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NXP Semiconductors SA56004BDP,118
- Part No.:
- SA56004BDP,118
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
SA56004BDP,118.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,075
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Product details
Overview
SA56004BDP,118 from NXP Semiconductors is an SMBus/I²C-compatible 11-bit remote/local digital temperature sensor with dual overtemperature alarms (ALERT and T_CRIT), ±1 °C remote diode accuracy, and programmable conversion rate (0.0625–26 Hz) for thermal monitoring in server CPU subsystems. It interfaces directly with microprocessor substrate PNP or discrete diodes (e.g., 2N3904/2N3906) and operates from 3.0 V to 3.6 V.
For engineers reviewing the SA56004BDP,118 datasheet, SA56004BDP,118 pinout, SA56004BDP,118 application, or SA56004BDP,118 equivalent, this device delivers precise local/remote thermal sensing with factory-trimmed offset compensation, SMBus timeout protection, and open-drain ALERT/T_CRIT outputs for system interrupt or fan control in high-density computing platforms.
Technical Context
The SA56004BDP,118 integrates a Σ-Δ A/D converter with dual-channel measurement architecture: one on-chip bandgap sensor (±2 °C) and one remote diode interface with current-source/sink terminals (D+, D−). Its register-mapped SMBus 2.0 interface supports read/write access to 11-bit temperature data (0.125 °C LSB), programmable thresholds (LHS/LLS/RHSHB/RLSHB/LCS/RCS), and configuration bits for RUN/STOP, ALERT masking, and T_CRIT source selection.
It implements fault detection including remote diode OPEN condition, BUSY status flagging, and hysteresis-controlled T_CRIT output (configurable 1–32 °C). The device uses OTP-programmed 7-bit slave address (1001001b for SA56004BDP variants) and supports up to eight devices on one bus without address conflict.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Resolution | 11-bit (0.125 °C LSB for local/remote readings); enables fine-grained thermal margining in CPU/GPU thermal management. |
| Remote Accuracy | ±1 °C at −40 °C to +125 °C range; achieved via factory trimming and offset register calibration (RTOHB/RTOLB). |
| Supply Voltage | 3.0 V to 3.6 V; compatible with modern low-voltage server and embedded power rails; includes undervoltage lockout. |
| Interface Standard | SMBus 2.0 and I²C Standard/Fast-mode; supports TIMEOUT protocol for bus robustness in noisy server environments. |
| Conversion Rate | Programmable from 0.0625 Hz to 26 Hz; allows dynamic trade-off between update latency and power consumption (e.g., 16 Hz default). |
| Alarm Outputs | Two open-drain outputs: ALERT (active-low, configurable as comparator/interrupt/ARA) and T_CRIT (active-low, critical shutdown trigger). |
| Operating Range | −40 °C to +125 °C ambient; validated for industrial and server-grade thermal environments. |
Pinout & Package
TSSOP8 package (SOT505-1), 3 mm body width, 0.65 mm pitch, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Positive supply input | 3.0–3.6 V power rail connection; decoupling capacitor required near pin for noise immunity. |
| D+ | Diode current source (anode) | Provides 10 µA constant current to forward-bias external thermal diode or microprocessor PNP junction. |
| D− | Diode current sink (cathode) | Completes remote diode bias path; connects to cathode of 2N3904 or substrate PNP emitter. |
| T_CRIT | Critical temperature alarm output | Open-drain, active-low signal; requires external pull-up; triggers fan activation or system shutdown when local/remote exceeds RCS/LCS. |
| GND | Power ground reference | Common return path for VDD, D+, D−, and internal analog/digital circuits; must be low-impedance. |
| ALERT | General temperature alert output | Open-drain, active-low interrupt; configurable for undertemperature/overtemperature events on local or remote channel. |
| SDATA | SMBus/I²C bidirectional data line | Open-drain serial data; requires 10 kΩ pull-up; supports multi-master arbitration and ARA response. |
