NXP Semiconductors SE97BTP,547
- Part No.:
- SE97BTP,547
- Manufacturer:
- NXP Semiconductors
- Category:
- Thermal Management
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
SE97BTP,547.pdf
- Description:
- IC TEMP SENSOR DIMM 8HWSON
- Quantity:
- Payment:

- Shipping:

Inventory:104,389
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Product details
Overview
SE97BTP,547 from NXP Semiconductors is a JEDEC JC-42.4-compliant DDR memory module temperature sensor with integrated 256-byte SPD EEPROM, delivering ±1 °C max accuracy in the +75 °C to +95 °C critical zone, 11-bit ΔΣ ADC resolution of 0.125 °C, and I²C/SMBus interface up to 400 kHz - deployed on DDR3 DIMMs for real-time DRAM thermal monitoring and vendor data storage.
For engineers reviewing the SE97BTP,547 datasheet, SE97BTP,547 pinout, SE97BTP,547 application, or SE97BTP,547 equivalent, this page delivers verified thermal sensing accuracy, EVENT output configuration options (comparator/interrupt/critical-only), SMBus TIMEOUT and ALERT support, EEPROM write protection modes, and HWSON8 package integration details essential for DIMM design compliance and system-level thermal management.
Technical Context
The SE97BTP,547 integrates a local temperature sensor and 256-byte EEPROM on a single die, sharing an I²C/SMBus interface with programmable slave addresses (A0–A2) supporting up to eight devices per bus. Its 11-bit ΔΣ ADC updates temperature readings at ≥8 Hz (125 ms conversion period), latching results into a 16-bit temperature register with MSB-first transmission.
Thermal event signaling uses an open-drain EVENT pin configurable as active-HIGH/LOW comparator output or microprocessor interrupt, with independent upper/lower alarm and critical trip thresholds (02h–04h registers), hysteresis (0–6 °C), and SMBus TIMEOUT (25–35 ms). The EEPROM supports permanent/reversible software write protection for lower 128 bytes (00h–7Fh), while upper 128 bytes (80h–FFh) remain freely writable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temp Range | −40 °C to +125 °C operating range; ±1 °C max error between +75 °C and +95 °C per JEDEC Grade B. |
| ADC Resolution | 0.125 °C (11-bit ΔΣ), enabling fine-grained thermal control for DDR3 memory throttling decisions. |
| I²C/SMBus Speed | Up to 400 kHz Fast-mode; SMBus TIMEOUT (25–35 ms) prevents bus lock-up during host faults. |
| Supply Voltage | 3.0 V to 3.6 V; EEPROM read functional down to 1.7 V, supporting low-voltage DIMM power sequencing. |
| EVENT Output | Open-drain, 0.9–3.6 V pull-up compatible; supports comparator, interrupt, or critical-only modes with polarity selection. |
| EEPROM Endurance | 100,000 write/erase cycles and 10-year data retention; lower 128 bytes support permanent/reversible software write protect. |
| Shutdown Current | 0.1 μA typical; enables ultra-low-power thermal monitoring during DIMM standby states. |
Pinout & Package
SE97BTP,547 is housed in a 2 mm × 3 mm × 0.8 mm HWSON8 (SOT1069-2) thermally enhanced thin-outline package with exposed pad for improved heat dissipation on DDR modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0 | I²C slave address bit 0 | Internal pull-down; 10 V tolerant for reversible software write protection activation. |
| A1 | I²C slave address bit 1 | Internal pull-down; sets device address alongside A0/A2 for multi-sensor DIMM configurations. |
| A2 | I²C slave address bit 2 | Internal pull-down; enables up to eight SE97BTP,547 units on one I²C bus without address conflict. |
| VSS | Ground reference | System ground return path; must be low-impedance for stable ADC and EEPROM operation. |
| SDA | I²C bidirectional data line | Open-drain I/O requiring external pull-up; transmits temperature data, EEPROM contents, and config registers. |
| SCL | I²C clock input | Open-drain input requiring external pull-up; synchronizes all serial transfers including SMBus ALERT responses. |
| EVENT | Thermal alarm output | Open-drain output asserting on over/under/critical temperature events; polarity and mode fully software-configurable. |
| VDD | Power supply | 3.0–3.6 V supply; powers both temperature sensor and EEPROM; POR triggers at 1.8 V typical. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC JC-42.4 Compliance | Fully meets DDR3 DIMM thermal sensor specification, replacing legacy SPD functions with integrated sensing and storage. |
| Single-Die Integration | Monolithic construction of sensor + EEPROM improves reliability and reduces board space vs. discrete solutions. |
| Configurable EVENT Modes | Three operational modes - comparator (thermostat), interrupt (microprocessor alert), or critical-only - reduce firmware complexity. |
| SMBus ALERT Support | Enables multi-device interrupt arbitration via Alert Response Address (ARA), simplifying host polling in dense DIMM systems. |
