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Home > Products > Integrated Circuits (ICs) > Embedded > Microprocessors

Microchip Technology SAM9X60D1G-I/4FB

Name: SAM9X60D1G-I/4FB
Brand: Microchip Technology
SKU: SAM9X60D1G-I/4FB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SAM9X60D1G-I/4FB

Manufacturer:: Microchip Technology

Category:: Microprocessors

Package:: 233-TFBGA

Datasheet:: SAM9X60D1G-I/4FB.pdf

Description:: IC MPU SAM9X60 600MHZ 233TFBGA

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Product details

Overview

SAM9X60D1G-I/4FB from Microchip Technology is a System-in-Package (SIP) microprocessor integrating an ARM926EJ-S core running at up to 600 MHz, 1-Gbit DDR2-SDRAM (Winbond W971GG6SB), and 64-Kbyte SRAM0 in a single TFBGA233 package. It features a 16-bit DDR2 memory bus, hardware cryptography (AES-256, SHA-512, TRNG), and dual 10/100 Mbps Ethernet MACs - enabling Linux-capable industrial HMI and edge gateway designs with reduced PCB layer count and EMI-optimized routing.

For engineers reviewing the SAM9X60D1G-I/4FB datasheet, SAM9X60D1G-I/4FB pinout, SAM9X60D1G-I/4FB application, or SAM9X60D1G-I/4FB equivalent, this SIP solution addresses memory co-location constraints, DDR2 timing validation complexity, secure boot requirements, and high-integration embedded control where board space, signal integrity, and cryptographic acceleration are critical selection criteria.

Technical Context

The SAM9X60D1G-I/4FB implements a unified SIP architecture with tightly coupled DDR2-SDRAM (1 Gbit, 16-bit bus, CAS Latency 3, SSTL_18 interface) and MPDDRC controller supporting auto-refresh, DLL-aligned DQS, and impedance-calibrated drivers. Its ARM926EJ-S core includes MMU, 32-Kbyte I/D caches, and runs at 600 MHz with system clock up to 200 MHz.

Power management integrates ULP0/ULP1 low-power modes, dual RC oscillators (32 kHz / 12 MHz), and PLLs for system (up to 200 MHz) and USB HS (480 MHz). Peripheral integration includes two CAN controllers, 13 FLEXCOMs (USART/SPI/TWI), 12-channel 12-bit ADC, and LCD controller supporting 1024×768 @ 60 fps.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	ARM926EJ-S @ 600 MHz with MMU, 32-Kbyte I-cache + 32-Kbyte D-cache - enables Linux OS execution and memory-protected multitasking.
Integrated Memory	1-Gbit DDR2-SDRAM (W971GG6SB), 16-bit bus, CL3, 1.8 V - eliminates external memory routing, reduces layer count to 2-layer PCB feasibility.
Cryptographic Acceleration	AES-256, SHA-512, TDES, TRNG compliant with FIPS PUB 197/180-2/46-3 - supports secure boot, encrypted firmware updates, and NIST-validated RNG for key generation.
Peripherals	Dual 10/100 Mbps EMAC (MII/RMII), 2× CAN 2.0B, 13× FLEXCOM, 12-bit 12-ch ADC, LCD controller (1024×768), 2D graphics engine - targets industrial HMI, gateway, and vision-adjacent edge nodes.
Package & Environment	TFBGA233, 14×14 mm², 0.8 mm pitch, -40°C to +85°C ambient - optimized for standard PCB layout with defined power/ground ball assignment for decoupling.
Power Management	ULP0/ULP1 ultra-low-power modes, backup mode with RTC + 8×32-bit GPBR, programmable slew-rate I/Os - supports battery-backed operation and EMI-aware sleep/wake transitions.

Pinout & Package

Package: TFBGA233, 14×14 mm², 0.8 mm ball pitch, 233-ball configuration with dedicated DDR2 power rails (DDRM_VDD/VSS), DDR_CAL, DDR_VREF, and impedance-controlled I/O banks.

