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NXP Semiconductors SA56004GD,112
- Part No.:
- SA56004GD,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SA56004GD,112.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8SO
- Quantity:
- Payment:
- Shipping:
Inventory:2,719
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Product details
Overview
SA56004GD,112 from NXP Semiconductors is an SMBus-compatible 11-bit remote/local digital temperature sensor with dual overtemperature alarms (ALERT and T_CRIT), ±1 °C remote diode accuracy, and programmable conversion rates from 0.0625 Hz to 26 Hz. It monitors microprocessor thermal diodes or discrete transistors (e.g., 2N3904/2N3906) in server thermal management systems.
For engineers reviewing the SA56004GD,112 datasheet, SA56004GD,112 pinout, SA56004GD,112 application, or SA56004GD,112 equivalent, key selection factors include its SO8 package, factory-programmed SMBus address (1001 110), 3.0–3.6 V operation, open-drain ALERT/T_CRIT outputs, and compatibility with LM86/MAX6657/ADM1032 in thermal monitoring designs.
Technical Context
The SA56004GD,112 integrates a Σ-Δ A/D converter for 11-bit (0.125 °C LSB) remote and local temperature measurements, with separate high/low and T_CRIT threshold registers for both channels. Its architecture supports SMBus 2.0 timeout protocol and dual interrupt outputs-ALERT (active-Low, maskable) and T_CRIT (active-Low, critical shutdown trigger).
It features factory-trimmed remote sensing, programmable offset correction for diode non-ideality, undervoltage lockout, and latch-up immunity exceeding 100 mA per JEDEC JESD78. The device operates in free-running or software standby mode (<10 µA quiescent current), with register-based configuration via SMBus/I²C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature resolution | 11-bit (0.125 °C LSB) for remote/local sensing - enables precise thermal margining in CPU/GPU thermal throttling. |
| Remote accuracy | ±1 °C at −40 °C to +125 °C - meets server-grade thermal diode monitoring requirements without calibration. |
| Local accuracy | ±2 °C - sufficient for ambient or die-temperature reference in system-level thermal control loops. |
| Supply voltage | 3.0 V to 3.6 V - matches modern low-voltage server motherboard power rails; excludes 5 V operation. |
| Conversion rate | Programmable 0.0625 Hz to 26 Hz - allows dynamic trade-off between update latency and power consumption. |
| SMBus address | Factory-programmed 7-bit address 1001 110 - one of eight unique addresses enabling multi-sensor configurations on shared bus. |
| Operating range | −40 °C to +125 °C - supports industrial and server environments including hot-swap and extended-temperature applications. |
Pinout & Package
SA56004GD,112 is supplied in the SO8 (SOT96-1) plastic small outline package, 8-lead, 3.9 mm body width, lead pitch 1.27 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Positive supply input | Accepts 3.0–3.6 V; powers internal circuitry and diode bias current source. |
| D+ | Diode anode current source | Provides constant-current excitation (≈10 µA) to remote PNP or NPN diode junctions. |
| D− | Diode cathode sink | Completes remote diode bias path; enables accurate forward-voltage measurement. |
| T_CRIT | Critical temperature alarm output | Open-drain, active-Low signal requiring external pull-up; triggers fan activation or system shutdown. |
| GND | Power ground reference | Common return for VDD, analog sensing, and digital I/O; must be low-impedance for noise immunity. |
| ALERT | General over/undertemperature alarm | Open-drain, active-Low interrupt output; configurable as comparator or latched SMBus alert. |
| SDATA | SMBus/I²C bidirectional data line | Open-drain interface requiring external pull-up; supports Standard/Fast-mode I²C and SMBus 2.0. |
| SCLK | SMBus/I²C clock input | Input-only clock line requiring external pull-up; synchronizes all register read/write operations. |
Key Features
| Feature | Design Value |
|---|---|
| Remote diode sensing | ±1 °C accuracy with factory trimming - eliminates need for system-level calibration in server thermal subsystems. |
| Programmable offset registers | 11-bit remote offset adjustment (RTOHB/RTOLB) - compensates for diode ideality factor and series resistance errors. |
| Dual independent alarms | Separate ALERT (configurable hysteresis) and T_CRIT (critical shutdown) outputs - enables tiered thermal response (warning → mitigation → shutdown). |
| SMBus 2.0 compliance | Full TIMEOUT protocol support - prevents bus lockup during communication faults in mission-critical systems. |
| Low-power standby mode | <10 µA quiescent current with SMBus active - maintains remote monitoring capability while minimizing idle power in energy-sensitive platforms. |
Applications
| Server CPU Thermal Monitoring | Laptop GPU Thermal Protection |
|---|---|
Use Scenario: Real-time monitoring of Intel Xeon or AMD EPYC processor die temperature using integrated substrate PNP diode. IC Role / Device Role / Timing Role: Remote temperature sensor providing 0.125 °C-resolution readings to BMC or host controller via SMBus. Use Value: Enables dynamic frequency scaling and fan speed control within ±1 °C accuracy, preventing thermal throttling and extending component lifetime. |
Use Scenario: Detecting overheating in NVIDIA or AMD mobile GPUs during sustained gaming or rendering workloads. IC Role / Device Role / Timing Role: Local + remote sensor feeding thermal data to EC firmware for immediate fan ramp-up or display warning. Use Value: Prevents GPU thermal shutdown by triggering cooling action 5–10 °C before critical junction limits are reached. |
| Industrial PLC Cabinet Management | Network Switch ASIC Thermal Control |
Use Scenario: Monitoring ambient and power module temperature inside DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Dual-channel sensor reporting local cabinet air temp and remote MOSFET junction temp via I²C to ARM-based controller. Use Value: Supports predictive maintenance by logging temperature trends and initiating derating before thermal runaway occurs. |
