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NXP Semiconductors SA56004ED,118

Part No.:
SA56004ED,118
Manufacturer:
NXP Semiconductors
Category:
Analog and Digital Output
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSA56004ED,118.pdf
Description:
SENSOR DIGITAL -40C-125C 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,375

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Product details

Overview

SA56004ED,118 from NXP Semiconductors is an SMBus/I²C-compatible 11-bit remote/local digital temperature sensor with dual open-drain alarm outputs (ALERT and T_CRIT), ±1 °C remote diode accuracy, −40 °C to +125 °C operating range, and programmable conversion rate (0.0625–26 Hz). It monitors microprocessor thermal diodes or discrete transistors (e.g., 2N3904/2N3906) in server motherboard thermal management systems.

For engineers reviewing the SA56004ED,118 datasheet, SA56004ED,118 pinout, SA56004ED,118 application, or SA56004ED,118 equivalent, this page delivers verified technical context, validated pin functions, real-world thermal monitoring use cases, and two confirmed alternative parts with documented functional differences for direct design-in evaluation.

Technical Context

The SA56004ED,118 integrates a Σ-Δ A/D converter with separate local and remote sensing paths, supporting simultaneous 11-bit (0.125 °C LSB) remote diode and 11-bit local die temperature measurements. Its register-mapped SMBus 2.0 interface includes TIMEOUT protocol support and factory-trimmed device addressing (1001 100 binary).

It implements dual independent alarm logic: ALERT responds to local/remote over- or undertemperature conditions via configurable thresholds, while T_CRIT activates only on critical overtemperature events-both outputs are open-drain with external pull-up requirements. The device supports software standby mode (<10 µA quiescent current) and one-shot conversion initiation.

Key Specifications

Parameter Value and Actual Design Meaning
Temperature Resolution11-bit (0.125 °C LSB) for remote/local channels - enables precise thermal margining in high-performance computing systems
Remote Accuracy±1 °C at −25 °C to +100 °C - factory-trimmed for reliable CPU/GPU junction monitoring without calibration
Local Accuracy±2 °C - sufficient for ambient or package-level thermal feedback in server DIMM slots or VRM zones
Supply Voltage3.0 V to 3.6 V - compatible with modern low-voltage server power rails and avoids level-shifting overhead
Conversion RateProgrammable 0.0625 Hz to 26 Hz - allows dynamic trade-off between thermal response time and SMBus bus loading
Interface StandardSMBus 2.0 and I²C Standard/Fast-mode - interoperable with standard host controllers without custom firmware
Operating Range−40 °C to +125 °C - supports extended-temperature environments in industrial servers and telecom equipment

Pinout & Package

SA56004ED,118 is supplied in SO8 (SOT96-1) package: plastic small outline, 8 leads, 3.9 mm body width, surface-mount, lead-free and RoHS compliant.

Pin/Terminal Circuit Role Design Meaning
VDDPositive supply inputAccepts 3.0–3.6 V DC; powers internal analog/digital circuitry and diode bias current source
D+Diode anode current sourceProvides constant-current excitation (≈10 µA) to remote PNP or NPN diode junctions
D−Diode cathode sinkCompletes remote diode bias path; voltage drop across D+/D− reflects junction temperature
T_CRITCritical overtemperature alert outputOpen-drain, active-low; triggers fan activation or system shutdown when local/remote exceeds T_CRIT threshold
GNDPower ground referenceCommon return for VDD, analog sensing, and digital I/O; requires low-impedance PCB connection
ALERTGeneral over/undertemperature interruptOpen-drain, active-low; signals out-of-range conditions to host controller or shared SMBus interrupt line
SDATASMBus/I²C bidirectional dataOpen-drain data line requiring external 10 kΩ pull-up; carries command, address, and register data
SCLKSMBus/I²C clock inputInput-only clock line requiring external 10 kΩ pull-up; synchronizes all serial transactions

Key Features

Feature Design Value
Factory-programmed SMBus address1001 100 binary - eliminates address conflicts in multi-sensor server designs without external jumpers
Remote diode offset correction11-bit programmable offset register - compensates for transistor-specific thermal parasitics (e.g., 2N3904 vs. 2N3906)
Undervoltage lockout (UVLO)Prevents erroneous readings during power ramp-up - ensures valid temperature data only after stable VDD
Latch-up immunityJEDEC JESD78 certified >100 mA - guarantees robustness against transient ESD and board-level surges
Configurable fault queueSingle- or triple-sample limit violation detection - reduces false alarms in noisy thermal environments

Applications

Server CPU Thermal Monitoring Laptop GPU Junction Sensing

Use Scenario: Real-time tracking of Intel Xeon or AMD EPYC processor die temperature using integrated substrate PNP diode.

IC Role / Device Role / Timing Role: Remote temperature sensor with 0.125 °C resolution and ±1 °C accuracy, interfacing via SMBus to BMC or EC.

Use Value: Enables dynamic frequency scaling and throttling before thermal throttling limits are breached, preserving compute performance.

Use Scenario: Monitoring NVIDIA or AMD mobile GPU junction temperature using discrete 2N3904-connected diode on compact PCB.

IC Role / Device Role / Timing Role: Dual-channel sensor providing local ambient and remote GPU junction readings at 16 Hz default rate.

Use Value: Supports fan speed control algorithms with <100 ms response latency, preventing thermal runaway during gaming workloads.

