NXP Semiconductors SE97TK,118

Overview

SE97TK,118 from NXP Semiconductors is a JEDEC JC-42.4-compliant DDR memory module temperature sensor with integrated 256-byte SPD EEPROM, operating from −40 °C to +125 °C with ±1 °C max accuracy between +75 °C and +95 °C, 11-bit ΔΣ ADC resolution (0.125 °C), and I²C/SMBus interface - deployed on SO-DIMM/RDIMM modules for DRAM case temperature estimation and thermal throttling control in thin-and-light notebooks.

For engineers reviewing the SE97TK,118 datasheet, SE97TK,118 pinout, SE97TK,118 application, or SE97TK,118 equivalent, key selection considerations include JEDEC Grade B thermal accuracy, programmable EVENT output polarity and hysteresis, dual-function EEPROM (PWP/RWP protection), SMBus TIMEOUT/ALERT support, and HVSON8 package compatibility with DDR3 RDIMM ECC and mobile platform memory modules.

Technical Context

The SE97TK,118 integrates a local temperature sensor and 256-byte serial EEPROM on a single die, sharing I²C/SMBus (0–400 kHz) with separate slave addresses (0x30 for temp sensor, 0x50 for EEPROM normal access, 0x30 for software write protect). Its 11-bit ΔΣ ADC performs conversions every 125 ms (8 Hz), latching results into a 16-bit temperature register with MSB-first data transfer.

Three address pins (A0–A2) enable up to eight devices per bus; A0 supports overvoltage-tolerant (10 V) software write protection. The open-drain EVENT output is configurable as active-HIGH/LOW comparator or interrupt, with independent critical/upper/lower trip points, hysteresis (0/1.5/3/6 °C), and lockable alarm bands - all controlled via a dedicated configuration register.

Key Specifications

Pinout & Package

SE97TK,118 uses the HVSON8 (SOT908-1) package: 3 mm × 3 mm × 0.85 mm, no leads, 8-terminal thermal-enhanced plastic body optimized for DIMM surface mounting and heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature-sensing-with-SPD applications.

Compared with SE97TK,118, SE97PW,118 offers mechanical compatibility at the cost of thermal performance, while SE97TP,118 delivers superior package miniaturization and drive capability - making SE97TK,118 the balanced choice for mainstream DDR3 RDIMM/ECC deployments where thermal enhancement and footprint efficiency are both critical.

Availability

SE97TK,118 is available at Aetrix Electronics and suitable for DDR3 RDIMM thermal monitoring, laptop DRAM throttling control, and enterprise server memory modules requiring stable component supply, JEDEC-compliant accuracy, and long-term SPD data integrity.

Supply support for SE97TK,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communication infrastructure markets.

The SE97TK,118 belongs to NXP's JEDEC-compliant memory interface sensor family, designed specifically to meet JC-42.4 Mobile Platform Memory Module Temperature Sensor requirements for DDR2/DDR3 DIMMs with integrated SPD functionality.

FAQ

What is the primary application of the SE97TK,118?

The SE97TK,118 is primarily used as a JEDEC JC-42.4-compliant temperature sensor and SPD EEPROM on DDR3 RDIMM and SO-DIMM modules. It measures local DRAM temperature to enable accurate thermal throttling, replaces legacy SPD-only EEPROMs, and supports dynamic memory refresh scaling - all within a single HVSON8 package. Its design targets thin-and-light notebooks and enterprise servers requiring reliable, standards-aligned thermal management.

Does the SE97TK,118 support SMBus TIMEOUT and ALERT functions?

Yes, the SE97TK,118 fully supports SMBus TIMEOUT (default enabled, resets internal state if SCL held low 25–35 ms) and SMBus ALERT Response Address (ARA = 0x0C, default ON). These features prevent system lockups and allow multiple SE97TK,118 devices on one bus to share an interrupt line via wire-AND arbitration - critical for multi-DIMM platforms where bus resource efficiency matters.

How is EEPROM write protection implemented on the SE97TK,118?

The SE97TK,118 implements two-tier EEPROM write protection: the lower 128 bytes (00h–7Fh) support Permanent Write Protect (PWP) or Reversible Write Protect (RWP) via software command, securing SPD vendor data; the upper 128 bytes (80h–FFh) remain unprotected for runtime telemetry. A0 pin overvoltage tolerance (10 V) enables RWP activation without hardware modification - a feature confirmed in the official NXP SE97 datasheet Rev. 07.

What are the key differences between SE97TK,118 and SE97TP,118?

The SE97TK,118 uses HVSON8 (3 mm × 3 mm × 0.85 mm), while SE97TP,118 uses HWSON8 (2 mm × 3 mm × 0.8 mm) with improved VPOR/EVENT IOL drive strength. Both share identical register maps, thermal specs, and JEDEC compliance. SE97TP,118 is preferred for ultra-thin DIMMs needing minimal height and stronger interrupt signaling; SE97TK,118 balances thermal performance and manufacturability for mainstream DDR3 RDIMM applications.

Can the SE97TK,118 operate with VDD below 3.0 V?

Yes - the SE97TK,118 operates with VDD from 3.0 V to 3.6 V for full functionality (temperature sensing and EEPROM read/write), but EEPROM read operations remain functional down to 1.7 V. This allows SPD data retrieval during low-power or brown-out conditions while preserving thermal monitoring capability only above 3.0 V, as specified in the NXP SE97 product data sheet Rev. 07.