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Microchip Technology SAM9X60D5M-I/4FB

Part No.:
SAM9X60D5M-I/4FB
Manufacturer:
Microchip Technology
Category:
Microprocessors
Package:
233-TFBGA
Datasheet:
AetrixSAM9X60D5M-I/4FB.pdf
Description:
IC MPU SAM9X60 600MHZ 233TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:130

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Product details

Overview

SAM9X60D5M-I/4FB from Microchip Technology is a System-in-Package (SiP) microprocessor integrating an ARM926EJ-S core running at 600 MHz, 512-Mbit DDR2-SDRAM, 64-Kbyte SRAM0, and peripherals including dual 10/100 Ethernet MACs, two CAN controllers, LCD controller supporting 1024×768, and hardware crypto accelerators (AES-256, SHA-512, TRNG). It targets industrial HMI, embedded Linux gateways, and secure edge devices requiring integrated memory and low-EMI BGA packaging.

For engineers reviewing the SAM9X60D5M-I/4FB datasheet, SAM9X60D5M-I/4FB pinout, SAM9X60D5M-I/4FB application, or SAM9X60D5M-I/4FB equivalent, key selection criteria include DDR2-SDRAM integration (W975116KG2-5I), TFBGA233 package with 0.8 mm pitch, 16-bit DRAM bus, -40°C to +85°C industrial temperature grade, and support for secure boot via OTP-configurable bootloader.

Technical Context

The SAM9X60D5M-I/4FB implements a single-chip SiP architecture combining the SAM9X60 MPU die and Winbond W975116KG2-5I 512-Mbit DDR2-SDRAM in a monolithic TFBGA233 package. Its MPDDRC controller supports DDR2-specific timing (CAS Latency 3, burst length 8, SSTL_18 I/O), while the ARM926EJ-S core operates at up to 600 MHz with MMU, 32-Kbyte I/D caches, and TrustZone-enabled security primitives.

System-level integration includes a high-bandwidth multi-port DDR2 controller, dual 10/100 Ethernet MACs with MII/RMII interfaces, 13 FLEXCOMs configurable as USART/SPI/TWI, and dedicated hardware accelerators for AES-256, SHA-512, and true random number generation compliant with NIST SP 800-22 and FIPS PUB 140-3.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM926EJ-S @ 600 MHz with MMU, 32-Kbyte instruction cache, 32-Kbyte data cache
Integrated Memory512-Mbit DDR2-SDRAM (Winbond W975116KG2-5I), 16-bit bus, CAS Latency 3
PackageTFBGA233, 14×14 mm², 0.8 mm ball pitch, optimized for 2-layer PCB layout
Operating Temperature-40°C to +85°C ambient, junction rated to +125°C
Security FeaturesAES-256/192/128, SHA-1/224/256/384/512, TDES, TRNG compliant with FIPS PUB 197/180-2/46-3 and NIST SP 800-22
PeripheralsDual 10/100 Ethernet MACs (MII/RMII), two CAN 2.0B controllers, 12-bit 12-channel ADC, LCD controller (1024×768), 13 FLEXCOMs
Power ManagementULP0/ULP1 ultra-low-power modes, backup mode with RTC and 8×32-bit GPBR registers

Pinout & Package

Package: TFBGA233, 14×14 mm², 0.8 mm ball pitch, 233-ball configuration with dedicated DDR2 power/ground ball assignment for optimal decoupling and EMI control.

Pin/TerminalCircuit RoleDesign Meaning
DDRM_VDD (multiple balls)DDR2 memory I/O supply1.8 V ±0.1 V SSTL_18 interface voltage; requires tight regulation and local decoupling
DDR_CALDDR impedance calibration referenceConnects to external 240 Ω resistor for on-die termination calibration of DDR2 drivers
DDR_VREFDDR2 reference voltage0.9 V reference for SSTL_18 input receivers; must be stable and low-noise
CLK / CLKNDifferential DDR2 clock inputsAccepts differential 1.8 V clock; DLL aligns DQ/DQS transitions to CLK edges
DQ[0:15], DQS/DQSN[0:1]Data and strobe lines16-bit bidirectional data bus with edge-aligned read / center-aligned write timing