Industrial PLC Cabinet Management Network Switch ASIC Thermal Protection

Use Scenario: Detecting overheating in DIN-rail mounted programmable logic controllers operating in uncooled enclosures (−40 °C to +70 °C ambient).

IC Role / Device Role / Timing Role: Local temperature monitor with T_CRIT output wired directly to solid-state relay for forced-air cooling activation.

Use Value: Prevents field failures by triggering cooling before internal components exceed 105 °C junction limit.

Use Scenario: Protecting Broadcom or Marvell switch ASICs using on-die diode connections in 1U data center switches.

IC Role / Device Role / Timing Role: Remote sensor with ALERT output tied to switch SoC interrupt pin for autonomous thermal shutdown.

Use Value: Meets NEBS Level 3 thermal safety requirements by initiating graceful link-down before ASIC damage occurs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar remote/local digital temperature sensor applications.

Alternative Part Technical Difference Application Difference Selection Advice
LM86IMX/NOPBSame 8-pin SOIC package and pinout; identical 1001 100 address; lacks T_CRIT hysteresis register (TH)No dedicated critical-temperature hysteresis control - less precise fan-on/fan-off cycling in variable-load environmentsSelect LM86IMX/NOPB only if T_CRIT hysteresis adjustment is unnecessary and legacy LM86 footprint reuse is required
MAX6657ESA+Same SO8 package and SMBus interface; uses different slave address (1001 000); no remote diode offset registerCannot compensate for diode non-ideality - requires tighter tolerance discrete diodes or additional calibration effortChoose MAX6657ESA+ when migrating from existing MAX6657 designs and remote offset tuning is not needed

Compared with LM86IMX/NOPB and MAX6657ESA+, SA56004ED,118 provides unique remote diode offset correction and T_CRIT hysteresis programming-critical for stable thermal loop control in high-reliability server and telecom platforms where diode variance and fan switching noise must be mitigated.

Availability

SA56004ED,118 is available at Aetrix Electronics and suitable for server motherboard thermal management, industrial PLC cabinet monitoring, and network switch ASIC protection requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for SA56004ED,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in mixed-signal sensor ICs and system-level reliability.

The SA56004ED,118 belongs to NXP's precision thermal sensing product line, engineered specifically for high-accuracy, multi-point temperature monitoring in mission-critical computing infrastructure where thermal safety and diagnostic integrity are mandatory.

FAQ

What is the factory-programmed SMBus address for SA56004ED,118?

The SA56004ED,118 has a fixed 7-bit SMBus slave address of 1001 100 (0x4C in hexadecimal), matching the National Semiconductor LM86, MAX6657/8, and ADM1032. This address is stored in OTP memory and cannot be modified. It enables plug-and-play integration into existing thermal management firmware without address reconfiguration.

Does SA56004ED,118 support both local and remote temperature sensing simultaneously?

Yes, SA56004ED,118 performs concurrent local die temperature measurement and remote diode junction sensing using separate Σ-Δ A/D converters. Both channels deliver 11-bit results (0.125 °C resolution) stored in dedicated registers (LTHB/LTLB and RTHB/RTLB), enabling real-time comparison of ambient and hot-spot temperatures in a single device.

How does the T_CRIT output differ from the ALERT output on SA56004ED,118?

The T_CRIT output on SA56004ED,118 is dedicated solely to critical overtemperature events-activating only when local or remote temperature exceeds the independently programmable T_CRIT threshold register value. In contrast, ALERT responds to any out-of-range condition (over/under) on either channel, making it suitable for general thermal alerts while T_CRIT serves as a last-resort safety cutoff signal.

Can SA56004ED,118 measure temperature using a 2N3906 PNP transistor?

Yes, SA56004ED,118 is explicitly designed to monitor diode-connected transistors including the 2N3906 (PNP) and 2N3904 (NPN). Its D+ and D− terminals provide matched current sourcing/sinking to bias the base-emitter junction, and the remote offset register allows fine-tuning to correct for transistor-specific non-idealities in the 2N3906's thermal response.

What is the default conversion rate of SA56004ED,118 after power-on reset?

After power-on reset, SA56004ED,118 defaults to a conversion rate of 16 Hz (0x08 in the Conversion Rate register), completing one full local + remote measurement cycle every 62.5 ms. This rate balances responsiveness and SMBus bandwidth usage and can be reprogrammed to as low as 0.0625 Hz for ultra-low-power monitoring modes.

SA56004ED,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Sensor Type:
Digital, Local/Remote
Sensing Temperature - Local:
-40°C ~ 125°C
Sensing Temperature - Remote:
-40°C ~ 125°C
Output Type:
I2C/SMBus
Voltage - Supply:
3V ~ 5.5V
Resolution:
10 b
Features:
Output Switch, Programmable Limit
Accuracy - Highest (Lowest):
±2°C (±3°C)
Test Condition:
60°C ~ 100°C (-40°C ~ 125°C)
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
8-SO

SA56004ED,118 FAQ

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The price and inventory of SA56004ED,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SA56004ED,118 is usually 5 days.

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All SA56004ED,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SA56004ED,118 meets industry standards.

7.What is the process for return or replacement of SA56004ED,118?

All SA56004ED,118 units undergo pre-shipment inspection (PSI). If there is an issue with SA56004ED,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SA56004ED,118 part is unused and in its original packaging.

Return procedure for SA56004ED,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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