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Vishay General Semiconductor - Diodes Division SBLB1040CTHE3_B/I
- Part No.:
- SBLB1040CTHE3_B/I
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- Diode Arrays
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SBLB1040CTHE3_B/I.pdf
- Description:
- DIODE ARR SCHOTT 40V 5A TO-263AB
- Quantity:
- Payment:
- Shipping:
Inventory:2,536
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Product details
Overview
SBLB1040CTHE3_B/I from Vishay General Semiconductor is a dual common-cathode Schottky rectifier in D2PAK (TO-263AB) package, rated for 40 V repetitive peak reverse voltage, 5 A average forward current per diode, and 0.55 V forward voltage at 5 A. It delivers high-frequency rectification with low power loss in DC/DC converters and switching-mode power supplies.
For engineers reviewing the SBLB1040CTHE3_B/I datasheet, SBLB1040CTHE3_B/I pinout, SBLB1040CTHE3_B/I application, or SBLB1040CTHE3_B/I equivalent, key selection criteria include its 175 A peak surge capability, 125 °C max junction temperature, thermal resistance of 3.0 °C/W per diode, and AEC-Q101 qualification eligibility in D2PAK configuration.
Technical Context
This dual-diode Schottky rectifier integrates two independent anodes sharing a common cathode terminal, enabling synchronous freewheeling or dual-output rectification in compact topologies. Its guardring structure provides overvoltage protection, and the low VF supports high-efficiency operation at switching frequencies up to several hundred kHz.
The device operates within -40 °C to +125 °C junction temperature range and exhibits 0.5 mA reverse leakage at 25 °C and rated VR, rising to 50 mA at 100 °C - critical for thermal design in enclosed power stages. Thermal resistance RθJC = 3.0 °C/W per diode enables predictable heatsink sizing when mounted on PCB copper planes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 40 V - maximum repetitive reverse blocking voltage; defines safe operating limit in buck converter freewheel paths. |
| IF(AV) per diode | 5.0 A - continuous forward current rating per anode at TC = 107 °C; determines steady-state conduction loss in 12 V or 5 V output rails. |
| VF @ 5 A | 0.55 V - forward voltage drop at rated DC current; directly sets conduction loss (P = I × V) and thermal load per diode. |
| IFSM | 175 A - non-repetitive surge current capability (8.3 ms half-sine); supports inrush and transient overload handling without failure. |
| RθJC | 3.0 °C/W - thermal resistance from junction to case per diode; enables accurate junction temperature estimation when heatsink or PCB copper area is known. |
| TJ max. | 125 °C - maximum allowable junction temperature; constrains ambient and thermal design margin in sealed or high-ambient environments. |
Pinout & Package
Package: D2PAK (TO-263AB), surface-mount, single-row 3-terminal outline with exposed cathode pad for thermal and electrical connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIN 1 | Anode 1 (A1) | Input terminal for first Schottky diode; connects to switch node in synchronous rectifier or input rail in polarity protection. |
| PIN 2 | Heatsink / Cathode (K) | Common cathode and thermal pad; electrically tied to both diodes' cathodes and serves as primary thermal path to PCB copper. |
| PIN 3 | Anode 2 (A2) | Input terminal for second Schottky diode; enables dual-channel rectification or independent freewheeling paths. |
Key Features
| Feature | Design Value |
|---|---|
| Guardring overvoltage protection | Enhances ruggedness against voltage transients in automotive and industrial DC/DC inputs without external clamping. |
| Low VF (0.55 V @ 5 A) | Reduces conduction losses by ~30 % vs. comparable silicon diodes, improving efficiency in 5–12 V output stages. |
| High IFSM (175 A) | Withstands repeated startup surges and short-circuit events in 48 V battery-fed converters without degradation. |
| MSL Level 1 (245 °C peak) | Enables standard reflow soldering without moisture-related delamination risk; eliminates baking requirement pre-assembly. |
Applications
| Automotive DC/DC Converter | Industrial SMPS Secondary Rectification |
|---|---|
Use Scenario: 12 V to 5 V step-down conversion in vehicle infotainment power modules. IC Role / Device Role / Timing Role: Dual-anode Schottky rectifier providing synchronous freewheeling and output rectification. Use Value: Low VF minimizes heat generation in confined under-dash enclosures; AEC-Q101-compatible variants support qualification requirements. |
Use Scenario: Secondary-side rectification in 24 V input, 3.3 V/5 V isolated flyback supplies for PLC I/O modules. IC Role / Device Role / Timing Role: Common-cathode dual diode enabling compact layout for dual-rail outputs or redundancy. Use Value: 175 A IFSM handles load dump transients; TO-263AB thermal pad ensures stable operation at 60 °C ambient. |
| USB-C PD Power Path | Polarity Protection Circuit |
Use Scenario: Input rectification and reverse-current blocking in 20 V/3 A USB-C PD adapter secondary stage. IC Role / Device Role / Timing Role: Dual Schottky configured as OR-ing diode pair for redundant input paths. Use Value: 0.55 V VF reduces voltage drop across protection path, preserving tight 20 V ±5 % regulation tolerance. |
Use Scenario: Reverse-polarity protection for 12 V battery-powered edge sensor nodes. IC Role / Device Role / Timing Role: Anode-connected to supply, cathode to load - blocks reverse current while conducting forward. Use Value: Guardring structure prevents breakdown during accidental -12 V connection; low IR limits standby leakage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay SBLB1040CT-M3/I | Same die, halogen-free RoHS-compliant variant; identical electrical specs and D2PAK package. | No functional difference; selected where halogen-free compliance is mandated by OEM procurement policy. | Direct material substitution if halogen-free certification is required; same thermal and electrical behavior. |
| ON Semiconductor SB1040-T3 | Single-diode TO-220AB version; 40 V VRRM, 10 A IF(AV) total, VF = 0.55 V @ 5 A, but no common-cathode dual configuration. | Requires two devices and additional layout area to replicate dual-anode functionality; lacks integrated cathode thermal plane. | Use only when dual-anode integration is not needed and board space permits discrete placement; not a drop-in replacement. |
Compared with SBLB1040CTHE3_B/I, the M3/I variant offers identical performance with halogen-free compliance, while SB1040-T3 requires redesign to accommodate separate anodes and lacks the optimized D2PAK thermal interface - making SBLB1040CTHE3_B/I preferable for space-constrained, thermally demanding dual-rail designs.