Use Scenario: Tracking Broadcom or Marvell switch ASIC temperature under full packet forwarding load in 1U data center switches. IC Role / Device Role / Timing Role: Remote diode sensor interfaced to switch management MCU, with T_CRIT driving hardware reset if >110 °C is exceeded. Use Value: Guarantees fail-safe shutdown before ASIC silicon damage, meeting NEBS GR-63-CORE reliability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar remote/local temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM86IMX/NOPB | Same SO8 package, identical pinout, 11-bit resolution, but ±2 °C remote accuracy and no SMBus timeout support. | Lacks T_CRIT hysteresis register and remote offset correction; less suitable for high-accuracy server thermal control. | Select when cost sensitivity outweighs ±1 °C accuracy requirement and SMBus robustness is not critical. |
| MAX6657AESA+ | SO8 pin-compatible, 11-bit resolution, ±1.5 °C remote accuracy, supports 3.0–5.5 V supply (wider than SA56004GD,112). | No T_CRIT output; uses single ALERT with programmable hysteresis only - requires external logic for critical shutdown. | Choose for mixed-voltage systems where 5 V tolerance is needed and dual-alarm architecture is unnecessary. |
Compared with LM86IMX/NOPB and MAX6657AESA+, the SA56004GD,112 delivers superior remote accuracy (±1 °C vs. ±1.5–2 °C), dedicated T_CRIT output for hardware-level shutdown, and SMBus timeout protection - making it optimal for high-reliability server and telecom thermal management where deterministic fault response is mandatory.
Availability
SA56004GD,112 is available at Aetrix Electronics and suitable for server thermal management, industrial PLC cabinet monitoring, and network switch ASIC protection requiring stable component supply across long production lifecycles.
Supply support for SA56004GD,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in sensor signal conditioning and embedded system interfaces.
The SA56004GD,112 belongs to NXP's precision analog temperature sensor product line, designed specifically for high-accuracy, SMBus-enabled thermal monitoring in enterprise computing and infrastructure equipment.
FAQ
What is the SMBus slave address of SA56004GD,112?
The SA56004GD,112 has a factory-programmed 7-bit SMBus slave address of 1001 110 (0x4E in hexadecimal). This address is stored in OTP memory and cannot be changed. It is one of eight unique addresses available across the SA56004X family, allowing up to eight SA56004GD,112 devices on a single SMBus without conflict.
Does SA56004GD,112 support both SMBus and I²C protocols?
Yes, SA56004GD,112 is fully compatible with SMBus 2.0 and I²C Standard-mode (100 kHz) and Fast-mode (400 kHz). It implements SMBus-specific features including TIMEOUT detection and Alert Response Address (ARA) support, while maintaining electrical and timing compliance with I²C specifications for interoperability with standard I²C controllers.
How does the remote diode sensing accuracy of SA56004GD,112 compare to its local sensor?
The SA56004GD,112 achieves ±1 °C remote diode accuracy across −40 °C to +125 °C due to factory trimming, while its on-chip local temperature sensor is specified at ±2 °C. This differential reflects the higher complexity and variability of external diode measurement versus internal silicon sensing, and is consistent with industry-standard thermal diode sensor performance.
Can SA56004GD,112 operate from a 5 V supply?
No, SA56004GD,112 is rated for 3.0 V to 3.6 V only. Operation outside this range may cause functional failure or permanent damage. Unlike some competing sensors (e.g., MAX6657), it does not support 5 V operation - design must ensure clean, regulated 3.3 V supply with adequate decoupling near the VDD pin.
What is the function of the T_CRIT output on SA56004GD,112?
The T_CRIT output on SA56004GD,112 is an open-drain, active-Low signal that asserts when either the local or remote temperature exceeds its independently programmed T_CRIT threshold register value. It is intended for direct connection to hardware shutdown circuits, cooling fan enable inputs, or system reset controllers - providing deterministic, non-software-dependent thermal safety response.
SA56004GD,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -40°C ~ 125°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 3V ~ 5.5V
- Resolution:
- 10 b
- Features:
- Output Switch, Programmable Limit
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- 60°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-SO
SA56004GD,112 FAQ
1.How can I place an order for SA56004GD,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for SA56004GD,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SA56004GD,112 reliable?
The price and inventory of SA56004GD,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SA56004GD,112 is usually 5 days.
3.What payment methods are accepted for SA56004GD,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SA56004GD,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SA56004GD,112?
SA56004GD,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SA56004GD,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SA56004GD,112?
For technical support, including SA56004GD,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SA56004GD,112 requirements.
6.How does Aetrix verify that SA56004GD,112 is sourced from the original manufacturer or authorized distributors?
All SA56004GD,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SA56004GD,112 meets industry standards.
7.What is the process for return or replacement of SA56004GD,112?
All SA56004GD,112 units undergo pre-shipment inspection (PSI). If there is an issue with SA56004GD,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SA56004GD,112 part is unused and in its original packaging.
Return procedure for SA56004GD,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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