Pin/Terminal	Circuit Role	Design Meaning
DDRM_VDD (multiple balls)	DDR2 memory I/O supply	1.8 V ±0.1 V rail for DDR2 SDRAM interface - requires separate low-noise regulation and local decoupling per Microchip DS60001580B Section 8.1.
DDR_CAL	DDR calibration reference	Single-ended input for on-die termination (ODT) calibration - must be connected to VDDIOM via 240 Ω resistor per datasheet Figure 6-1 and Table 6-2.
DDR_VREF	DDR2 reference voltage	0.9 V reference for SSTL_18 input receivers - generated internally from DDRM_VDD and requires external 10 nF capacitor to ground.
CLK / CLKN	Differential DDR2 clock inputs	LVDS-compatible differential pair driving DDR2 memory - routed as matched-length, controlled-impedance traces (100 Ω differential) per JEDEC DDR2 spec.
DQ[0:15], DQS/DQSN[0:1]	Data and strobe lines	16-bit bidirectional data bus with source-synchronous double-data-rate strobes - DQS aligned to read data edge, center-aligned to write data.

Key Features

Feature	Design Value
System-in-Package Integration	Eliminates 100+ external DDR2 routing nets, reduces PCB layers from 6 to 2 in typical layouts, and removes DDR2 fly-by topology constraints.
Hardware Crypto Engine	Offloads AES-256 encryption/decryption, SHA-512 hashing, and TRNG entropy generation - reduces CPU load by >90% vs. software-only crypto in Linux-based OTA update workflows.
MPDDRC Controller	Supports auto-refresh, self-refresh, and programmable timing parameters (tRCD, tRP, tRAS) - enables deterministic DDR2 initialization and runtime reconfiguration without external PHY.
EMI-Optimized I/O	Slew-rate controlled outputs, spread-spectrum PLLs, and BGA power/ground ball assignment - achieves <15 dB lower radiated emissions vs. discrete MPU+DDR2 solutions at 100–500 MHz.
Secure Bootloader	64-Kbyte ROM bootloader with OTP-configurable boot sources (NAND, SD, QSPI), BCH ECC for NAND, and PMECC support - ensures authenticated firmware launch and NAND reliability in unattended deployments.

Applications

Industrial HMI	Edge Gateway
Use Scenario: Touch-enabled factory floor display with real-time PLC communication and local data logging. IC Role / Device Role / Timing Role: Main application processor executing Linux Qt-based UI, managing 1024×768 RGB LCD, 4-wire resistive touchscreen ADC, and dual CAN for fieldbus bridging. Use Value: Integrated DDR2 eliminates memory layout bottlenecks; hardware crypto secures firmware updates over cellular backhaul; dual EMAC enables isolated control and IT network interfaces.	Use Scenario: Protocol-convergent gateway aggregating Modbus RTU, CANopen, and MQTT traffic to cloud platforms. IC Role / Device Role / Timing Role: Central protocol translation engine with two 10/100 EMACs (one for LAN, one for industrial network), 2× CAN controllers, and secure TLS stack acceleration. Use Value: SIP DDR2 provides sufficient RAM for concurrent protocol stacks; TRNG + AES-256 enables FIPS-compliant TLS 1.2 handshake offload; 13 FLEXCOMs support legacy serial field devices.
Smart Building Controller	Medical Edge Node
Use Scenario: HVAC and lighting controller with BACnet/IP, KNX, and local web UI hosted on device. IC Role / Device Role / Timing Role: Real-time control processor running FreeRTOS for sensor polling and actuator PWM, plus Linux container for web server and BACnet stack. Use Value: Dual Ethernet allows segregated management and control networks; 4× PWM channels drive dimmable LED loads; hardware SHA-512 validates signed BACnet firmware images.	Use Scenario: Portable diagnostic device with image sensor interface, audio feedback, and HIPAA-compliant data export. IC Role / Device Role / Timing Role: Image acquisition host via 12-bit ISI (ITU-R BT.656), audio playback via Class D amplifier, and encrypted USB mass storage export. Use Value: 12-bit ADC + ISI supports 12-bit medical imaging sensors; Class D controller drives SE/BTL speakers; AES-256 encrypts patient data before USB transfer.

Industrial HMI

Edge Gateway

Use Scenario: Touch-enabled factory floor display with real-time PLC communication and local data logging.

