NXP Semiconductors SA56004DDP,118
- Part No.:
- SA56004DDP,118
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
SA56004DDP,118.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,750
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SA56004DDP,118 from NXP Semiconductors is an SMBus/I²C-compatible 11-bit remote/local digital temperature sensor with dual overtemperature alarms (ALERT and T_CRIT), ±1 °C remote accuracy via factory-trimmed diode sensing, and programmable conversion rates from 0.0625 Hz to 26 Hz. It monitors microprocessor thermal diodes or discrete transistors (e.g., 2N3904/2N3906) in server motherboard thermal management systems.
For engineers reviewing the SA56004DDP,118 datasheet, SA56004DDP,118 pinout, SA56004DDP,118 application, or SA56004DDP,118 equivalent, this device delivers precise local/remote thermal monitoring with open-drain interrupt outputs, SMBus timeout support, and 8 factory-programmed slave addresses for multi-sensor server configurations.
Technical Context
The SA56004DDP,118 integrates a Σ-Δ A/D converter with separate local and remote sensing paths, supporting simultaneous 11-bit (0.125 °C LSB) temperature measurements. Its register-mapped SMBus 2.0 interface enables real-time configuration of thresholds, offset correction, and conversion rate control via dedicated R/W registers including CR (04h/0Ah), LHS (05h/0Bh), and RCS (19h).
It implements dual alarm logic: ALERT responds to local/remote out-of-range conditions (programmable HIGH/LOW limits), while T_CRIT activates only on critical overtemperature events (local or remote), each with independent mask bits (CON[7], CON[4:2]) and hysteresis (TH register, 21h). Fault detection includes remote diode OPEN status (SR[2]) and BUSY flag (SR[7]).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 11-bit (0.125 °C LSB) for local/remote temperature data; 8-bit (1.0 °C LSB) for T_CRIT setpoints |
| Accuracy | ±1 °C remote (diode junction), ±2 °C local (on-chip sensor), −40 °C to +125 °C operating range |
| Interface | SMBus 2.0 and I²C Standard/Fast-mode compatible; open-drain SDATA/SCLK requiring 10 kΩ pull-ups |
| Supply Voltage | 3.0 V to 3.6 V; undervoltage lockout prevents erroneous readings below threshold |
| Conversion Rate | Programmable 0.0625 Hz to 26 Hz (CR register, 04h/0Ah); default 16 Hz after POR |
| Alarm Outputs | Two open-drain, active-low outputs: ALERT (configurable HIGH/LOW/T_CRIT alert) and T_CRIT (critical-only) |
| Slave Addresses | 8 factory-programmed 7-bit addresses (e.g., SA56004DDP = 1001 011); supports multi-device bus sharing |
Pinout & Package
TSSOP8 package (SOT505-1): plastic thin shrink small outline, 8 leads, 3 mm body width, lead pitch 0.65 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Positive supply input | 3.0–3.6 V DC; powers internal circuitry and bias current sources for remote diode sensing |
| D+ | Diode anode current source | Provides constant current to forward-bias external PNP substrate or NPN/PNP transistor diode junctions |
| D− | Diode cathode sink | Completes remote diode current path; voltage drop across D+/D− reflects junction temperature |
| T_CRIT | Critical temperature alarm output | Open-drain, active-low interrupt signaling local or remote temperature ≥ programmed T_CRIT threshold |
| GND | Power ground reference | Return path for VDD, D+, D−, and internal analog/digital blocks; must be low-impedance |
| ALERT | General temperature alarm output | Open-drain, active-low interrupt indicating local/remote temperature outside HIGH/LOW limits or fault conditions |
| SDATA | Serial data I/O | Bi-directional SMBus/I²C data line; requires external pull-up; supports ARA response protocol |
| SCLK | Serial clock input | Master-generated clock for synchronous data transfer; open-drain, requires external pull-up |
Key Features
| Feature | Design Value |
|---|---|
| Remote diode offset calibration | Adjustable via 11-bit RTOHB/RTOLB registers (11h/12h) to compensate for transistor-specific thermal gradients |
