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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Thermal Management

NXP Semiconductors SE97TP,147

Name: SE97TP,147
Brand: NXP Semiconductors
SKU: SE97TP,147
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SE97TP,147

Manufacturer:: NXP Semiconductors

Category:: Thermal Management

Package:: 8-WFDFN Exposed Pad

Datasheet:: SE97TP,147.pdf

Description:: IC TEMP SENSOR DIMM 3.3V 8-HWSON

Quantity:: RFQ Add To RFQ list

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Product details

Overview

SE97TP,147 from NXP Semiconductors is a JEDEC JC-42.4-compliant DDR memory module temperature sensor with integrated 256-byte SPD EEPROM, operating from −40 °C to +125 °C with ±1 °C (max) accuracy between +75 °C and +95 °C, 11-bit ΔΣ ADC resolution of 0.125 °C, and I²C/SMBus interface - deployed directly on SO-DIMM/UDIMM modules for DRAM case temperature estimation and thermal throttling control in thin-and-light notebooks.

For engineers reviewing the SE97TP,147 datasheet, SE97TP,147 pinout, SE97TP,147 application, or SE97TP,147 equivalent, this page delivers verified JEDEC-grade thermal sensing specs, HWSON8 package details, EVENT output configuration modes, EEPROM write-protection behavior, and DIMM-specific register initialization requirements - all confirmed against NXP's Rev. 07 product data sheet.

Technical Context

The SE97TP,147 integrates a local temperature sensor and 256-byte serial EEPROM on a single die, sharing I²C/SMBus pins (SDA/SCL) and three address lines (A0–A2) to support up to eight devices per bus. Its 11-bit ΔΣ ADC performs conversions every 125 ms (8 Hz), latching results into a 16-bit temperature register with MSB-first transmission.

It implements three programmable alarm modes - comparator, interrupt, and critical-only - via CONFIG register bits, with independent hysteresis (0/1.5/3/6 °C), event polarity selection, and SMBus TIMEOUT/ALERT Response Address support. The EEPROM supports permanent/reversible software write protection for lower 128 bytes (00h–7Fh), while upper 128 bytes (80h–FFh) remain freely writable.

Key Specifications

Parameter	Value and Actual Design Meaning
Temperature Range	−40 °C to +125 °C; full-range operation enables DIMM thermal monitoring across industrial and mobile platforms.
Accuracy (B Grade)	±1 °C (max) from +75 °C to +95 °C; meets JEDEC JC-42.4 TSE 2002B3 specification for DDR3 RDIMM/ECC modules.
Resolution	0.125 °C (11-bit ΔΣ ADC); enables fine-grained thermal throttling decisions without external signal conditioning.
I²C/SMBus Speed	0 Hz to 400 kHz; supports Fast-mode I²C and SMBus 10–100 kHz, compatible with host controllers in DDR3/DDR2 memory subsystems.
EEPROM Endurance	100,000 write/erase cycles with 10-year data retention; sufficient for SPD programming during module manufacturing and field updates.
Supply Voltage	VDD = 3.0 V to 3.6 V (sensor & EEPROM write); EEPROM read functional down to 1.7 V - ensures SPD data accessibility during low-power states.
Shutdown Current	5.0 μA (max); minimizes standby power draw on memory modules where continuous sensing is not required.

Pinout & Package

SE97TP,147 is housed in an HWSON8 (SOT1069-1) package: 2 mm × 3 mm × 0.8 mm, thermally enhanced, no leads, 8-terminal surface-mount device compliant with JEDEC VCED-3 PSON8 standard.

Pin/Terminal	Circuit Role	Design Meaning
A0	I²C slave address bit 0	Internal pull-down; overvoltage tolerant to 10 V for software write protection activation - enables reversible EEPROM lock without hardware changes.
A1	I²C slave address bit 1	Internal pull-down; selects one of eight possible I²C addresses (0011xxx) on shared DIMM bus with other SE97 variants.
A2	I²C slave address bit 2	Internal pull-down; completes 3-bit address selection - allows coexistence of multiple SE97TP,147 sensors on same memory channel.
VSS	Ground reference	Device ground terminal; must be connected to DIMM substrate ground plane to ensure accurate thermal measurement and noise immunity.
SDA	I²C bidirectional data line	Open-drain I/O requiring external pull-up; transmits temperature data, EEPROM contents, and register reads/writes using MSB-first protocol.
SCL	I²C clock input	Open-drain input requiring external pull-up; synchronizes all SMBus transactions including ALERT response and TIMEOUT recovery.
EVENT	Configurable thermal alarm output	Open-drain output (0.9–3.6 V pull-up range); asserts for over/under/critical temperature events - used by chipset to trigger DRAM throttling or system shutdown.
VDD	Power supply	3.0–3.6 V main supply; powers both sensor and EEPROM; EEPROM read remains functional at 1.7 V for low-voltage SPD access.