Key Features

FeatureDesign Value
Integrated DDR2-SDRAM512-Mbit Winbond W975116KG2-5I eliminates external memory routing, reduces PCB layers from ≥6 to 2 in most designs
Hardware Crypto EngineFIPS-compliant AES-256, SHA-512, and TRNG enable secure boot, encrypted storage, and TLS offload without software overhead
Low-EMI BGA LayoutSlew-rate-controlled I/Os, impedance-calibrated DDR PHY, and optimized power/ground ball mapping simplify EMC certification
Dual Ethernet + CANTwo independent 10/100 MACs and two CAN 2.0B controllers support industrial protocol gateways with redundant connectivity
Secure Bootloader64-Kbyte ROM bootloader with OTP-selectable boot sources (NAND, SD, SPI/QSPI Flash) and NAND BCH ECC table support

Applications

Industrial HMI TerminalSecure Edge Gateway

Use Scenario: Touchscreen-based operator interface in factory automation with real-time status display and alarm logging.

IC Role / Device Role / Timing Role: Main application processor executing Linux UI stack, driving 1024×768 RGB LCD, sampling 12-bit resistive touchscreen, and managing Ethernet/CAN fieldbus bridging.

Use Value: Integrated DDR2 eliminates memory layout complexity; LCD controller with alpha-blending enables smooth GUI rendering; -40°C to +85°C rating ensures reliability in uncontrolled environments.

Use Scenario: Field-deployed IoT gateway aggregating sensor data from Modbus RTU and CAN networks, encrypting payloads, and forwarding via TLS-secured Ethernet.

IC Role / Device Role / Timing Role: Secure system-on-module host running embedded Linux, performing AES-256 encryption, validating firmware signatures, and managing dual Ethernet uplinks with failover.

Use Value: Hardware TRNG and FIPS-compliant crypto accelerators reduce CPU load and ensure cryptographic integrity; dual Ethernet MACs enable primary/backup WAN links.

Medical Device ControllerSmart Energy Meter

Use Scenario: Portable diagnostic device requiring FDA-grade data integrity, battery-backed RTC, and low-power sleep between measurements.

IC Role / Device Role / Timing Role: Real-time controller executing deterministic measurement routines, storing calibrated sensor data in internal SRAM0, and maintaining secure audit logs in encrypted NAND flash.

Use Value: ULP0/ULP1 power modes enable <10 µA standby current; hardware SHA-512 ensures tamper-proof log signing; backup mode preserves RTC and 8×32-bit registers during main power loss.

Use Scenario: DIN-rail mounted electricity meter communicating AMI protocols over PLC and Ethernet, with secure firmware updates and tamper detection.

IC Role / Device Role / Timing Role: Dual-role processor handling metrology data acquisition via ADC, executing DLMS/COSEM stack, and enforcing secure OTA updates using OTP-locked bootloader keys.

Use Value: 12-bit ADC with 4/5-wire touchscreen support repurposed for precision analog sensing; OTP memory stores root-of-trust keys; PMECC supports NAND reliability in long-life deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SAM9X60D1G-I/4FBIntegrates 1-Gbit DDR2-SDRAM (W971GG6SB) instead of 512-Mbit; identical TFBGA233 package and pinoutTargets Linux-based applications requiring >256 MB RAM footprint; higher memory bandwidth but same power envelopeSelect when application demands larger heap/stack or full desktop Linux distributions; no PCB changes required
SAM9X60D6K-I/4FBUses 64-Mbit SDR-SDRAM (W9864G6KH) in TFBGA196 (11×11 mm², 0.65 mm pitch); different ball count and memory interfaceOptimized for bare-metal or RTOS use cases with minimal memory needs; lower cost and smaller footprint but reduced bandwidthChoose for cost-sensitive, low-complexity designs where DDR2 features (burst, DLL) are unnecessary; requires new PCB layout

Compared with SAM9X60D5M-I/4FB, the D1G variant offers double memory capacity in the same footprint for Linux scalability, while the D6K variant trades DDR2 performance for compactness and cost in resource-constrained RTOS systems-enabling tiered product families from a single silicon platform.

Availability

SAM9X60D5M-I/4FB is available at Aetrix Electronics and suitable for industrial HMI terminals, secure edge gateways, medical device controllers, and smart energy meters requiring stable component supply across extended product lifecycles.

Supply support for SAM9X60D5M-I/4FB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and FPGA solutions with emphasis on reliability, longevity, and embedded security.