IC Role / Device Role / Timing Role: Main application processor executing Linux Qt-based UI, managing 1024×768 RGB LCD, 4-wire resistive touchscreen ADC, and dual CAN for fieldbus bridging.

Use Value: Integrated DDR2 eliminates memory layout bottlenecks; hardware crypto secures firmware updates over cellular backhaul; dual EMAC enables isolated control and IT network interfaces.

Use Scenario: Protocol-convergent gateway aggregating Modbus RTU, CANopen, and MQTT traffic to cloud platforms.

IC Role / Device Role / Timing Role: Central protocol translation engine with two 10/100 EMACs (one for LAN, one for industrial network), 2× CAN controllers, and secure TLS stack acceleration.

Use Value: SIP DDR2 provides sufficient RAM for concurrent protocol stacks; TRNG + AES-256 enables FIPS-compliant TLS 1.2 handshake offload; 13 FLEXCOMs support legacy serial field devices.

Smart Building Controller

Medical Edge Node

Use Scenario: HVAC and lighting controller with BACnet/IP, KNX, and local web UI hosted on device.

IC Role / Device Role / Timing Role: Real-time control processor running FreeRTOS for sensor polling and actuator PWM, plus Linux container for web server and BACnet stack.

Use Value: Dual Ethernet allows segregated management and control networks; 4× PWM channels drive dimmable LED loads; hardware SHA-512 validates signed BACnet firmware images.

Use Scenario: Portable diagnostic device with image sensor interface, audio feedback, and HIPAA-compliant data export.

IC Role / Device Role / Timing Role: Image acquisition host via 12-bit ISI (ITU-R BT.656), audio playback via Class D amplifier, and encrypted USB mass storage export.

Use Value: 12-bit ADC + ISI supports 12-bit medical imaging sensors; Class D controller drives SE/BTL speakers; AES-256 encrypts patient data before USB transfer.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SAM9X60D5M-I/4FB	512-Mbit DDR2-SDRAM (W9751G6KB), same TFBGA233 package, identical core/peripherals	Targeted at smaller Linux footprint or bare-metal RTOS use cases requiring <512 MB effective RAM	Select when memory bandwidth and capacity requirements are lower; retains full pin compatibility and software compatibility.
SAM9X60D6K-I/4FB	64-Mbit SDR-SDRAM (W9864G6KH), TFBGA196 (11×11 mm², 0.65 mm pitch), 3.3 V DDRM_VDD	Designed for cost-sensitive, low-power applications using μClinux or bare metal with minimal memory needs	Choose for compact form factor and lower power; requires PCB redesign due to different package, pitch, and voltage domain.

Compared with SAM9X60D1G-I/4FB, the D5M variant offers identical integration and footprint at reduced memory density, while the D6K variant trades DDR2 performance and capacity for smaller size and SDR-SDRAM simplicity - making D1G the optimal choice for Linux-based edge nodes demanding high-bandwidth memory and cryptographic throughput.

Availability

SAM9X60D1G-I/4FB is available at Aetrix Electronics and suitable for industrial HMI, edge gateways, and smart building controllers requiring stable component supply, long-term lifecycle assurance, and validated SIP-level qualification.

Supply support for SAM9X60D1G-I/4FB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company specializing in microcontrollers, analog, FPGA, and security solutions, with a focus on industrial, automotive, and IoT applications.

The SAM9X60 SIP product line delivers fully integrated, pre-validated MPU+memory combinations targeting rapid development of Linux-capable edge devices with minimized PCB complexity and enhanced EMI robustness.

FAQ

What is the memory configuration of the SAM9X60D1G-I/4FB?

The SAM9X60D1G-I/4FB integrates a 1-Gbit DDR2-SDRAM (Winbond W971GG6SB) with a 16-bit data bus, CAS Latency 3, and SSTL_18 interface, alongside 64-Kbyte SRAM0 and 160-Kbyte ROM. This configuration supports full Linux distributions and eliminates external memory routing, directly reducing PCB layer count and signal integrity challenges in the SAM9X60D1G-I/4FB design.

Does the SAM9X60D1G-I/4FB support secure boot?

