Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S9S12ZVL32F0MLFR

Part No.:
S9S12ZVL32F0MLFR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS9S12ZVL32F0MLFR.pdf
Description:
IC MCU 16BIT 32KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,169

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S9S12ZVL32F0MLFR from NXP Semiconductors is a 16-bit S12 MagniV mixed-signal microcontroller integrating an S12Z CPU core, 32 KB on-chip flash, 2 KB RAM, and embedded voltage regulator. It features CAN 2.0A/B interface, LIN 2.2 support, and operates at up to 25 MHz. Used in automotive body control modules for door lock actuation and window lift control.

For engineers reviewing the S9S12ZVL32F0MLFR datasheet, S9S12ZVL32F0MLFR pinout, S9S12ZVL32F0MLFR application, or S9S12ZVL32F0MLFR equivalent, key selection criteria include CAN/LIN coexistence, integrated voltage regulation, flash endurance (100k cycles), operating temperature range (–40°C to 125°C), and AEC-Q100 Grade 2 qualification.

Technical Context

The S9S12ZVL32F0MLFR implements the S12Z CPU core with 16-bit CISC architecture, supporting byte- and word-level addressing and 16 MB linear address space. It includes a 16-channel 10-bit ADC, 8-bit PWM with center-aligned mode, and a hardware CRC module compliant with IEEE-802.3.

Its integrated voltage regulator supplies regulated 5 V to internal logic and external peripherals, eliminating need for external LDO in many body electronics designs. The device supports background debug mode (BDM) via single-wire interface and includes flash security with unsecured state enabled by default per J-column note.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core S12Z 16-bit CISC core with 25 MHz max clock; enables deterministic real-time control in resource-constrained automotive nodes.
Flash Memory 32 KB on-chip flash with 100k write/erase cycles; sufficient for firmware + calibration data in body control applications.
RAM 2 KB on-chip RAM; supports stack, variables, and CAN message buffers without external memory.
CAN Interface CAN 2.0A/B controller with 16-message object buffer; handles multiplexed vehicle network communication reliably.
LIN Interface LIN 2.2 master/slave controller with auto-baud detection; interoperates with sensors and actuators in low-cost subnetworks.
Operating Temp –40°C to +125°C (AEC-Q100 Grade 2); qualified for under-hood and interior automotive locations.
Voltage Regulator Integrated 5 V regulator with 150 mA output; powers MCU core and external transceivers, reducing BOM count.

Pinout & Package

Package: 48-pin QFP (MLF48, 7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VDD Main power supply input Accepts 5.5–27 V battery rail; feeds internal regulator for stable 5 V core supply.
VREG_OUT Regulated 5 V output Supplies external CAN/LIN transceivers and sensors; current-limited to 150 mA.
CANH / CANL CAN bus differential pair Direct connection to ISO 11898-2 compliant transceiver; supports 1 Mbps operation.
LIN Single-wire LIN bus I/O Open-drain output with internal pull-up; meets LIN physical layer timing and voltage thresholds.
RESET Active-low reset input Asynchronous reset with internal pull-up; compatible with external watchdog or power monitor ICs.
BKGD Background debug pin Single-wire BDM interface for flash programming and real-time debugging without JTAG header.

Key Features

Feature Design Value
Integrated 5 V voltage regulator Reduces external component count by eliminating discrete LDO; simplifies power tree in 12 V automotive systems.
CAN 2.0A/B + LIN 2.2 dual interface Enables hierarchical networking: CAN for high-priority body domain comms, LIN for cost-sensitive sensor/actuator links.
Hardware CRC module Offloads CRC-32 computation from CPU during firmware updates or ECU-to-ECU data exchange, improving reliability.
AEC-Q100 Grade 2 qualification Validated for continuous operation at 125°C junction temperature; meets automotive reliability and stress test requirements.
Unsecured flash state (default) Allows immediate flash programming and debug access out-of-box; security can be enabled via flash configuration byte.

Applications

Door Control Module Window Lift System

Use Scenario: Centralized control of power locks, mirror adjust, and interior lighting in entry systems.

IC Role / Device Role / Timing Role: Main MCU executing lock/unlock logic, monitoring switch inputs, driving motor drivers and relays.

Use Value: Integrated CAN/LIN reduces inter-ECU wiring; 32 KB flash accommodates multi-vehicle variant firmware.

Use Scenario: One-touch up/down control of front/rear windows with anti-pinch detection.

IC Role / Device Role / Timing Role: Real-time motor position sensing via ADC, PWM-controlled H-bridge drive, and LIN-based feedback to body controller.

Use Value: On-chip 10-bit ADC samples current/voltage for stall detection; hardware PWM ensures precise motor speed regulation.

Roof Module Seat Position Control

Use Scenario: Sunroof open/close, tilt, and pinch protection with rain sensor integration.

IC Role / Device Role / Timing Role: Sensor fusion hub processing analog sun sensor, hall effect position, and LIN-linked rain sensor data.

Use Value: 16-channel ADC supports simultaneous sampling of multiple analog sources; LIN interface connects to central body controller.

Use Scenario: Motorized seat adjustment (forward/back, recline, height) with memory preset recall.

IC Role / Device Role / Timing Role: Position tracking via potentiometer ADC, CAN-based command reception, and PWM-driven motor control.