| Configurable alarm latching | Fault queue bit (CON[0]) selects single-event (default) or triple-consecutive-out-of-limit triggering for ALERT assertion |
| Low-power standby mode | Software-controlled RUN/STOP bit (CON[6]) reduces supply current to <10 μA while retaining register state and SMBus responsiveness |
| SMBus timeout protection | Hardware-enforced bus recovery prevents lockup during master failure; compliant with SMBus 2.0 specification |
| Diode fault detection | Automated OPEN detection (SR[2]) identifies disconnected or shorted remote diode, preventing false thermal shutdown |
Applications
| Server CPU Thermal Monitoring | Laptop GPU Temperature Control |
|---|---|
Use Scenario: Real-time tracking of multi-core CPU die temperature using integrated substrate PNP diode. IC Role / Device Role / Timing Role: Remote temperature sensor providing 0.125 °C resolution readings every 62.5 ms (16 Hz default) to BMC for fan speed modulation. Use Value: Enables dynamic thermal throttling before silicon exceeds 105 °C, maintaining performance within JEDEC JESD22-A108 reliability limits. |
Use Scenario: Monitoring discrete 2N3904 transistor mounted near GPU VRM to detect hotspots under sustained load. IC Role / Device Role / Timing Role: Local/remote dual-channel sensor feeding thermal data to EC firmware for adaptive cooling policy execution. Use Value: Prevents GPU thermal runaway by triggering T_CRIT-driven system shutdown at 95 °C, avoiding permanent damage. |
| Industrial PLC Cabinet Management | Network Switch ASIC Thermal Protection |
Use Scenario: Distributed temperature supervision across multiple I/O modules inside sealed industrial control cabinets. IC Role / Device Role / Timing Role: SMBus node with unique slave address (1001 011) reporting ambient and component temperatures to main controller. Use Value: Eight address options allow up to eight SA56004DDP,118 units on one bus, eliminating address conflicts in modular designs. |
Use Scenario: Protecting high-speed SerDes lanes in 10G Ethernet switches from thermal derating due to ambient rise. IC Role / Device Role / Timing Role: Remote sensor interfaced to switch ASIC's thermal diode, delivering 11-bit readings to MAC controller via I²C. Use Value: Programmable conversion rate (down to 0.0625 Hz) extends battery life in fanless PoE switch designs without sacrificing alarm responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar remote/local temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM86IMMX/NOPB | Same pinout, identical SMBus interface, but ±2 °C remote accuracy (vs. ±1 °C for SA56004DDP,118); no remote offset register | Lacks remote diode calibration capability; less suitable for precision thermal compensation in high-density PCBs | Select LM86IMMX/NOPB only when ±2 °C remote tolerance is acceptable and offset adjustment is unnecessary |
| MAX6657ESA+ | Identical 8-pin SO8/TSSOP8 footprint and register map; operates at 3.0–5.5 V (wider than SA56004DDP,118's 3.0–3.6 V) | Supports higher VDD but lacks SMBus timeout protocol; not JEDEC JESD78 latch-up tested | Choose MAX6657ESA+ for legacy 5 V systems where SMBus timeout is non-critical and latch-up immunity is verified externally |
Compared with LM86IMMX/NOPB and MAX6657ESA+, the SA56004DDP,118 provides superior remote accuracy and built-in SMBus timeout, making it optimal for high-reliability server and industrial applications where thermal precision and bus robustness are mandatory.
Availability
SA56004DDP,118 is available at Aetrix Electronics and suitable for server motherboard thermal management, industrial PLC cabinet monitoring, and network switch ASIC protection requiring stable component supply across extended temperature ranges.
Supply support for SA56004DDP,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in mixed-signal IC design and embedded processing.
The SA56004DDP,118 belongs to NXP's precision analog sensor product line, engineered specifically for high-density thermal monitoring in enterprise computing and industrial control systems demanding sub-degree accuracy and SMBus reliability.
FAQ
