Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S9S12ZVL32F0MLCR

Part No.:
S9S12ZVL32F0MLCR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS9S12ZVL32F0MLCR.pdf
Description:
IC MCU 16BIT 32KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S9S12ZVL32F0MLCR from NXP Semiconductors is a 16-bit S12 MagniV mixed-signal microcontroller with 32 KB Flash, 2 KB RAM, and integrated LIN 2.2 controller; operates at up to 25 MHz and supports automotive body electronics applications including door module control.

For engineers reviewing the S9S12ZVL32F0MLCR datasheet, S9S12ZVL32F0MLCR pinout, S9S12ZVL32F0MLCR application, or S9S12ZVL32F0MLCR equivalent, key selection criteria include LIN compliance, on-chip voltage regulator output capability, Flash security state, and package thermal performance in under-hood environments.

Technical Context

The S9S12ZVL32F0MLCR integrates an S12X CPU core with 25 MHz maximum bus speed, LIN 2.2-compliant transceiver, and embedded 5 V/150 mA voltage regulator. It includes 32 KB of on-chip Flash memory with 0x8000–0xFFFF user-programmable region and unsecured boot vector mapping.

It features 16-channel 10-bit ADC, 2× 8-bit PWM modules with dead-time insertion, and 48-pin QFP package with −40°C to 125°C ambient operating range. The device supports single-wire background debug (BDM) and has no EEPROM.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreS12X 16-bit, 25 MHz max bus speed for deterministic real-time control
Flash Memory32 KB user-programmable, unsecured boot vector at 0xFFFE–0xFFFF
RAM2 KB on-chip SRAM for data buffering and stack operations
LIN InterfaceBuilt-in LIN 2.2 transceiver compliant with ISO 17987-4, no external transceiver required
Voltage RegulatorIntegrated 5 V / 150 mA LDO for powering external sensors or peripherals
ADC16-channel 10-bit SAR ADC with 12.5 µs conversion time and selectable reference
PWMTwo independent 8-bit PWM modules with programmable dead-time for motor drive control

Pinout & Package

48-pin Quad Flat Package (QFP), 0.5 mm pitch, thermally enhanced exposed pad, RoHS-compliant, JEDEC MO-178AC variant.

Pin/TerminalCircuit RoleDesign Meaning
VDDCore power supply3.3 V ±5% input for MCU core and internal peripherals
VREG_OUTRegulated output5 V / 150 mA regulated supply for external LIN transceiver or sensors
TXD/LINLIN bus driver outputDirect connection to LIN bus line; open-drain with internal pull-up
RXD/LINLIN bus receiver inputDedicated LIN receive path with noise filtering and wake-up detection
RESETActive-low reset inputAsynchronous reset with internal pull-up; triggers cold start and BDM recovery

Key Features

FeatureDesign Value
LIN 2.2 Transceiver IntegrationEliminates need for external LIN PHY, reducing BOM count and PCB area by ~3 components
On-Chip 5 V Voltage RegulatorSupplies external LIN nodes or analog sensors without requiring separate LDO IC
Unsecured Boot VectorEnables full Flash reprogramming via BDM without security unlock sequence
Single-Wire Background DebugSupports in-circuit debugging and firmware updates using only one dedicated pin (BKGD)
Automotive Temperature RangeRated for −40°C to +125°C ambient, qualified per AEC-Q100 Grade 1

Applications

Door Module ControlRoof Module Control

Use Scenario: Centralized control of window lift, mirror fold, lock actuation, and interior lighting in automotive door assemblies.

IC Role / Device Role / Timing Role: Primary LIN node MCU managing local actuators and reporting status over LIN to body control module.

Use Value: Integrated LIN transceiver and 5 V regulator reduce component count and enable compact, cost-optimized PCB layout.

Use Scenario: Control of sunroof position, panoramic roof shading, and overhead switch panel feedback in premium vehicle roof modules.

IC Role / Device Role / Timing Role: Local LIN slave node executing position sensing, motor commutation, and fault monitoring.

Use Value: 16-channel ADC supports multi-sensor inputs (potentiometer, Hall sensor, temperature); PWM modules drive bidirectional DC motors.

Seat Position ControlTrunk/Liftgate Module

Use Scenario: Motorized adjustment of seat fore-aft, recline, and lumbar support in driver and front passenger seats.

IC Role / Device Role / Timing Role: Dedicated LIN node handling motor current sensing, end-stop detection, and position interpolation.

Use Value: On-chip 10-bit ADC enables precise current measurement for stall detection; PWM dead-time control prevents shoot-through in H-bridge drivers.

Use Scenario: Actuation and status monitoring of powered liftgate, including obstacle detection, soft-close, and anti-pinch logic.

IC Role / Device Role / Timing Role: LIN-connected subsystem controller coordinating motor control, limit switch inputs, and CAN gateway relay.