The SAM9X60 SIP product line integrates ARM9-based processors with embedded memory to simplify design of industrial, medical, and IoT edge devices requiring robust operation, cryptographic trust, and long-term supply assurance.

FAQ

What is the memory configuration of the SAM9X60D5M-I/4FB?

The SAM9X60D5M-I/4FB integrates a 512-Mbit DDR2-SDRAM (Winbond W975116KG2-5I) with a 16-bit data bus, CAS Latency 3, and SSTL_18 I/O standard. It also includes 64-Kbyte SRAM0, 160-Kbyte ROM (with 64-Kbyte secure bootloader), and 11-Kbyte OTP memory for key storage. This configuration supports Linux execution while minimizing external memory routing complexity.

Does the SAM9X60D5M-I/4FB support secure boot, and how is it implemented?

Yes, the SAM9X60D5M-I/4FB supports secure boot via a 64-Kbyte ROM-embedded bootloader that validates firmware signatures before execution. Boot source selection (NAND, SD, SPI/QSPI Flash) is controlled by OTP bits, and the bootloader includes NAND BCH ECC table support for reliable flash reads. The 11-Kbyte OTP memory stores cryptographic keys used for signature verification and secure key provisioning.

What are the thermal specifications for the SAM9X60D5M-I/4FB?

The SAM9X60D5M-I/4FB is rated for an ambient operating temperature range of -40°C to +85°C and a junction temperature range of -40°C to +125°C. Its TFBGA233 package features optimized power/ground ball assignment to facilitate effective thermal dissipation and decoupling capacitor placement, supporting reliable operation in industrial enclosures without forced airflow.

Can the SAM9X60D5M-I/4FB interface with both DDR2 and SDR-SDRAM memories?

No-the SAM9X60D5M-I/4FB is specifically configured with 512-Mbit DDR2-SDRAM and is not compatible with SDR-SDRAM. The memory interface is hardwired to DDR2 timing and electrical requirements (1.8 V, SSTL_18, DLL, differential clocks). For SDR-SDRAM support, the SAM9X60D6K-I/4FB variant (TFBGA196, 3.3 V) must be selected instead.

What peripheral interfaces are available on the SAM9X60D5M-I/4FB for industrial connectivity?

The SAM9X60D5M-I/4FB provides dual 10/100 Ethernet MACs (MII/RMII), two CAN 2.0B controllers, 13 configurable FLEXCOMs (USART/SPI/TWI), a 12-bit 12-channel ADC with touchscreen support, and a 24-bit RGB LCD controller. These interfaces enable direct connection to industrial sensors, HMIs, fieldbuses, and wired networks without external bridge ICs.

SAM9X60D5M-I/4FB Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Package/Case:
233-TFBGA
Series:
SAM9X60
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
-
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
SATA:
-
USB:
USB 2.0 (3)
Voltage - I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Supplier Device Package:
233-TFBGA (14x14)
Additional Interfaces:
-

SAM9X60D5M-I/4FB FAQ

1.How can I place an order for SAM9X60D5M-I/4FB through Aetrix?

Please submit a Request for Quotation (RFQ) for SAM9X60D5M-I/4FB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SAM9X60D5M-I/4FB reliable?

The price and inventory of SAM9X60D5M-I/4FB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SAM9X60D5M-I/4FB is usually 5 days.

3.What payment methods are accepted for SAM9X60D5M-I/4FB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SAM9X60D5M-I/4FB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SAM9X60D5M-I/4FB?

SAM9X60D5M-I/4FB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SAM9X60D5M-I/4FB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SAM9X60D5M-I/4FB?

For technical support, including SAM9X60D5M-I/4FB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SAM9X60D5M-I/4FB requirements.

6.How does Aetrix verify that SAM9X60D5M-I/4FB is sourced from the original manufacturer or authorized distributors?

All SAM9X60D5M-I/4FB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SAM9X60D5M-I/4FB meets industry standards.

7.What is the process for return or replacement of SAM9X60D5M-I/4FB?

All SAM9X60D5M-I/4FB units undergo pre-shipment inspection (PSI). If there is an issue with SAM9X60D5M-I/4FB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SAM9X60D5M-I/4FB part is unused and in its original packaging.

Return procedure for SAM9X60D5M-I/4FB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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