What is the remote temperature accuracy specification for SA56004DDP,118?
The SA56004DDP,118 achieves ±1 °C remote temperature accuracy across −40 °C to +125 °C when monitoring diode-connected transistors (e.g., 2N3904) or microprocessor substrate PNP junctions, enabled by factory trimming and supported by the remote offset register (RTOHB/RTOLB) for post-assembly calibration. This accuracy is specified per NXP SA56004X datasheet Rev. 7.
Does SA56004DDP,118 support I²C Fast-mode operation?
Yes, SA56004DDP,118 is fully compatible with I²C Fast-mode (400 kHz) and Standard-mode (100 kHz), as confirmed in its features list and functional description. Its open-drain SDATA and SCLK pins require external 10 kΩ pull-up resistors to VDD, and timing parameters meet Fast-mode specifications for setup/hold times and clock low/high periods.
How does the T_CRIT output differ from the ALERT output on SA56004DDP,118?
The T_CRIT output on SA56004DDP,118 is dedicated solely to critical overtemperature events (local or remote ≥ programmed T_CRIT threshold), while ALERT signals broader conditions including HIGH/LOW limit violations and fault states (e.g., diode OPEN). T_CRIT has independent enable/mask control (CON[4:2]), hysteresis (TH register), and is intended for immediate system shutdown or fan activation.
Can SA56004DDP,118 operate with a 5.0 V supply?
No, SA56004DDP,118 is rated for 3.0 V to 3.6 V only. Its absolute maximum VDD is 4.0 V per the datasheet; applying 5.0 V risks permanent damage. For 5 V systems, consider alternatives like MAX6657ESA+ (3.0–5.5 V) or level-shifting the SMBus interface while powering SA56004DDP,118 from a regulated 3.3 V rail.
What package type is used by SA56004DDP,118?
SA56004DDP,118 uses the TSSOP8 package (SOT505-1): plastic thin shrink small outline with 8 leads, 3 mm body width, 0.65 mm lead pitch, and exposed pad option not present. This package is pin-compatible with SO8 and HVSON8 variants of the SA56004X family and matches the pinout of LM86/MAX6657/ADM1032.
SA56004DDP,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -40°C ~ 125°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 3V ~ 5.5V
- Resolution:
- 10 b
- Features:
- Output Switch, Programmable Limit
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- 60°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-TSSOP
SA56004DDP,118 FAQ
1.How can I place an order for SA56004DDP,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for SA56004DDP,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SA56004DDP,118 reliable?
The price and inventory of SA56004DDP,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SA56004DDP,118 is usually 5 days.
3.What payment methods are accepted for SA56004DDP,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SA56004DDP,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SA56004DDP,118?
SA56004DDP,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SA56004DDP,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SA56004DDP,118?
For technical support, including SA56004DDP,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SA56004DDP,118 requirements.
6.How does Aetrix verify that SA56004DDP,118 is sourced from the original manufacturer or authorized distributors?
All SA56004DDP,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SA56004DDP,118 meets industry standards.
7.What is the process for return or replacement of SA56004DDP,118?
All SA56004DDP,118 units undergo pre-shipment inspection (PSI). If there is an issue with SA56004DDP,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SA56004DDP,118 part is unused and in its original packaging.
Return procedure for SA56004DDP,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SA56004DDP,118 Tags

-
MCP9700T-E/TT
Microchip Technology

-
MCP9700T-E/LT
Microchip Technology

-
MCP9701T-E/TT
Microchip Technology

-
MCP9701T-E/LT
Microchip Technology

-
TMP235A4DBZR
Texas Instruments

-
MCP9700AT-E/TT
Microchip Technology

-
MCP9700AT-E/LT
Microchip Technology

-
MCP9701AT-E/LT
Microchip Technology

-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

