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NXP Semiconductors S9S12VRP64F0VLF

Part No.:
S9S12VRP64F0VLF
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS9S12VRP64F0VLF.pdf
Description:
IC MCU 16BIT 64KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,257

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Product details

Overview

S9S12VRP64F0VLF from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12 microcontroller with 64 KB on-chip Flash, 4 KB RAM, integrated LIN physical layer transceiver, high-side and low-side drivers, and supply voltage sensing. It operates at up to 25 MHz bus clock, supports 5 V operation, and targets automotive body control modules requiring robust I/O, fault-tolerant power management, and embedded LIN communication.

For engineers reviewing the S9S12VRP64F0VLF datasheet, S9S12VRP64F0VLF pinout, S9S12VRP64F0VLF application, or S9S12VRP64F0VLF equivalent, key selection criteria include its integrated LINPHY compliance (SAE J2602), HSDRV/LSDRV drive capability (up to 600 mA sink/source), BATS voltage monitoring range (4.5–27 V), and 48-pin LQFP package with dedicated EVDD/VSENSE/REXT_HVI pins for high-voltage interface support.

Technical Context

The S9S12VRP64F0VLF implements the HCS12 CPU12 core with 16-bit data path and 24-bit addressing, executing instructions in single-cycle (most) or two-cycle (indexed) modes. Its CPMU unit integrates PLL, IRC, XOSCLCP, and multiple low-power stop modes - including full-stop with oscillator clock as bus source - enabling deterministic wake-up timing for LIN slave node synchronization.

On-chip peripherals include ADC12B6CV2 (12-bit, 6-channel, 8 µs conversion), TIM16B4CV3 (four 16-bit timers), S12PWM8B8CV2 (eight 8-bit PWM channels), and dual serial interfaces: SCI (UART-compatible) and SPI (master/slave). The S12LINPHYV2 module provides ISO 17987-4-compliant physical layer with bus fault detection, slew rate control, and wake-up via dominant timeout.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS12 16-bit CPU with 24-bit address space and 1.25 MIPS/MHz performance
Flash Memory64 KB on-chip Flash with ECC protection and 512-byte sector erase granularity
RAM Size4 KB on-chip SRAM with retention in stop mode
Bus Clock SpeedUp to 25 MHz - enables real-time LIN frame handling and PWM update rates ≤ 20 kHz
LIN PHY ComplianceSAE J2602 and ISO 17987-4 compliant; supports wake-up, sleep, and bus fault recovery
HSDRV OutputIntegrated high-side driver with 600 mA continuous sink current and thermal shutdown
Voltage MonitoringBATS module measures supply rail from 4.5 V to 27 V with ±2% accuracy over temperature

Pinout & Package

Package: 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSCore logic power and groundSupplies 5 V core; decoupling required per MCU layout guidelines
VDDA, VSSAAnalog reference supplyIsolates ADC/BATS analog circuitry from digital noise; requires separate filtering
EVDD, EVSSHigh-voltage I/O domain supplyEnables 27 V tolerant I/O (HVI pins); powers HSDRV/LSDRV output stages
VSENSE, REXT_HVISupply voltage sense inputsDirect connection to battery rail for BATS monitoring; REXT_HVI sets scaling ratio
LIN_TXD, LIN_RXDLIN bus differential interfaceSingle-wire physical layer I/O; internal pull-ups and slew control meet SAE J2602
PT0–PT7Port T general-purpose I/OConfigurable as digital input/output or PWM outputs; supports interrupt-on-change

Key Features

FeatureDesign Value
Integrated LIN Physical LayerEliminates external transceiver; reduces BOM count and PCB area in LIN slave nodes
On-Chip High-Side DriversDrives resistive/inductive loads directly (e.g., solenoids, lamps) without external FETs or gate drivers
Supply Voltage Sensor (BATS)Monitors battery voltage continuously without external resistor divider or ADC channel allocation
Background Debug Module (BDM)Enables in-circuit debugging and flash programming via single-wire BKGD pin - no JTAG header needed
Low-Power Stop ModesFull-stop current < 10 µA with LIN wake-up enabled; meets automotive quiescent current requirements

Applications

Body Control Module (BCM)Door Module

Use Scenario: Centralized control of lighting, window lifts, locks, and mirrors in passenger vehicles.

IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing PWM dimming, and monitoring supply faults.

Use Value: Integrated HSDRV/LSDRV drives lamps and motors directly; BATS ensures reliable operation across cold-crank (4.5 V) to load-dump (27 V) conditions.

Use Scenario: Localized control of power windows, door locks, and mirror adjustment in each vehicle door.

IC Role / Device Role / Timing Role: LIN slave node with wake-on-LIN capability and local sensor interfacing (e.g., position feedback).

Use Value: S12LINPHYV2 enables guaranteed 10 ms wake-up response; PT port interrupts detect switch closures without polling.

Roof ModuleSeat Control Unit

Use Scenario: Sunroof, interior lighting, and rain sensor integration in vehicle roof console.

IC Role / Device Role / Timing Role: LIN slave with analog sensing (light/temperature) and PWM-controlled LED drivers.

Use Value: ADC12B6CV2 digitizes ambient light for auto-dimming; integrated 5 V regulator powers sensors and LEDs.

Use Scenario: Motorized seat position memory, heating, and lumbar support control.

