NXP Semiconductors SE97TP/S900,547

Overview

SE97TP/S900,547 from NXP Semiconductors is a JEDEC JC-42.4-compliant DDR memory module temperature sensor with integrated 256-byte SPD EEPROM, operating from −40 °C to +125 °C with ±1 °C max accuracy between +75 °C and +95 °C, 11-bit ΔΣ ADC resolution of 0.125 °C, and I²C/SMBus interface - deployed directly on SO-DIMM/UDIMM/RDIMM modules for DRAM case temperature estimation and thermal throttling control in thin-and-light notebooks.

For engineers reviewing the SE97TP/S900,547 datasheet, SE97TP/S900,547 pinout, SE97TP/S900,547 application, or SE97TP/S900,547 equivalent, key selection criteria include JEDEC Grade B thermal accuracy, HWSON8 (2 × 3 × 0.8 mm) package compatibility with DIMM space constraints, EVENT open-drain interrupt/comparator configurability, EEPROM write-protection architecture for SPD data integrity, and SMBus TIMEOUT/ALERT support for system-level bus robustness.

Technical Context

The SE97TP/S900,547 integrates a local temperature sensor and 256-byte serial EEPROM on a single die, sharing I²C/SMBus (0–400 kHz) with separate slave addresses (0x30–0x37 for temp sensor; 0x50–0x57 for EEPROM normal access; 0x30 for software protection). Its 11-bit ΔΣ ADC performs 8 Hz conversions (125 ms period), latching readings into a 16-bit temperature register updated 10×/second.

Three address pins (A0–A2) enable up to eight devices per bus; A0 is overvoltage-tolerant (10 V) to trigger reversible write protection. The EVENT output supports three modes - comparator (window-based), interrupt (edge-triggered), or critical-only - with programmable hysteresis (0/1.5/3/6 °C) and polarity, and remains asserted during shutdown if active at entry.

Key Specifications

Pinout & Package

SE97TP/S900,547 uses the HWSON8 package (JEDEC PSON8 VCED-3), measuring 2.0 × 3.0 × 0.8 mm, with no leads and 8 terminals - optimized for high-density DIMM mounting where height and footprint are constrained.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature-sensing-with-SPD applications.

Compared with SE97TP/S900,547, SE97TP/S900 offers identical functionality with regional manufacturing variance, while SE97TL delivers identical thermal/EEPROM performance in a thinner package - enabling mechanical optimization without firmware or layout changes beyond footprint clearance verification.

Availability

SE97TP/S900,547 is available at Aetrix Electronics and suitable for DDR3 RDIMM thermal management, laptop SO-DIMM dynamic throttling, and enterprise storage memory modules requiring stable component supply, JEDEC-compliant accuracy, and long-term SPD data integrity.

Supply support for SE97TP/S900,547 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in sensor signal conditioning and embedded interface IP.

The SE97TP/S900,547 belongs to NXP's JEDEC-compliant memory interface sensor family, designed specifically to meet JC-42.4 specifications for DDR2/DDR3 DIMM thermal monitoring and SPD replacement in high-volume computing platforms.

FAQ

What is the primary function of the SE97TP/S900,547 in DDR memory modules?

The SE97TP/S900,547 serves as a JEDEC JC-42.4-compliant temperature sensor and integrated 256-byte SPD EEPROM for DDR2/DDR3 memory modules. It measures local DRAM temperature with ±1 °C max accuracy between +75 °C and +95 °C and stores vendor-specific SPD data - enabling accurate thermal throttling and eliminating the need for separate SPD and temperature ICs on the DIMM.

Does the SE97TP/S900,547 support both I²C and SMBus protocols?

Yes, the SE97TP/S900,547 is fully compatible with both I²C-bus Standard-mode (0–100 kHz) and Fast-mode (0–400 kHz), as well as SMBus (10–100 kHz). It implements SMBus-specific features including TIMEOUT (25–35 ms), ALERT Response Address (ARA), and packet error checking - ensuring robust communication in multi-device server and notebook memory subsystems.

How does the EVENT output of the SE97TP/S900,547 behave in comparator versus interrupt mode?

In comparator mode, the EVENT output asserts when temperature crosses upper/lower boundaries or critical threshold and remains asserted until temperature re-enters the window or thresholds are reprogrammed. In interrupt mode, EVENT pulses on boundary crossing and must be cleared via CONFIG register bit CEVNT; it reasserts only on subsequent crossings - making it suitable for BIOS-driven thermal event logging rather than direct fan control.

What EEPROM protection mechanisms does the SE97TP/S900,547 provide for SPD data integrity?

The SE97TP/S900,547 provides two EEPROM protection layers: Permanent Write Protection (PWP) and Reversible Write Protection (RWP) for the lower 128 bytes (00h–7Fh), safeguarding vendor ID and timing data; the upper 128 bytes (80h–FFh) remain unprotected for general-purpose use. RWP is triggered by driving A0 >7.8 V, allowing field updates without soldering.

Is the SE97TP/S900,547 pin-compatible with other SE97 variants like SE97TL or SE97TK?

Yes, all SE97 variants - including SE97TP/S900,547 (HWSON8), SE97TL (HXSON8), SE97TK (HVSON8), and SE97PW (TSSOP8) - share identical pinout, register map, and electrical interface. Mechanical compatibility depends on package dimensions: SE97TP/S900,547 and SE97TL both use 2 × 3 mm footprints but differ in height (0.8 mm vs 0.5 mm), requiring layout review for clearance.