Yes, the SAM9X60D1G-I/4FB includes a 64-Kbyte ROM-based secure bootloader with OTP-configurable boot sources (NAND Flash, SD card, SPI/QSPI Flash), BCH ECC for NAND reliability, and PMECC support. It validates firmware signatures using integrated SHA-256 and AES-256 engines, ensuring authenticated and tamper-resistant startup - a core capability of the SAM9X60D1G-I/4FB.

What package type and ball count does the SAM9X60D1G-I/4FB use?

The SAM9X60D1G-I/4FB uses a 233-ball TFBGA package measuring 14×14 mm² with 0.8 mm pitch. This package incorporates dedicated DDR2 power rails (DDRM_VDD/VSS), DDR_CAL, DDR_VREF, and impedance-calibrated I/O banks - all specified in Microchip DS60001580B and required for reliable DDR2 interface implementation in the SAM9X60D1G-I/4FB.

Can the SAM9X60D1G-I/4FB operate in ultra-low-power modes?

Yes, the SAM9X60D1G-I/4FB supports software-programmable Ultra-Low Power modes including ULP0 (Very Slow Clock Operating Mode) and ULP1 (No-Clock Operating Mode) with fast wake-up, plus backup mode retaining RTC and eight 32-bit general-purpose registers. These modes are managed by the integrated Power Management Controller and are fully documented for the SAM9X60D1G-I/4FB in DS60001580B Section 2.4.

What peripherals are included in the SAM9X60D1G-I/4FB?

The SAM9X60D1G-I/4FB includes dual 10/100 Mbps Ethernet MACs (MII/RMII), two CAN 2.0B controllers, 13 FLEXCOMs (configurable as USART/SPI/TWI), a 12-channel 12-bit ADC with touchscreen support, LCD controller (1024×768), 2D graphics engine, and hardware crypto accelerators (AES-256, SHA-512, TRNG). All are silicon-verified features of the SAM9X60D1G-I/4FB per DS60001580B.

SAM9X60D1G-I/4FB Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Package/Case:: 233-TFBGA

Series:: SAM9X60

Packaging:: Tray

Product Status:: Active

Core Processor:: ARM926EJ-S

Number of Cores/Bus Width:: 1 Core, 32-Bit

Speed:: 600MHz

Co-Processors/DSP:: -

RAM Controllers:: LPDDR, LPSDR, DDR2, SDR, SRAM

Graphics Acceleration:: Yes

Display & Interface Controllers:: Keyboard, LCD, Touchscreen

Ethernet:: 10/100Mbps (2)

SATA:: -

USB:: USB 2.0 (3)

Voltage - I/O:: 3.3V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Security Features:: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins

Mounting Type:: Surface Mount

Supplier Device Package:: 233-TFBGA (14x14)

Additional Interfaces:: -

SAM9X60D1G-I/4FB FAQ

1.How can I place an order for SAM9X60D1G-I/4FB through Aetrix?

Please submit a Request for Quotation (RFQ) for SAM9X60D1G-I/4FB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SAM9X60D1G-I/4FB reliable?

The price and inventory of SAM9X60D1G-I/4FB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SAM9X60D1G-I/4FB is usually 5 days.

3.What payment methods are accepted for SAM9X60D1G-I/4FB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SAM9X60D1G-I/4FB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SAM9X60D1G-I/4FB?

SAM9X60D1G-I/4FB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SAM9X60D1G-I/4FB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SAM9X60D1G-I/4FB?

For technical support, including SAM9X60D1G-I/4FB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SAM9X60D1G-I/4FB requirements.

6.How does Aetrix verify that SAM9X60D1G-I/4FB is sourced from the original manufacturer or authorized distributors?

All SAM9X60D1G-I/4FB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SAM9X60D1G-I/4FB meets industry standards.

7.What is the process for return or replacement of SAM9X60D1G-I/4FB?

All SAM9X60D1G-I/4FB units undergo pre-shipment inspection (PSI). If there is an issue with SAM9X60D1G-I/4FB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SAM9X60D1G-I/4FB part is unused and in its original packaging.

Return procedure for SAM9X60D1G-I/4FB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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