| EEPROM Write Protection | Software-selectable permanent (PWP) or reversible (RWP) protection for lower 128 bytes ensures vendor SPD data integrity. |
Applications
| DDR3 Memory Modules | Laptop Thermal Management |
|---|---|
Use Scenario: Mounted directly on DDR3 DIMMs to monitor DRAM junction temperature in real time. IC Role / Device Role / Timing Role: JEDEC-compliant thermal sensor and SPD EEPROM replacement, providing temperature data and module identification to memory controller. Use Value: Enables dynamic memory throttling and prevents thermal runaway by triggering system-level cooling or frequency scaling when thresholds are exceeded. | Use Scenario: Integrated into laptop motherboard DIMM slots to track memory temperature under sustained CPU/GPU load. IC Role / Device Role / Timing Role: Local temperature sensor feeding thermal management firmware; EVENT pin signals host processor on critical excursions. Use Value: Supports fan speed ramping and OS-level thermal warnings before DRAM reaches JEDEC-defined safe limits. |
| Enterprise Server DIMMs | Network Equipment Memory Banks |
Use Scenario: Deployed across dual-rank DDR3 RDIMMs in rack-mounted servers for predictive thermal analytics. IC Role / Device Role / Timing Role: High-accuracy temperature node feeding BMC/IPMI subsystems; EEPROM stores vendor-part-number and timing parameters. Use Value: Enables server health monitoring dashboards and automated maintenance alerts based on cumulative thermal stress metrics. | Use Scenario: Used in telecom switches and routers with high-density DDR3 memory banks operating in elevated ambient temperatures. IC Role / Device Role / Timing Role: Critical temperature monitor with SMBus TIMEOUT and ALERT ensuring robust communication in noisy backplane environments. Use Value: Prevents uncontrolled reboots by detecting localized hotspots before memory controller ECC errors escalate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR memory module temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SE98BTP,547 | Thermal sensor only (no EEPROM); identical temp accuracy, pinout, and I²C interface; lacks SPD functionality. | Used where SPD data storage is handled externally or not required; lower BOM cost but requires separate EEPROM. | Select when DIMM design separates sensing and SPD functions or when EEPROM capacity exceeds requirements. |
| LM75BIMM/NOPB | Standalone temperature sensor (no EEPROM); ±2 °C max accuracy over −40 °C to +125 °C; no SMBus TIMEOUT or ALERT; 0.5 °C resolution. | General-purpose thermal monitoring; not JEDEC JC-42.4 compliant; unsuitable for DDR3 SPD replacement. | Choose only for non-JEDEC applications needing basic temperature readouts without memory or advanced event signaling. |
Compared with SE97BTP,547, SE98BTP,547 removes EEPROM to reduce cost and complexity where SPD is unnecessary, while LM75BIMM/NOPB offers broader industrial temperature range but lacks JEDEC compliance, EEPROM, and SMBus features critical for DDR3 DIMM integration.
Availability
SE97BTP,547 is available at Aetrix Electronics and suitable for DDR3 memory modules, enterprise servers, and network equipment requiring stable component supply, JEDEC-compliant thermal monitoring, and integrated SPD EEPROM functionality.
Supply support for SE97BTP,547 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and communications markets, with leadership in embedded processing and analog technologies.
The SE97BTP,547 belongs to NXP's JEDEC-compliant thermal sensor product line, designed specifically to meet DDR3 DIMM memory module requirements for integrated temperature sensing and Serial Presence Detect functionality.
FAQ
What is the primary function of the SE97BTP,547 in DDR3 memory modules?
The SE97BTP,547 serves as a JEDEC JC-42.4-compliant thermal sensor and integrated Serial Presence Detect (SPD) EEPROM for DDR3 DIMMs. It continuously monitors DRAM temperature with ±1 °C max accuracy in the critical +75 °C to +95 °C range while storing vendor-specific memory module data in its 256-byte EEPROM. This dual functionality replaces discrete sensor + EEPROM solutions, reducing component count and ensuring compliance with industry thermal management standards for DDR3 systems.
Does the SE97BTP,547 support SMBus TIMEOUT and ALERT features?
Yes, the SE97BTP,547 supports both SMBus TIMEOUT (programmable 25–35 ms) and SMBus ALERT Response Address (ARA). TIMEOUT prevents system lock-ups if the host holds SCL low too long, while ALERT enables multi-device interrupt arbitration on shared buses. These features are enabled by default in the SMBUS register and can be disabled or configured via I²C writes. The SE97BTP,547 responds to ARA only in Interrupt mode with active-LOW EVENT polarity, making it suitable for complex server and networking platforms requiring coordinated thermal event handling.
How is EEPROM write protection implemented in the SE97BTP,547?