| SCLK | SMBus/I²C clock input | Open-drain clock input; requires 10 kΩ pull-up; synchronizes all register reads/writes and conversion timing. |
Key Features
| Feature | Design Value |
|---|---|
| Factory-trimmed remote diode accuracy | ±1 °C error across −40 °C to +125 °C eliminates need for system-level calibration in server thermal designs. |
| Programmable remote offset correction | RTOHB/RTOLB registers allow per-board compensation of PCB trace resistance and diode non-ideality. |
| Dual independent alarm thresholds | LHS/LLS and RHSHB/RLSHB registers enable separate high/low limits for local die and remote diode channels. |
| SMBus timeout protection | Prevents bus lockup during communication faults; essential for unattended server operation and BMC reliability. |
| Eight factory-configured slave addresses | Enables stacking up to eight SA56004X sensors on one SMBus segment without address collision in multi-CPU systems. |
Applications
| Server CPU Thermal Monitoring | Laptop GPU Thermal Protection |
|---|---|
Use Scenario: Real-time die and package temperature tracking in dual-socket x86 servers with multiple processor cores and memory controllers. IC Role / Device Role / Timing Role: Local sensor monitors SoC junction temperature; remote channel tracks discrete thermal diode on VRM or memory module. Use Value: Enables dynamic frequency scaling and fan speed control using 0.125 °C resolution data, reducing thermal throttling events by >30% versus 1 °C-step sensors. |
Use Scenario: Compact thermal supervision of integrated GPU and CPU die in thin-and-light notebooks with limited airflow. IC Role / Device Role / Timing Role: Dual-channel sensor provides simultaneous local SoC and remote GPU diode readings via single SMBus address. Use Value: Reduces BOM count by replacing two discrete sensors; T_CRIT output directly drives GPU thermal shutdown logic without MCU intervention. |
| Industrial PLC Cabinet Monitoring | Network Switch ASIC Thermal Management |
Use Scenario: Ambient and component-level temperature surveillance inside sealed industrial control cabinets operating at −40 °C to +85 °C. IC Role / Device Role / Timing Role: Local sensor measures controller IC temperature; remote channel monitors heatsink-mounted diode for cabinet air flow verification. Use Value: ALERT output triggers cabinet fan activation when remote diode exceeds 70 °C, preventing derating of I/O modules under sustained load. |
Use Scenario: High-precision thermal feedback for 100G Ethernet switch ASICs with tight thermal budgets and dynamic power states. IC Role / Device Role / Timing Role: Remote diode interface tracks ASIC junction via on-die PNP; local sensor validates package thermal interface integrity. Use Value: Programmable conversion rate (up to 26 Hz) supports real-time thermal loop closure for adaptive power gating in SerDes lanes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar remote/local digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM86IMMX/NOPB | Same pinout and SMBus interface; ±2 °C remote accuracy (vs. ±1 °C for SA56004BDP,118); no remote offset register. | Lower-cost option where ±2 °C remote tolerance is acceptable; lacks fine-tuning capability for production board variation. | Select LM86IMMX/NOPB for cost-sensitive industrial applications where calibration headroom exists. |
| MAX6657ESA+ | Identical 8-pin SO package; 12-bit resolution (0.0625 °C); fixed 1.5 V to 3.6 V supply; no T_CRIT hysteresis register. | Better resolution but narrower voltage range; lacks T_CRIT hysteresis programming (fixed 10 °C), limiting fan control stability in variable-load environments. | Choose MAX6657ESA+ only when sub-0.1 °C resolution is mandatory and supply is stable at 1.8 V or 3.3 V. |
Compared with LM86IMMX/NOPB and MAX6657ESA+, the SA56004BDP,118 offers superior remote accuracy with factory trim and user-adjustable offset, plus flexible T_CRIT hysteresis and wider 3.0–3.6 V operation-making it optimal for high-reliability server and telecom thermal management where precision and configurability are critical.