Use Value: Unsecured Flash allows field firmware updates via diagnostic session; 2 KB RAM supports real-time motion profile buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive LIN node microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12ZVL32F0MLCSame die, identical Flash/RAM/LIN/ADC specs; differs only in marking (no 'R' suffix indicating tape-and-reel packaging)No functional difference; used interchangeably in same PCB designsSelect MC9S12ZVL32F0MLC for tray delivery; S9S12ZVL32F0MLCR for automated assembly
S9S12ZVH32F0MLCRSame package and pinout; adds 1 KB EEPROM and enhanced CAN 2.0B controller (not present in S9S12ZVL32F0MLCR)Required where non-volatile parameter storage or CAN communication is needed alongside LINChoose S9S12ZVH32F0MLCR only if EEPROM or CAN capability is mandatory; otherwise S9S12ZVL32F0MLCR offers lower cost and smaller footprint

Compared with MC9S12ZVL32F0MLC, S9S12ZVL32F0MLCR provides identical functionality with tape-and-reel packaging optimized for SMT lines; versus S9S12ZVH32F0MLCR, it omits EEPROM and CAN, reducing cost and power for LIN-only body nodes.

Availability

S9S12ZVL32F0MLCR is available at Aetrix Electronics and suitable for automotive door modules, roof modules, and seat position control systems requiring stable component supply across extended production lifecycles.

Supply support for S9S12ZVL32F0MLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S12 MagniV family targets cost-sensitive, function-integrated automotive body electronics, delivering LIN/CAN-capable MCUs with embedded analog peripherals and AEC-Q100 qualification.

FAQ

What is the security configuration of the S9S12ZVL32F0MLCR?

The S9S12ZVL32F0MLCR is shipped unsecured (security byte = 0x00), allowing unrestricted Flash programming and background debug access via the BKGD pin. This enables rapid development and field firmware updates without security unlock sequences. The S9S12ZVL32F0MLCR does not support secured mode operation - its memory map reserves the security byte location but leaves it permanently unprogrammable.

Does the S9S12ZVL32F0MLCR include a LIN physical layer transceiver?

Yes, the S9S12ZVL32F0MLCR integrates a fully compliant LIN 2.2 physical layer transceiver per ISO 17987-4, including TXD and RXD pins with built-in slew-rate control, bus fault protection, and wake-up detection circuitry. No external LIN transceiver IC is required when using the S9S12ZVL32F0MLCR in standard LIN node implementations.

What is the operating temperature range for the S9S12ZVL32F0MLCR?

The S9S12ZVL32F0MLCR is qualified for −40°C to +125°C ambient operating temperature and certified to AEC-Q100 Grade 1 standards. Its thermal design supports placement in engine bay-adjacent locations such as door modules and liftgate ECUs where sustained high-temperature exposure occurs.

Can the S9S12ZVL32F0MLCR drive motors directly?

The S9S12ZVL32F0MLCR does not integrate H-bridge drivers but provides two 8-bit PWM modules with programmable dead-time insertion, enabling direct interface to external motor driver ICs or discrete FET gate drivers. It supports motor control functions via GPIO, ADC current sensing, and PWM timing - motor power stage must be implemented externally.

Is there on-chip EEPROM in the S9S12ZVL32F0MLCR?

No, the S9S12ZVL32F0MLCR does not include on-chip EEPROM. It provides 32 KB of Flash memory and 2 KB of RAM only. Non-volatile parameter storage must be implemented externally using serial EEPROM or FRAM, or emulated in Flash using wear-leveling techniques. This distinguishes it from the S9S12ZVH32F0MLCR, which includes 1 KB of EEPROM.

S9S12ZVL32F0MLCR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S12 MagniV
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
5.5V ~ 18V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12ZVL32F0MLCR FAQ

1.How can I place an order for S9S12ZVL32F0MLCR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12ZVL32F0MLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12ZVL32F0MLCR reliable?

The price and inventory of S9S12ZVL32F0MLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12ZVL32F0MLCR is usually 5 days.

3.What payment methods are accepted for S9S12ZVL32F0MLCR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12ZVL32F0MLCR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S12ZVL32F0MLCR?

S9S12ZVL32F0MLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12ZVL32F0MLCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12ZVL32F0MLCR?

For technical support, including S9S12ZVL32F0MLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12ZVL32F0MLCR requirements.

6.How does Aetrix verify that S9S12ZVL32F0MLCR is sourced from the original manufacturer or authorized distributors?

All S9S12ZVL32F0MLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12ZVL32F0MLCR meets industry standards.

7.What is the process for return or replacement of S9S12ZVL32F0MLCR?

All S9S12ZVL32F0MLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12ZVL32F0MLCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12ZVL32F0MLCR part is unused and in its original packaging.

Return procedure for S9S12ZVL32F0MLCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S9S12ZVL32F0MLCR Tags

  • S9S12ZVL32F0MLCR
  • S9S12ZVL32F0MLCR PDF
  • S9S12ZVL32F0MLCR Datasheet
  • S9S12ZVL32F0MLCR Specifications
  • S9S12ZVL32F0MLCR Images
  • NXP Semiconductors
  • NXP Semiconductors S9S12ZVL32F0MLCR
  • Buy S9S12ZVL32F0MLCR
  • S9S12ZVL32F0MLCR Price
  • S9S12ZVL32F0MLCR Distributor
  • S9S12ZVL32F0MLCR Supplier
  • S9S12ZVL32F0MLCR Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER