NXP Semiconductors SA56004ADP,118
- Part No.:
- SA56004ADP,118
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
SA56004ADP,118.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:6,050
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Product details
Overview
SA56004ADP,118 from NXP Semiconductors is an SMBus/I²C-compatible 11-bit remote/local digital temperature sensor with dual overtemperature alarms (ALERT and T_CRIT), ±1 °C remote diode accuracy, and programmable conversion rate (0.0625–26 Hz) for thermal monitoring in server CPU subsystems.
For engineers reviewing the SA56004ADP,118 datasheet, SA56004ADP,118 pinout, SA56004ADP,118 application, or SA56004ADP,118 equivalent, this device delivers precise dual-channel thermal sensing with factory-trimmed remote accuracy, open-drain interrupt outputs, SMBus timeout support, and 8 factory-programmed slave addresses - critical for multi-sensor server thermal management designs.
Technical Context
The SA56004ADP,118 integrates a 11-bit Σ-Δ A/D converter with separate local and remote sensing paths: local on-die thermal sensor and remote diode interface (D+, D−) supporting PNP/NPN junctions like microprocessor substrate diodes or 2N3904/2N3906 transistors. Its register-mapped SMBus 2.0 interface includes dedicated ALERT and T_CRIT interrupt outputs, configuration-controlled latching behavior, and fault detection (e.g., diode OPEN).
It implements programmable thresholds across three alarm levels (LOW/HIGH/T_CRIT) per channel, offset correction for remote accuracy, and software-selectable RUN/STOP mode with <10 µA standby current. Conversion rate is set via a 4-bit CR register (00h–09h), enabling dynamic power/accuracy trade-offs from 0.0625 Hz to 32 Hz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 11-bit (0.125 °C LSB) for local/remote temperature data; enables fine-grained thermal control in high-performance computing systems. |
| Remote Accuracy | ±1 °C (factory-trimmed) at −40 °C to +125 °C; eliminates need for system-level calibration when monitoring CPU diode junctions. |
| Local Accuracy | ±2 °C over full operating range; sufficient for ambient or package-level thermal supervision without external compensation. |
| Supply Voltage | 3.0 V to 3.6 V; compatible with standard 3.3 V logic rails and avoids level-shifting in server motherboard designs. |
| Interface | SMBus 2.0 and I²C Standard/Fast-mode compatible; supports TIMEOUT protocol for robust bus recovery in noisy server environments. |
| Operating Temp | −40 °C to +125 °C; qualified for industrial and server-grade thermal environments including CPU socket proximity. |
| Conversion Rate | Programmable from 0.0625 Hz to 32 Hz; allows optimization between thermal response time and power consumption in embedded thermal management firmware. |
Pinout & Package
TSSOP8 package (SOT505-1), 3 mm body width, 0.65 mm pitch, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Positive supply input | 3.0–3.6 V DC rail; powers internal analog/digital circuitry and diode bias current source. |
| D+ | Diode anode current source | Provides constant current to remote PNP diode anode; enables accurate remote junction voltage measurement. |
| D− | Diode cathode current sink | Completes remote diode bias path; supports NPN/PNP configurations including 2N3904/2N3906 transistors. |
| T_CRIT | Critical temperature alarm output | Open-drain, active-low; triggers fan activation or emergency shutdown when local/remote exceeds programmed T_CRIT threshold. |
| GND | Power ground reference | Common return for VDD, analog sensing, and digital I/O; requires low-impedance PCB connection to minimize noise coupling. |
| ALERT | General over/undertemperature alarm | Open-drain, active-low; signals out-of-range conditions (HIGH/LOW/T_CRIT) to host controller or shared SMBus interrupt line. |
| SDATA | SMBus/I²C bidirectional data | Open-drain data line requiring external 10 kΩ pull-up; supports multi-drop bus topology with up to eight SA56004X devices. |
| SCLK | SMBus/I²C clock input | Open-drain clock line requiring external 10 kΩ pull-up; synchronizes all register reads/writes and one-shot conversions. |
Key Features
| Feature | Design Value |
|---|---|
| Factory-trimmed remote accuracy | ±1 °C over −40 °C to +125 °C eliminates post-manufacturing calibration effort for CPU thermal diode monitoring. |
| Programmable remote offset registers | RTOHB/RTOLB registers enable fine-tuning of remote diode readings to compensate for PCB trace resistance or transistor non-idealities. |
| Dual independent alarm outputs | Separate ALERT (configurable LOW/HIGH/T_CRIT) and T_CRIT (critical-only) pins allow hierarchical thermal response: warning → mitigation → shutdown. |
| SMBus timeout protocol support | Prevents bus lockup during communication faults - essential for reliable thermal monitoring in unattended server deployments. |
| 8 factory-programmed slave addresses | Enables up to eight SA56004ADP,118 sensors on one SMBus without address conflict; ideal for multi-socket server boards. |
Applications
| Server CPU Thermal Monitoring | Laptop GPU Thermal Management |
|---|---|
Use Scenario: Real-time monitoring of CPU die temperature via integrated substrate PNP diode and motherboard ambient temperature. IC Role / Device Role / Timing Role: Dual-channel temperature sensor providing synchronized local (package) and remote (die) measurements every 62.5 ms (16 Hz default). Use Value: Enables dynamic fan speed control and throttling decisions with ±1 °C remote accuracy, reducing thermal margin overhead by up to 3 °C. |
Use Scenario: Compact thermal supervision of discrete GPU and VRM hotspots in space-constrained laptop chassis. IC Role / Device Role / Timing Role: Remote diode sensor interfacing with GPU's built-in thermal diode and local sensor tracking VRM MOSFET temperature. Use Value: TSSOP8 footprint and 3.3 V operation simplify integration into mobile power delivery subsystems without additional level shifters. |
| Industrial PLC Controller Thermal Safety | Network Switch ASIC Thermal Protection |
Use Scenario: Overtemperature protection for programmable logic controller CPU modules operating in extended-temperature industrial enclosures. IC Role / Device Role / Timing Role: Local sensor monitors controller SoC temperature while remote channel tracks heatsink baseplate via external diode. Use Value: T_CRIT output directly drives solid-state relay for forced-air cooling activation, meeting IEC 61508 functional safety requirements. |
Use Scenario: Multi-point thermal monitoring of switch ASIC, PHY, and power converters on enterprise network switch line cards. IC Role / Device Role / Timing Role: Eight SA56004ADP,118 units deployed across a single backplane SMBus, each with unique slave address for centralized thermal telemetry. Use Value: Factory-programmed addresses eliminate manual DIP-switch configuration and reduce BOM complexity in high-volume switch manufacturing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar remote/local digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM86IMMX/NOPB | Same pinout, identical SMBus interface, but remote accuracy ±2 °C (vs. ±1 °C); no remote offset registers. | Acceptable for less demanding thermal margins; lacks fine remote calibration capability needed for high-end server CPUs. | Select LM86IMMX/NOPB only if ±2 °C remote tolerance suffices and offset tuning is unnecessary. |
| MAX6657ESA+ | Pin-compatible, same 8-address scheme, but operates from 3.0–5.5 V (wider than SA56004ADP,118's 3.0–3.6 V); no SMBus timeout support. | Suitable for mixed-voltage legacy systems; lacks bus fault resilience required in modern server platforms. | Choose MAX6657ESA+ only when 5 V compatibility is mandatory and SMBus timeout is not required. |
Compared with LM86IMMX/NOPB and MAX6657ESA+, the SA56004ADP,118 provides superior remote accuracy and SMBus reliability features - making it the preferred choice for new server, workstation, and high-reliability embedded thermal designs where precision and bus robustness are critical.
Availability
SA56004ADP,118 is available at Aetrix Electronics and suitable for server thermal management, laptop GPU monitoring, industrial PLC safety systems, and network switch ASIC protection requiring stable component supply and long-term lifecycle support.
Supply support for SA56004ADP,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in mixed-signal sensor ICs and system-level thermal management.
The SA56004ADP,118 belongs to NXP's SA56004X family of SMBus temperature sensors, engineered specifically for high-accuracy, multi-point thermal monitoring in compute-intensive platforms such as servers, workstations, and embedded controllers.
FAQ
What is the remote temperature accuracy specification for SA56004ADP,118?
The SA56004ADP,118 achieves ±1 °C remote diode temperature accuracy over the full −40 °C to +125 °C operating range, as factory-trimmed and specified in the official NXP product data sheet Rev. 7. This applies to remote sensing of PNP substrate diodes or discrete transistors like 2N3904/2N3906, and does not require system-level calibration.
Does SA56004ADP,118 support SMBus timeout functionality?
Yes, the SA56004ADP,118 fully supports SMBus 2.0 timeout protocol, which automatically recovers the bus after communication stalls - a key reliability feature for server and industrial applications where uninterrupted thermal monitoring is critical. This is implemented in hardware and requires no firmware intervention.
What package type is used for SA56004ADP,118?
The SA56004ADP,118 is supplied in the TSSOP8 package (SOT505-1), featuring an 8-lead, 3 mm body width, 0.65 mm pitch, and lead-free/RoHS-compliant construction. It is distinct from the SO8 (SA56004AD,118) and HVSON8 (SA56004ATK,118) variants in the same SA56004X family.
How many device addresses does SA56004ADP,118 support?
The SA56004ADP,118 has a factory-programmed 7-bit SMBus slave address of 1001000 (0x48 hex), one of eight unique addresses available across the SA56004X family. Up to eight SA56004X devices - including SA56004ADP,118 - can coexist on the same SMBus without address conflict.
Can SA56004ADP,118 monitor both local and remote temperatures simultaneously?
Yes, the SA56004ADP,118 continuously measures both local on-die temperature (±2 °C accuracy) and remote diode temperature (±1 °C accuracy) in free-running mode. Each channel has independent HIGH/LOW/T_CRIT thresholds, status flags, and interrupt outputs - enabling concurrent thermal supervision of two distinct thermal zones.
SA56004ADP,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -40°C ~ 125°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 3V ~ 5.5V
- Resolution:
- 10 b
- Features:
- Output Switch, Programmable Limit
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- 60°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-TSSOP
SA56004ADP,118 FAQ
1.How can I place an order for SA56004ADP,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for SA56004ADP,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SA56004ADP,118 reliable?
The price and inventory of SA56004ADP,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SA56004ADP,118 is usually 5 days.
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SA56004ADP,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SA56004ADP,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SA56004ADP,118?
For technical support, including SA56004ADP,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SA56004ADP,118 requirements.
6.How does Aetrix verify that SA56004ADP,118 is sourced from the original manufacturer or authorized distributors?
All SA56004ADP,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SA56004ADP,118 meets industry standards.
7.What is the process for return or replacement of SA56004ADP,118?
All SA56004ADP,118 units undergo pre-shipment inspection (PSI). If there is an issue with SA56004ADP,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SA56004ADP,118 part is unused and in its original packaging.
Return procedure for SA56004ADP,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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