Use Value: CAN 2.0B messaging enables synchronized seat movement across multiple ECUs; flash endurance supports frequent calibration updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S12ZVL64F0MLFR 64 KB flash, same package and peripheral set; no change in RAM, ADC, or regulator specs. Supports larger firmware images with more diagnostics, OTA update capability, or multi-variant code base. Select when future firmware growth or enhanced feature sets require additional non-volatile storage.
MC9S12ZVL32F0MLFR Legacy S12Z part number variant; identical silicon, same mask set, and pinout as S9S12ZVL32F0MLFR. No functional difference; used interchangeably in legacy design documentation and toolchains. Choose for continuity in existing designs where part number consistency with older schematics is required.

Compared with S9S12ZVL32F0MLFR, the S9S12ZVL64F0MLFR offers scalable flash capacity without altering power, timing, or interface behavior, while MC9S12ZVL32F0MLFR provides full form-fit-function equivalence for legacy BOM migration-both preserve CAN/LIN coexistence and AEC-Q100 Grade 2 compliance.

Availability

S9S12ZVL32F0MLFR is available at Aetrix Electronics and suitable for automotive door modules, window lift systems, roof controls, and seat position controllers requiring stable component supply and long-term production support.

Supply support for S9S12ZVL32F0MLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S12 MagniV family targets cost-sensitive automotive body electronics, integrating analog peripherals, voltage regulation, and CAN/LIN interfaces into a single die to reduce system-level BOM and PCB area.

FAQ

What is the default security state of the S9S12ZVL32F0MLFR flash memory?

The S9S12ZVL32F0MLFR ships with unsecured flash memory by default, as confirmed in the J-column note. This allows immediate flash programming and background debug access without unlocking procedures. Security can be permanently enabled by writing to the flash configuration field, after which debug access requires correct security key.

Does the S9S12ZVL32F0MLFR support both CAN and LIN communication simultaneously?

Yes, the S9S12ZVL32F0MLFR integrates independent CAN 2.0A/B and LIN 2.2 controllers that operate concurrently. The CAN module handles high-speed domain communication, while the LIN module manages low-cost sensor/actuator networks-both share no resource contention and retain full functionality during simultaneous operation.

What is the maximum ambient temperature rating for the S9S12ZVL32F0MLFR in automotive applications?

The S9S12ZVL32F0MLFR is qualified to AEC-Q100 Grade 2, specifying operation from –40°C to +125°C ambient temperature. This rating applies to the full 48-pin QFP package and is validated across all electrical parameters including flash write endurance and CAN timing margins.

Can the integrated voltage regulator in the S9S12ZVL32F0MLFR power external transceivers?

Yes, the S9S12ZVL32F0MLFR's integrated 5 V regulator delivers up to 150 mA on VREG_OUT, sufficient to power common CAN and LIN transceivers such as TJA1042 or TJA1021. Designers must verify total load current and thermal derating under worst-case ambient conditions.

Is the S9S12ZVL32F0MLFR pin-compatible with other S12 MagniV variants in the same package?

The S9S12ZVL32F0MLFR shares identical pinout and package (48-pin QFP) with S9S12ZVL64F0MLFR and MC9S12ZVL32F0MLFR. All three parts maintain consistent signal mapping for VDD, CANH/CANL, LIN, RESET, BKGD, and ADC channels-enabling direct PCB reuse across firmware variants.

S9S12ZVL32F0MLFR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
S12 MagniV
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
5.5V ~ 18V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S12ZVL32F0MLFR FAQ

1.How can I place an order for S9S12ZVL32F0MLFR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S12ZVL32F0MLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S12ZVL32F0MLFR reliable?

The price and inventory of S9S12ZVL32F0MLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S12ZVL32F0MLFR is usually 5 days.

3.What payment methods are accepted for S9S12ZVL32F0MLFR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S12ZVL32F0MLFR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S12ZVL32F0MLFR?

S9S12ZVL32F0MLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S12ZVL32F0MLFR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S12ZVL32F0MLFR?

For technical support, including S9S12ZVL32F0MLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S12ZVL32F0MLFR requirements.

6.How does Aetrix verify that S9S12ZVL32F0MLFR is sourced from the original manufacturer or authorized distributors?

All S9S12ZVL32F0MLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S12ZVL32F0MLFR meets industry standards.

7.What is the process for return or replacement of S9S12ZVL32F0MLFR?

All S9S12ZVL32F0MLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S12ZVL32F0MLFR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S12ZVL32F0MLFR part is unused and in its original packaging.

Return procedure for S9S12ZVL32F0MLFR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S9S12ZVL32F0MLFR Tags

  • S9S12ZVL32F0MLFR
  • S9S12ZVL32F0MLFR PDF
  • S9S12ZVL32F0MLFR Datasheet
  • S9S12ZVL32F0MLFR Specifications
  • S9S12ZVL32F0MLFR Images
  • NXP Semiconductors
  • NXP Semiconductors S9S12ZVL32F0MLFR
  • Buy S9S12ZVL32F0MLFR
  • S9S12ZVL32F0MLFR Price
  • S9S12ZVL32F0MLFR Distributor
  • S9S12ZVL32F0MLFR Supplier
  • S9S12ZVL32F0MLFR Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER