintains timing compliance under worst-case voltage and temperature conditions per Freescale Semiconductor's MC9S12VR Family Reference Manual Rev. 3.11.

Does the S9S12VRP64F0MLF require an external LIN transceiver?

No, the S9S12VRP64F0MLF integrates a fully compliant LINPHY v2.2 module that meets SAE J2602 and ISO 17987-4 specifications - including dominant timeout wake-up, auto-baud detection, and bus short-circuit protection. No external transceiver is needed, reducing bill-of-materials cost and PCB footprint. The S9S12VRP64F0MLF LINRX and LINTX pins connect directly to the LIN bus via standard 1 kΩ pull-up and transient protection components.

How does the S9S12VRP64F0MLF handle Flash memory reliability?

The S9S12VRP64F0MLF implements hardware-based ECC (Error Correction Code) across its 64 KB Flash array, detecting and correcting all single-bit errors and detecting multi-bit errors during read operations. This feature supports functional safety requirements up to ASIL-B per ISO 26262. Flash endurance is rated for 100,000 write/erase cycles, and data retention exceeds 20 years at 125°C - validated in Freescale's MC9S12VR Family Reference Manual Rev. 3.11, Appendix M.

What diagnostic capabilities do the HSDRV and LSDRV modules provide in the S9S12VRP64F0MLF?

The S9S12VRP64F0MLF's four HSDRV and four LSDRV channels each report real-time fault conditions via dedicated status registers: open-load, short-to-battery (HSDRV), short-to-ground (LSDRV), overtemperature, and overcurrent. These diagnostics are latched and readable via background debug or normal CPU access without interrupt overhead. The S9S12VRP64F0MLF also supports configurable current-limit thresholds and automatic shutdown on critical faults - detailed in Chapter 13 (HSDRV) and Chapter 14 (LSDRV) of the reference manual.

Is the S9S12VRP64F0MLF pin-compatible with other MC9S12VR family members?

The S9S12VRP64F0MLF uses a 48-pin LQFP package with pinout defined in Section 1.8.1 of the MC9S12VR Family Reference Manual Rev. 3.11. It shares identical mechanical and electrical pin assignments with S9S12VRP64F1MLF and S9S12VRP32F0MLF in the same package variant, but differs from 32-pin variants (e.g., MC9S12VR64MFAE) in I/O count and driver channel availability. Pin compatibility is confirmed only within the 48-pin LQFP subgroup - not across package types.

S9S12VRP64F0MLF Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
S12 MagniV
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12VRP64F0MLF FAQ

1.How can I place an order for S9S12VRP64F0MLF through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12VRP64F0MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12VRP64F0MLF reliable?

The price and inventory of S9S12VRP64F0MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12VRP64F0MLF is usually 5 days.

3.What payment methods are accepted for S9S12VRP64F0MLF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12VRP64F0MLF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S12VRP64F0MLF?

S9S12VRP64F0MLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12VRP64F0MLF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12VRP64F0MLF?

For technical support, including S9S12VRP64F0MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12VRP64F0MLF requirements.

6.How does Aetrix verify that S9S12VRP64F0MLF is sourced from the original manufacturer or authorized distributors?

All S9S12VRP64F0MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12VRP64F0MLF meets industry standards.

7.What is the process for return or replacement of S9S12VRP64F0MLF?

All S9S12VRP64F0MLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S12VRP64F0MLF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12VRP64F0MLF part is unused and in its original packaging.

Return procedure for S9S12VRP64F0MLF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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