NXP Semiconductors SA56004HDP,118
- Part No.:
- SA56004HDP,118
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
SA56004HDP,118.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SA56004HDP,118 from NXP Semiconductors is an SMBus/I²C-compatible 11-bit remote/local digital temperature sensor with dual open-drain alarm outputs (ALERT and T_CRIT), ±1 °C remote diode accuracy, 0.125 °C resolution, and operation from −40 °C to +125 °C - used for thermal monitoring of microprocessor junctions and system-level thermal management in servers and embedded controllers.
For engineers reviewing the SA56004HDP,118 datasheet, SA56004HDP,118 pinout, SA56004HDP,118 application, or SA56004HDP,118 equivalent, key selection considerations include its TSSOP8 package, factory-programmed SMBus address (1001 111), programmable conversion rate (0.0625–26 Hz), remote diode offset compensation, and compatibility with LM86/MAX6657/ADM1032-based thermal subsystems.
Technical Context
The SA56004HDP,118 integrates a Σ-Δ A/D converter with dual sensing paths: on-chip local sensor (±2 °C) and remote diode interface (D+, D−) supporting PNP/NPN transistors like 2N3904/2N3906. Its register-mapped SMBus 2.0 interface includes timeout protection and supports both interrupt and comparator modes via the ALERT mode register (AM).
Temperature data is stored as 11-bit two's complement values (LSB = 0.125 °C) for local/remote channels, while setpoint registers use 8-bit two's complement (LSB = 1.0 °C). The device implements fault detection (diode open, BUSY status), programmable hysteresis (1–31 °C), and latch-up immunity per JEDEC JESD78 (>100 mA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 11-bit (0.125 °C LSB) for local/remote temperature readings - enables fine-grained thermal control in high-performance computing systems. |
| Remote Accuracy | ±1 °C over −40 °C to +125 °C - achieved via factory trimming, critical for CPU/GPU junction monitoring without calibration. |
| Operating Voltage | 3.0 V to 3.6 V - matches modern low-voltage server and embedded power rails; undervoltage lockout prevents erroneous reads. |
| Conversion Rate | Programmable from 0.0625 Hz to 26 Hz - allows dynamic trade-off between update latency and power consumption in thermal loop design. |
| SMBus Address | Factory-programmed 7-bit address 1001 111 (0x4F) - one of eight unique addresses enabling multi-sensor configurations on shared bus. |
| Diode Interface | D+ (current source) and D− (current sink) pins - directly interfaces substrate PNP diodes or discrete 2N3904/2N3906 transistors for remote sensing. |
| T_CRIT Output | Open-drain, active-low output - triggers hardware shutdown or fan activation when local/remote temperature exceeds user-defined critical threshold. |
Pinout & Package
TSSOP8 package (SOT505-1), 3 mm body width, 0.65 mm pitch, lead-free, RoHS-compliant - optimized for space-constrained server DIMM modules and industrial controller PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Positive supply input | Accepts 3.0–3.6 V DC; powers internal circuitry and bias current sources for diode sensing. |
| D+ | Diode anode current source | Provides constant current to forward-bias remote PNP substrate diode or NPN transistor base-emitter junction. |
| D− | Diode cathode current sink | Completes remote diode bias path; enables accurate ΔVBE measurement for temperature calculation. |
| T_CRIT | Critical temperature alarm output | Open-drain, active-low signal requiring external pull-up; asserts when local/remote temp exceeds T_CRIT register value. |
| GND | Power ground reference | Common return for VDD, analog sensing, and digital I/O; must be low-impedance for noise-sensitive measurements. |
| ALERT | General over/undertemperature alarm | Open-drain, active-low interrupt output; configurable as SMBus alert, system interrupt, or comparator via AM register. |
| SDATA | SMBus/I²C bidirectional data line | Open-drain data pin requiring 10 kΩ pull-up; supports Standard-mode (100 kHz) and Fast-mode (400 kHz) I²C timing. |
| SCLK | SMBus/I²C clock input | Open-drain clock pin requiring 10 kΩ pull-up; synchronizes all register read/write operations with host controller. |
Key Features
| Feature | Design Value |
|---|---|
| Remote diode offset correction | Adjustable via RTOHB/RTOLB registers - compensates for parasitic resistance and transistor non-idealities to maintain ±1 °C accuracy. |
| Programmable alarm thresholds | Independent local/remote HIGH/LOW and T_CRIT limits - enables tiered thermal response (warning → fan ramp → shutdown). |
| SMBus timeout protocol support | Prevents bus lockup during communication faults - enhances reliability in mission-critical server thermal management. |
| Low-power standby mode | <10 µA quiescent current with RUN/STOP bit = 1 - extends battery life in portable instrumentation and enables wake-on-temperature. |
| Diode open-circuit detection | Automated OPEN flag in Status Register (bit 2) - alerts host to broken remote sensor connection before thermal runaway occurs. |
Applications
| Server Thermal Monitoring | Laptop CPU/GPU Junction Sensing |
|---|---|
Use Scenario: Real-time temperature tracking of multiple CPU cores and memory modules in 1U/2U rack servers. IC Role / Device Role / Timing Role: Remote diode sensor interfacing with processor-integrated thermal diodes; provides 0.125 °C resolution readings at 16 Hz default rate. Use Value: Enables dynamic fan speed control and core throttling to maintain ASHRAE-recommended inlet air temperatures while minimizing acoustic noise. | Use Scenario: Compact thermal feedback for dual-core mobile processors and discrete graphics chips in ultrabooks. IC Role / Device Role / Timing Role: Local sensor measures SoC die temperature; remote channel monitors GPU junction via 2N3904-connected diode. Use Value: Supports Intel Dynamic Platform and Thermal Framework (DPTF) compliance with sub-degree accuracy and SMBus interrupt-driven event reporting. |
| Industrial PLC Temperature Supervision | Test Equipment Thermal Calibration |