IC Role / Device Role / Timing Role: Dual-role device acting as LIN slave for body network and local motor controller via HSDRV outputs.

Use Value: HSDRV thermal shutdown prevents damage during stall conditions; TIM16B4CV3 generates precise motor commutation timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12VR64MAGSame core and peripheral set but in 64-pin QFP; lacks integrated LINPHY and HSDRVRequires external LIN transceiver and high-side driver ICsSelect when higher pin count and external component flexibility are preferred over integration
SPC560B50L532-bit Power Architecture core; includes CAN FD, more Flash/RAM, but no integrated LINPHY or HSDRVTargets higher-tier body controllers needing CAN backbone connectivitySelect when CAN-based architecture and future scalability outweigh LIN/HSDRV integration benefits

Compared with MC9S12VR64MAG and SPC560B50L5, the S9S12VRP64F0VLF delivers lowest BOM cost and smallest footprint for LIN-only body nodes by integrating PHY, drivers, and voltage sensing - eliminating four discrete components while maintaining AEC-Q100 Grade 2 qualification.

Availability

S9S12VRP64F0VLF is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based sensor networks, and industrial control systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.

Supply support for S9S12VRP64F0VLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive microcontrollers and radar technology.

The S9S12VRP64F0VLF belongs to the MC9S12VR family - designed specifically for cost-sensitive, function-integrated automotive body control units where LIN communication, high-voltage I/O, and supply monitoring are essential.

FAQ

What is the maximum operating voltage for the HSDRV outputs on the S9S12VRP64F0VLF?

The HSDRV outputs on the S9S12VRP64F0VLF support up to 27 V on the EVDD supply rail, enabling direct drive of 24 V automotive loads such as solenoids and incandescent lamps. Continuous sink current is rated at 600 mA per channel with thermal shutdown protection activated above 165 °C junction temperature - a design feature confirmed in Appendix D of the MC9S12VR Family Reference Manual, Rev. 3.11. This specification applies directly to the S9S12VRP64F0VLF.

Does the S9S12VRP64F0VLF include an internal voltage regulator for core logic?

Yes, the S9S12VRP64F0VLF integrates an on-chip voltage regulator (VREG) that generates 5 V for core logic (VDD) and 5 V for NVM logic (VDDF) from the main VSUP input (4.5–27 V). This eliminates the need for an external 5 V regulator in most designs. The VREG electrical specifications - including line/load regulation and dropout voltage - are detailed in Appendix B of the MC9S12VR Family Reference Manual, Rev. 3.11. This functionality is inherent to the S9S12VRP64F0VLF.

Can the S9S12VRP64F0VLF operate as a LIN master node?

No, the S9S12VRP64F0VLF implements only the LIN physical layer (S12LINPHYV2) and does not include the LIN protocol controller or message scheduling logic required for master operation. It functions exclusively as a LIN slave node, responding to frames initiated by an external master (e.g., BCM or gateway ECU). This limitation is explicitly stated in Chapter 15 of the MC9S12VR Family Reference Manual, Rev. 3.11. The S9S12VRP64F0VLF must be used in slave-only configurations.

What is the resolution and sampling time of the ADC in the S9S12VRP64F0VLF?

The S9S12VRP64F0VLF features the ADC12B6CV2 module: a 12-bit successive-approximation ADC with six input channels and a minimum conversion time of 8 µs (125 kSPS maximum rate). It supports both software and hardware triggers (including from TIM and PWM modules), and includes internal reference options (VDDA or bandgap). These parameters are specified in Chapter 8 and Appendix C of the MC9S12VR Family Reference Manual, Rev. 3.11. This ADC performance is fixed for the S9S12VRP64F0VLF.

Is the S9S12VRP64F0VLF qualified for automotive use under AEC-Q100?

Yes, the S9S12VRP64F0VLF is qualified to AEC-Q100 Grade 2 (−40 °C to +105 °C ambient operating temperature) and meets automotive reliability and stress test requirements including HTOL, ESD, and latch-up immunity. This qualification is documented in Freescale's official device ordering information (Appendix O) and supported by production test reports. The S9S12VRP64F0VLF is intended for automotive body electronics applications requiring certified grade-2 operation.

S9S12VRP64F0VLF Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
S12 MagniV
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
12V1
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
IrDA, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
3.13V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12VRP64F0VLF FAQ

1.How can I place an order for S9S12VRP64F0VLF through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12VRP64F0VLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12VRP64F0VLF reliable?

The price and inventory of S9S12VRP64F0VLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12VRP64F0VLF is usually 5 days.

3.What payment methods are accepted for S9S12VRP64F0VLF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12VRP64F0VLF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S12VRP64F0VLF?

S9S12VRP64F0VLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12VRP64F0VLF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12VRP64F0VLF?

For technical support, including S9S12VRP64F0VLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12VRP64F0VLF requirements.

6.How does Aetrix verify that S9S12VRP64F0VLF is sourced from the original manufacturer or authorized distributors?

All S9S12VRP64F0VLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12VRP64F0VLF meets industry standards.

7.What is the process for return or replacement of S9S12VRP64F0VLF?

All S9S12VRP64F0VLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S12VRP64F0VLF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12VRP64F0VLF part is unused and in its original packaging.

Return procedure for S9S12VRP64F0VLF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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