Key Features

Feature	Design Value
JEDEC JC-42.4 Compliance	Guarantees interoperability with DDR3 RDIMM/ECC memory modules and compatibility with Intel Nehalem+ BIOS thermal management stacks.
Integrated SPD EEPROM	256-byte serial EEPROM with software write protection (PWP/RWP) for vendor ID, timing parameters, and module configuration - replaces discrete SPD ICs on DIMMs.
Configurable EVENT Output	Three operational modes (comparator/interrupt/critical-only), programmable polarity, and hysteresis options enable flexible integration with host interrupt controllers or analog thermostat circuits.
SMBus TIMEOUT Support	Resets internal state machine if SCL held low 25–35 ms - prevents bus lockup in noisy or fault-prone DIMM environments without requiring host-side watchdog intervention.
Single-Die Integration	Monolithic construction of sensor + EEPROM improves reliability vs. dual-chip solutions and eliminates inter-die thermal offset errors in DRAM temperature estimation.

Applications

DDR3 RDIMM Thermal Monitoring	Laptop SO-DIMM Throttling Control
Use Scenario: Mounted directly on DDR3 Registered DIMM PCB to measure local DRAM junction temperature under sustained memory bandwidth load. IC Role / Device Role / Timing Role: Local temperature sensor providing real-time Tcase estimate to chipset; replaces worst-case ambient-based throttling with dynamic, module-specific thermal feedback. Use Value: Enables up to 30% higher sustained memory bandwidth in thin-and-light notebooks by avoiding premature throttling based on motherboard ambient readings.	Use Scenario: Integrated into 1 GB or 2 GB SO-DIMM modules used in ultrabooks and compact workstations with limited cooling headroom. IC Role / Device Role / Timing Role: Dual-function component: temperature sensor for DRAM thermal management and SPD EEPROM for JEDEC-standardized module identification and timing parameter storage. Use Value: Eliminates need for separate SPD and thermal sensor ICs, reducing BOM count and PCB area while meeting DDR3 JEDEC JC-42.4 compliance requirements.
Server Memory Module SPD Replacement	Enterprise SSD Module Temperature Sensing
Use Scenario: Used in enterprise server RDIMMs where Serial Presence Detect data must be stored alongside real-time thermal telemetry for predictive failure analysis. IC Role / Device Role / Timing Role: SPD EEPROM (lower 128 bytes write-protected) + temperature sensor (upper registers) - provides both static configuration and dynamic thermal status over same I²C bus. Use Value: Allows server BMCs to correlate memory temperature trends with error logs and refresh rate adjustments, improving RAS capabilities without adding complexity.	Use Scenario: Embedded in high-density NVMe SSD modules where NAND flash and controller die temperatures must be monitored independently from system ambient. IC Role / Device Role / Timing Role: Local thermal sensor with configurable critical trip point (TCRIT) - triggers throttling or warning interrupts when SSD enclosure exceeds safe operating limits. Use Value: Supports JEDEC UFS/SSD thermal management profiles using industry-standard I²C interface and SMBus-compatible alert signaling.

DDR3 RDIMM Thermal Monitoring

Laptop SO-DIMM Throttling Control

Use Scenario: Mounted directly on DDR3 Registered DIMM PCB to measure local DRAM junction temperature under sustained memory bandwidth load.

IC Role / Device Role / Timing Role: Local temperature sensor providing real-time Tcase estimate to chipset; replaces worst-case ambient-based throttling with dynamic, module-specific thermal feedback.

Use Value: Enables up to 30% higher sustained memory bandwidth in thin-and-light notebooks by avoiding premature throttling based on motherboard ambient readings.

Use Scenario: Integrated into 1 GB or 2 GB SO-DIMM modules used in ultrabooks and compact workstations with limited cooling headroom.

IC Role / Device Role / Timing Role: Dual-function component: temperature sensor for DRAM thermal management and SPD EEPROM for JEDEC-standardized module identification and timing parameter storage.

Use Value: Eliminates need for separate SPD and thermal sensor ICs, reducing BOM count and PCB area while meeting DDR3 JEDEC JC-42.4 compliance requirements.

Server Memory Module SPD Replacement

Enterprise SSD Module Temperature Sensing

Use Scenario: Used in enterprise server RDIMMs where Serial Presence Detect data must be stored alongside real-time thermal telemetry for predictive failure analysis.

IC Role / Device Role / Timing Role: SPD EEPROM (lower 128 bytes write-protected) + temperature sensor (upper registers) - provides both static configuration and dynamic thermal status over same I²C bus.

Use Value: Allows server BMCs to correlate memory temperature trends with error logs and refresh rate adjustments, improving RAS capabilities without adding complexity.

Use Scenario: Embedded in high-density NVMe SSD modules where NAND flash and controller die temperatures must be monitored independently from system ambient.

IC Role / Device Role / Timing Role: Local thermal sensor with configurable critical trip point (TCRIT) - triggers throttling or warning interrupts when SSD enclosure exceeds safe operating limits.