Availability
SA56004BDP,118 is available at Aetrix Electronics and suitable for server motherboard design, industrial PLC thermal monitoring, and network equipment ASIC thermal management requiring stable component supply across extended product lifecycles.
Supply support for SA56004BDP,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in mixed-signal sensor ICs and system-level thermal management.
The SA56004X family was designed specifically for high-density computing platforms requiring accurate, SMBus-integrated thermal monitoring of both processor die and remote components-addressing the growing demand for energy-efficient, thermally aware server and networking hardware.
FAQ
What is the remote diode accuracy specification for SA56004BDP,118?
The SA56004BDP,118 achieves ±1 °C remote diode temperature accuracy across the full −40 °C to +125 °C operating range, verified at time of manufacture and maintained through factory trimming. This specification applies to standard diode-connected transistors (e.g., 2N3904) or microprocessor substrate PNP junctions used with the D+/D− terminals. No additional system-level calibration is required to meet this accuracy.
Does SA56004BDP,118 support I²C Fast-mode operation?
Yes, SA56004BDP,118 is fully compatible with I²C Fast-mode (400 kHz) in addition to SMBus 2.0 and I²C Standard-mode (100 kHz). Its SCLK and SDATA pins implement open-drain drivers with internal level-shifting, allowing interoperability with mixed-voltage I²C buses. External 10 kΩ pull-up resistors to VDD are required for reliable signal integrity at 400 kHz.
How does the T_CRIT output function in SA56004BDP,118?
The T_CRIT output of SA56004BDP,118 is an open-drain, active-low signal that asserts when either the local on-chip temperature or the remote diode temperature exceeds its respective programmed T_CRIT threshold (LCS or RCS register). It supports configurable hysteresis (TH register, 1–32 °C) to prevent chatter during thermal transients and is intended for direct connection to system reset controllers or fan driver ICs without additional logic.
Can SA56004BDP,118 measure both local and remote temperatures simultaneously?
SA56004BDP,118 performs sequential local and remote conversions in free-running mode, not true simultaneity. Each full cycle measures local temperature first, then remote diode temperature, with total conversion time dependent on the programmed rate (e.g., ~62.5 ms at 16 Hz). However, both results are stored in dedicated registers (LTHB/LTLB and RTHB/RTLB) and can be read back independently within one SMBus transaction, enabling near-concurrent thermal visibility.
What package type is used for SA56004BDP,118?
SA56004BDP,118 is supplied in the TSSOP8 package (SOT505-1), featuring 8 leads, 3.0 mm body width, 0.65 mm lead pitch, and lead-free/RoHS-compliant construction. This surface-mount package provides improved thermal performance over SO8 for high-power density applications while maintaining compatibility with standard reflow soldering processes.
SA56004BDP,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -40°C ~ 125°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 3V ~ 5.5V
- Resolution:
- 10 b
- Features:
- Output Switch, Programmable Limit
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- 60°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-TSSOP
SA56004BDP,118 FAQ
1.How can I place an order for SA56004BDP,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for SA56004BDP,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SA56004BDP,118 reliable?
The price and inventory of SA56004BDP,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SA56004BDP,118 is usually 5 days.
3.What payment methods are accepted for SA56004BDP,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SA56004BDP,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SA56004BDP,118?
SA56004BDP,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SA56004BDP,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SA56004BDP,118?
For technical support, including SA56004BDP,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SA56004BDP,118 requirements.
6.How does Aetrix verify that SA56004BDP,118 is sourced from the original manufacturer or authorized distributors?
All SA56004BDP,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SA56004BDP,118 meets industry standards.
7.What is the process for return or replacement of SA56004BDP,118?
All SA56004BDP,118 units undergo pre-shipment inspection (PSI). If there is an issue with SA56004BDP,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SA56004BDP,118 part is unused and in its original packaging.
Return procedure for SA56004BDP,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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