The SE97BTP,547 implements two-tier EEPROM write protection: the lower 128 bytes (00h–7Fh) support Permanent Write Protect (PWP) or Reversible Write Protect (RWP) via software commands, safeguarding critical SPD data like vendor ID and memory timings. The upper 128 bytes (80h–FFh) remain unprotected for general-purpose use. RWP activation requires driving the A0 pin above 7.0 V to enter reversible protection mode, while PWP is irreversible and locks the region permanently. This architecture ensures DRAM module identity and configuration integrity while allowing field-updatable application data storage.
What are the key differences between SE97BTP,547 and SE98BTP,547?
The SE97BTP,547 integrates both a temperature sensor and 256-byte EEPROM in one die, whereas the SE98BTP,547 contains only the thermal sensor with identical accuracy, resolution, and I²C interface but no EEPROM. Both share the same HWSON8 package, pinout, and JEDEC JC-42.4 compliance. The SE97BTP,547 is used where SPD data storage is required on-die; the SE98BTP,547 is selected when SPD is handled externally or omitted entirely, reducing cost and power consumption while retaining full thermal monitoring capability.
Can the EVENT output of the SE97BTP,547 be configured for different thermal response behaviors?
Yes, the EVENT output of the SE97BTP,547 is fully configurable via the Configuration register (01h). It supports three distinct modes: Comparator mode (continuous assertion outside alarm window), Interrupt mode (edge-triggered assertion on threshold crossing, clearable via register bit), and Critical-only mode (assertion only at TCRIT). Polarity (active-HIGH/LOW), hysteresis (0–6 °C), and lockability of alarm bands are also software-selectable. This flexibility allows the SE97BTP,547 to serve as either a simple thermostat output or a precise microprocessor interrupt source depending on system architecture requirements.
SE97BTP,547 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Temp Monitoring System (Sensor), DIMM DDR Memory
- Sensor Type:
- Internal
- Sensing Temperature:
- -40°C ~ 125°C
- Accuracy:
- ±3°C(Max)
- Topology:
- ADC (Sigma Delta), Comparator, Register Bank
- Output Type:
- I2C/SMBus
- Output Alarm:
- Yes
- Output Fan:
- Yes
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-HWSON (2x3)
SE97BTP,547 FAQ
1.How can I place an order for SE97BTP,547 through Aetrix?
Please submit a Request for Quotation (RFQ) for SE97BTP,547 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SE97BTP,547 reliable?
The price and inventory of SE97BTP,547 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SE97BTP,547 is usually 5 days.
3.What payment methods are accepted for SE97BTP,547?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SE97BTP,547 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SE97BTP,547?
SE97BTP,547 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SE97BTP,547 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SE97BTP,547?
For technical support, including SE97BTP,547 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SE97BTP,547 requirements.
6.How does Aetrix verify that SE97BTP,547 is sourced from the original manufacturer or authorized distributors?
All SE97BTP,547 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SE97BTP,547 meets industry standards.
7.What is the process for return or replacement of SE97BTP,547?
All SE97BTP,547 units undergo pre-shipment inspection (PSI). If there is an issue with SE97BTP,547, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SE97BTP,547 part is unused and in its original packaging.
Return procedure for SE97BTP,547:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SE97BTP,547 Tags

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EMC2101-ACZL-TR
Microchip Technology

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MCP9844T-BE/MNY
Microchip Technology

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EMC2101-R-ACZL-TR
Microchip Technology

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MCP98244T-BE/MNY
Microchip Technology

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TC670ECHTR
Microchip Technology
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SE98ATP,547
NXP Semiconductors

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AMC6821SDBQR
Texas Instruments

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MAX6604AATA+T
Analog Devices Inc./Maxim Integrated

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ADT7475ARQZ-REEL
onsemi

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MAX6643LBBAEE+
Analog Devices Inc./Maxim Integrated
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MAX6684ESA+T
Analog Devices Inc./Maxim Integrated

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MAX6639AEE+
Analog Devices Inc./Maxim Integrated
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