Use Value: Supports JEDEC UFS/SSD thermal management profiles using industry-standard I²C interface and SMBus-compatible alert signaling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR memory module temperature sensing applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SE97TK,118	Uses HVSON8 (SOT908-1) package: 3 mm × 3 mm × 0.85 mm - larger footprint and higher thermal resistance than HWSON8.	Preferred for DIMMs with less stringent height constraints; same electrical specs and register map as SE97TP,147.	Select SE97TK,118 only if board layout requires larger thermal pad area or existing HVSON8 footprint reuse.
SE97TL,118	Uses HXSON8 (SOT1052-1): 2 mm × 3 mm × 0.5 mm - thinner than SE97TP,147 but lacks VPOR/EVENT IOL enhancement.	Targeted at ultra-thin modules where 0.8 mm max height is exceeded; shares same pinout but has lower EVENT sink current.	Choose SE97TL,118 only when mechanical stack-up mandates sub-0.8 mm profile and reduced EVENT drive strength is acceptable.

Compared with SE97TK,118 and SE97TL,118, the SE97TP,147 offers optimal balance of mechanical fit (2 × 3 × 0.8 mm), enhanced EVENT output drive capability, and JEDEC-compliant thermal accuracy - making it the preferred choice for new DDR3 SO-DIMM and RDIMM designs requiring strict height and performance alignment.

Availability

SE97TP,147 is available at Aetrix Electronics and suitable for DDR3 memory module manufacturing, laptop OEM thermal management systems, and enterprise server DIMM qualification requiring stable component supply, JEDEC-compliant temperature sensing, and integrated SPD EEPROM functionality.

Supply support for SE97TP,147 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communication infrastructure markets, with deep expertise in mixed-signal IC design and JEDEC standards implementation.

The SE97TP,147 belongs to NXP's JEDEC-compliant thermal sensor family designed specifically for DDR2/DDR3 memory module applications - emphasizing single-die integration, SMBus robustness, and seamless replacement of legacy SPD-only ICs with added thermal intelligence.

FAQ

What is the primary function of the SE97TP,147 in DDR memory modules?

The SE97TP,147 serves a dual role: it measures local DRAM temperature with ±1 °C accuracy (B grade) across −40 °C to +125 °C and stores JEDEC-standardized Serial Presence Detect (SPD) data in its 256-byte EEPROM. This enables real-time thermal throttling decisions and eliminates the need for separate SPD and temperature sensor ICs on DDR3 RDIMMs and SO-DIMMs.

Does the SE97TP,147 support SMBus TIMEOUT and ALERT functions?

Yes, the SE97TP,147 fully supports SMBus TIMEOUT (resetting internal state if SCL is held low 25–35 ms) and SMBus ALERT Response Address (ARA) in interrupt mode with active-low EVENT polarity. These features prevent bus lockups and allow multi-device interrupt arbitration - critical for reliable operation in dense DIMM environments.

How is EEPROM write protection implemented in the SE97TP,147?

The SE97TP,147 divides its 256-byte EEPROM into two 128-byte blocks: addresses 00h–7Fh support Permanent Write Protection (PWP) or Reversible Write Protection (RWP) via software command (using A0 > 7.8 V), while 80h–FFh remain freely writable. This allows DRAM vendor data to be locked while leaving space for runtime logging or calibration data.

What are the key differences between SE97TP,147 and SE97TL,118?

The SE97TP,147 uses HWSON8 (2 × 3 × 0.8 mm) packaging with enhanced VPOR/EVENT IOL, whereas SE97TL,118 uses thinner HXSON8 (2 × 3 × 0.5 mm) without that enhancement. Both share identical pinout and register mapping, but SE97TP,147 delivers higher EVENT sink current - essential for driving longer traces or multiple pull-ups on high-density DIMMs.

Can the SE97TP,147 operate with VDD below 3.0 V?

The SE97TP,147 requires 3.0–3.6 V for full operation (temperature sensing and EEPROM write), but its EEPROM supports read functionality down to 1.7 V. This allows SPD data retrieval during low-power states or brown-out conditions - however, temperature measurements and writes are disabled below 3.0 V.

SE97TP,147 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 8-WFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Function:: Temp Monitoring System (Sensor), DIMM DDR Memory

Sensor Type:: Internal

Sensing Temperature:: -40°C ~ 125°C

Accuracy:: ±3°C

Topology:: ADC (Sigma Delta), Comparator, Register Bank

Output Type:: 2-Wire Serial, I2C/SMBUS

Output Alarm:: Yes

Output Fan:: Yes

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-HWSON (2x3)

SE97TP,147 FAQ

1.How can I place an order for SE97TP,147 through Aetrix?

Please submit a Request for Quotation (RFQ) for SE97TP,147 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SE97TP,147 reliable?

The price and inventory of SE97TP,147 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SE97TP,147 is usually 5 days.

3.What payment methods are accepted for SE97TP,147?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SE97TP,147 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SE97TP,147?

SE97TP,147 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SE97TP,147 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SE97TP,147?

For technical support, including SE97TP,147 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SE97TP,147 requirements.

6.How does Aetrix verify that SE97TP,147 is sourced from the original manufacturer or authorized distributors?

All SE97TP,147 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SE97TP,147 meets industry standards.

7.What is the process for return or replacement of SE97TP,147?

All SE97TP,147 units undergo pre-shipment inspection (PSI). If there is an issue with SE97TP,147, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SE97TP,147 part is unused and in its original packaging.

Return procedure for SE97TP,147:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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