Availability
SBLB1040CTHE3_B/I is available at Aetrix Electronics and suitable for automotive DC/DC converters, industrial SMPS secondary rectification, and USB-C PD power path designs requiring stable component supply, consistent thermal performance, and long-term manufacturability.
Supply support for SBLB1040CTHE3_B/I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, MOSFETs, and optoelectronics with emphasis on reliability, power efficiency, and automotive-grade qualification.
The SBLB1040CTHE3_B/I belongs to Vishay's SBLx series of dual common-cathode Schottky rectifiers, engineered for high-efficiency, high-reliability rectification in space-constrained power conversion systems.
FAQ
What is the maximum junction temperature rating for SBLB1040CTHE3_B/I?
The SBLB1040CTHE3_B/I has a maximum junction temperature (TJ max.) of +125 °C, as specified in the Vishay datasheet. This rating applies under continuous operation with proper thermal management via the D2PAK exposed cathode pad. Exceeding this temperature risks parametric shift and accelerated degradation. Derating curves in the datasheet show usable current decreases above TC = 107 °C, and thermal design must ensure TJ remains ≤125 °C under worst-case ambient and power dissipation conditions for SBLB1040CTHE3_B/I.
Is SBLB1040CTHE3_B/I AEC-Q101 qualified?
SBLB1040CTHE3_B/I is not AEC-Q101 qualified. The datasheet specifies that AEC-Q101 qualification applies only to variants with the HM3 suffix (e.g., SBLB1040CTHM3/I) in D2PAK package. SBLB1040CTHE3_B/I carries the E3 suffix, indicating RoHS-compliant commercial grade with no automotive qualification. For automotive applications requiring AEC-Q101, the HM3 variant must be selected - SBLB1040CTHE3_B/I does not meet those stress-test requirements.
What is the pin configuration and polarity marking for SBLB1040CTHE3_B/I?
SBLB1040CTHE3_B/I uses a 3-pin D2PAK (TO-263AB) package with PIN 1 = Anode 1, PIN 2 = Common Cathode/Heatsink, and PIN 3 = Anode 2. Polarity is marked on the top surface: "K" adjacent to PIN 2 confirms the cathode terminal. The exposed metal pad on the underside is electrically and thermally connected to PIN 2. This configuration enables dual independent forward paths sharing one cathode return - essential for compact dual-output or OR-ing layouts in SBLB1040CTHE3_B/I implementations.
How does the guardring feature benefit SBLB1040CTHE3_B/I in real-world use?
The guardring in SBLB1040CTHE3_B/I improves edge termination robustness, raising the effective breakdown voltage margin during voltage transients. In practice, this allows SBLB1040CTHE3_B/I to withstand brief overvoltage events - such as load dump spikes in automotive 12 V systems or inductive kickback in industrial solenoid drivers - without avalanche failure or parameter drift. It eliminates need for external TVS clamping in many mid-tier applications, reducing BOM count and layout complexity while maintaining reliability in SBLB1040CTHE3_B/I deployments.
What is the thermal resistance (RθJC) of SBLB1040CTHE3_B/I, and how is it measured?
The thermal resistance from junction to case (RθJC) for SBLB1040CTHE3_B/I is 3.0 °C/W per diode, measured with the device mounted on a standard FR-4 PCB using 1 in² (6.45 cm²) of 2 oz copper connected to the cathode pad (PIN 2). This value reflects heat flow from each diode's active region through the silicon die, bond wires, and package substrate into the exposed cathode metal. Accurate thermal modeling of SBLB1040CTHE3_B/I requires using this per-diode value - not total - since both diodes share the same case but operate independently.
SBLB1040CTHE3_B/I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io) (per Diode):
- 5A
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 40 V
- Operating Temperature - Junction:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB
SBLB1040CTHE3_B/I FAQ
1.How can I place an order for SBLB1040CTHE3_B/I through Aetrix?
Please submit a Request for Quotation (RFQ) for SBLB1040CTHE3_B/I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SBLB1040CTHE3_B/I reliable?
The price and inventory of SBLB1040CTHE3_B/I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SBLB1040CTHE3_B/I is usually 5 days.
3.What payment methods are accepted for SBLB1040CTHE3_B/I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SBLB1040CTHE3_B/I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SBLB1040CTHE3_B/I?
SBLB1040CTHE3_B/I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SBLB1040CTHE3_B/I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SBLB1040CTHE3_B/I?
For technical support, including SBLB1040CTHE3_B/I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SBLB1040CTHE3_B/I requirements.
6.How does Aetrix verify that SBLB1040CTHE3_B/I is sourced from the original manufacturer or authorized distributors?
All SBLB1040CTHE3_B/I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SBLB1040CTHE3_B/I meets industry standards.
7.What is the process for return or replacement of SBLB1040CTHE3_B/I?
All SBLB1040CTHE3_B/I units undergo pre-shipment inspection (PSI). If there is an issue with SBLB1040CTHE3_B/I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SBLB1040CTHE3_B/I part is unused and in its original packaging.
Return procedure for SBLB1040CTHE3_B/I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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