Use Scenario: Ambient and component-level thermal monitoring in DIN-rail mounted programmable logic controllers operating in −40 °C to +70 °C environments. IC Role / Device Role / Timing Role: Local sensor tracks ambient cabinet temperature; remote channel monitors power MOSFET junctions using onboard PNP diodes. Use Value: Provides fail-safe overtemperature shutdown via T_CRIT output, meeting IEC 61508 SIL-2 functional safety requirements for thermal protection. | Use Scenario: Reference-grade temperature acquisition in benchtop multimeters and automated test equipment requiring traceable thermal validation. IC Role / Device Role / Timing Role: High-stability local sensor (±2 °C) and calibrated remote diode interface used as secondary standard against PT100 probes. Use Value: Delivers 0.125 °C resolution and SMBus register logging for ISO/IEC 17025-compliant calibration reports without external ADC overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar remote/local temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM86IMMX/NOPB | Same pinout and SMBus address (0x4C); no remote diode offset register; ±2 °C remote accuracy vs. SA56004HDP,118's ±1 °C. | Lacks programmable remote offset - less suitable for high-accuracy CPU junction monitoring where board-level parasitics dominate error budget. | Select LM86IMMX/NOPB only if legacy design reuse is required and ±2 °C remote tolerance is acceptable. |
| MAX6657ISA+ | Identical TSSOP8 footprint and 0x4C address; supports only Standard-mode I²C (100 kHz); no SMBus timeout protocol. | No bus timeout protection - increases risk of hung bus in noisy industrial environments with long SMBus traces. | Choose MAX6657ISA+ for cost-sensitive consumer electronics where bus robustness is secondary to BOM cost. |
Compared with LM86IMMX/NOPB and MAX6657ISA+, the SA56004HDP,118 delivers superior remote accuracy (±1 °C), integrated SMBus timeout, and remote offset correction - making it the preferred choice for thermally constrained server and industrial control applications demanding long-term stability and fault resilience.
Availability
SA56004HDP,118 is available at Aetrix Electronics and suitable for server thermal management, laptop CPU/GPU junction sensing, and industrial PLC temperature supervision requiring stable component supply across extended product lifecycles.
Supply support for SA56004HDP,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in mixed-signal sensor ICs and system-level thermal management.
The SA56004X family was designed specifically for high-accuracy, multi-point thermal monitoring in dense computing platforms - addressing the need for reliable remote diode sensing, SMBus robustness, and programmable alarm hierarchy in servers and embedded controllers.
FAQ
What is the SMBus address of the SA56004HDP,118?
The SA56004HDP,118 has a factory-programmed 7-bit SMBus slave address of 1001 111 (0x4F), one of eight unique addresses available in the SA56004X series. This address is stored in OTP memory and cannot be modified in-system. It differs from the LM86 (0x4C) and ADM1032 (0x4C), enabling coexistence on the same bus when used alongside those devices.
Does the SA56004HDP,118 support remote diode offset calibration?
Yes, the SA56004HDP,118 supports remote diode offset calibration via the RTOHB (address 0x11) and RTOLB (address 0x12) registers. This allows compensation for voltage drops across PCB traces and transistor non-idealities, maintaining ±1 °C remote accuracy without external hardware adjustments - a capability not present in LM86 or MAX6657.
What is the maximum conversion rate of the SA56004HDP,118?
The SA56004HDP,118 supports a maximum conversion rate of 26 Hz, selectable via the Conversion Rate register (CR, address 0x04/0x0A). At this rate, the device completes a full local + remote measurement cycle every ~38.5 ms, enabling rapid thermal response in dynamic workloads such as burst-mode server processing.
How does the T_CRIT output function on the SA56004HDP,118?
The T_CRIT output on the SA56004HDP,118 is an open-drain, active-low signal that asserts when either the local die temperature or remote diode temperature exceeds the programmed T_CRIT threshold (default 85 °C). It requires an external pull-up resistor and is commonly wired to a system reset controller or fan driver to initiate immediate cooling or safe shutdown.
Is the SA56004HDP,118 pin-compatible with the LM86?
No, the SA56004HDP,118 is not pin-compatible with the LM86. While both are 8-pin TSSOP temperature sensors, the SA56004HDP,118 uses pin 2 for D+ and pin 3 for D−, whereas the LM86 uses pin 2 for SDA and pin 3 for SCL. The SA56004EDP/ED variants (not HDP) share LM86 pinout and address - but SA56004HDP,118 is a distinct variant with different pin mapping and address (0x4F).
SA56004HDP,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -40°C ~ 125°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 3V ~ 5.5V
- Resolution:
- 10 b
- Features:
- Output Switch, Programmable Limit
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- 60°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-TSSOP
SA56004HDP,118 FAQ
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Please submit a Request for Quotation (RFQ) for SA56004HDP,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of SA56004HDP,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SA56004HDP,118 is usually 5 days.
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5.How can I obtain technical support or documentation for SA56004HDP,118?
For technical support, including SA56004HDP,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SA56004HDP,118 requirements.
6.How does Aetrix verify that SA56004HDP,118 is sourced from the original manufacturer or authorized distributors?
All SA56004HDP,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SA56004HDP,118 meets industry standards.
7.What is the process for return or replacement of SA56004HDP,118?
All SA56004HDP,118 units undergo pre-shipment inspection (PSI). If there is an issue with SA56004HDP,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SA56004HDP,118 part is unused and in its original packaging.
Return procedure for SA56004HDP,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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