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NXP Semiconductors SE98APW,118

Part No.:
SE98APW,118
Manufacturer:
NXP Semiconductors
Category:
Thermal Management
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixSE98APW,118.pdf
Description:
IC TEMP SENSOR DDR 8-TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,375

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Product details

Overview

SE98APW,118 from NXP Semiconductors is a JEDEC JC-42.4-compliant digital temperature sensor optimized for DDR2/DDR3 memory module thermal monitoring, delivering ±0.5 °C (typ.) accuracy between +75 °C and +95 °C, 11-bit ΔΣ ADC with 0.125 °C resolution, and I²C/SMBus interface operating from 1.7 V to 3.6 V.

For engineers reviewing the SE98APW,118 datasheet, SE98APW,118 pinout, SE98APW,118 application, or SE98APW,118 equivalent, this page delivers verified JEDEC-grade thermal sensing specs, TSSOP8 pin mapping, EVENT output configuration options, and DIMM-specific register initialization guidance - all validated against NXP's Rev. 04 product data sheet.

Technical Context

The SE98APW,118 implements an on-chip 11-bit ΔΣ ADC that performs local temperature conversions at ≥8 Hz (125 ms period), latching results into a 16-bit Temperature Register (05h). Its SMBus/I²C interface supports 0–400 kHz operation with built-in TIMEOUT (25–35 ms) and ALERT functionality, and uses three address pins (A0–A2) to enable up to eight devices on one bus.

It features programmable EVENT output modes - comparator (window-based active-HIGH/LOW), interrupt (edge-triggered with software-clearable status), or critical-only - with user-selectable hysteresis (0 °C, 1.5 °C, 3 °C, 6 °C) and independent trip-point registers for Upper (02h), Lower (03h), and Critical (04h) thresholds, all defaulting to zero at power-up and requiring explicit initialization.

Key Specifications

Parameter Value and Actual Design Meaning
Temperature Range −40 °C to +125 °C operating range; ±1 °C max error over +40 °C to +125 °C per JEDEC Grade B.
Accuracy ±0.5 °C (typ.) / ±1 °C (max.) from +75 °C to +95 °C - meets JEDEC TS3000B1 DIMM specification.
Resolution 0.125 °C - derived from 11-bit ΔΣ ADC output mapped to 16-bit signed integer register format.
Supply Voltage 1.7 V to 3.6 V - enables direct integration into DDR module VDDQ rails without level-shifting.
Quiescent Current 250 μA (typ.) / 400 μA (max.) during active monitoring; 0.1 μA (typ.) in shutdown mode.
I²C/SMBus Speed 0 Hz to 400 kHz - supports Standard/Fast-mode I²C and full SMBus protocol including TIMEOUT and ALERT.
ESD Rating 2000 V HBM (JESD22-A114), 250 V MM (JESD22-A115), 1000 V CDM (JESD22-C101).

Pinout & Package

TSSOP8 package (SOT530-1), 4.4 mm body width, 0.65 mm pitch, lead-free and RoHS compliant.

Pin/Terminal Circuit Role Design Meaning
A0 I²C slave address bit 0 Input with internal pull-down; overvoltage tolerant to 10 V for SPD write protection; sets LSB of 7-bit address.
A1 I²C slave address bit 1 Input with internal pull-down; middle bit of 7-bit slave address; sampled at start of each bus access.
A2 I²C slave address bit 2 Input with internal pull-down; MSB of 7-bit slave address; enables up to eight devices on same bus.
VSS Ground reference Device ground return path; must be connected to system GND plane for accurate thermal measurement.
SDA Serial data I/O Open-drain bidirectional bus line; requires external pull-up resistor; supports I²C/SMBus read/write transactions.
SCL Serial clock input Open-drain clock input; driven by host controller; device samples A0–A2 and processes commands on falling edge.
EVENT Thermal alarm output Open-drain output configurable as active-HIGH/LOW comparator, interrupt, or critical-only signal; requires external pull-up (0.9–3.6 V).
VDD Power supply Primary supply rail (1.7–3.6 V); powers internal bandgap, ADC, and logic; decoupling capacitor required near pin.

Key Features

Feature Design Value
JEDEC JC-42.4 Compliance Guarantees ±0.5 °C (typ.) accuracy in +75 °C to +95 °C range - essential for DDR2/DDR3 DIMM thermal management compliance.
Configurable EVENT Output Three operational modes (comparator, interrupt, critical-only) with polarity selection and hysteresis control - enables flexible system-level thermal response.
Programmable Trip Registers Dedicated 16-bit registers for Upper (02h), Lower (03h), and Critical (04h) temperature thresholds - allows precise alarm window definition per platform requirements.
SMBus TIMEOUT & ALERT Hardware-enforced 25–35 ms SCL timeout prevents bus lockup; ALERT supports multi-device interrupt arbitration via ARA - improves system robustness.
Hot-Plug Ready I/O Open-drain SDA/EVENT and input-only SCL/A0–A2 pins with 50 ns noise filtering - ensures safe insertion/removal in live DIMM slots without bus contention.

Applications

DDR Memory Thermal Monitoring Laptop System Thermal Management

Use Scenario: Real-time DRAM junction temperature tracking on DDR2/DDR3 UDIMMs and RDIMMs to prevent thermal throttling or data corruption.

IC Role / Device Role / Timing Role: Local temperature sensor feeding thermal feedback to memory controller or baseboard management controller (BMC).

Use Value: Enables JEDEC-compliant thermal derating and dynamic refresh rate adjustment based on measured die temperature.

Use Scenario: Compact thermal sensing on laptop motherboard near CPU/GPU VRMs and memory banks to trigger fan speed control or throttle logic.

IC Role / Device Role / Timing Role: Secondary thermal monitor complementing integrated sensor arrays, providing high-accuracy localized readings.

Use Value: Delivers ±0.5 °C accuracy in critical +75 °C to +95 °C range where thermal runaway risk is highest - improving reliability margin.

Enterprise Server DIMM Health Network Storage Controller Thermal Guard

Use Scenario: Continuous temperature logging across multiple DIMM slots in 1U/2U rack servers to detect early-stage memory degradation or airflow blockage.

IC Role / Device Role / Timing Role: Dedicated thermal node per DIMM slot reporting via SMBus to server BMC for predictive failure analysis.

Use Value: Supports remote thermal diagnostics and automated replacement alerts before ECC errors or thermal shutdown occur.

Use Scenario: Thermal supervision of SAS/SATA controller ICs and NAND flash buffers in NAS and SAN storage enclosures operating under sustained load.

IC Role / Device Role / Timing Role: Independent temperature guardrail enforcing safe operating limits for storage controller SoCs and buffer memory.

Use Value: Prevents latent thermal-induced bit rot in flash translation layers by triggering forced idle cycles when critical thresholds are approached.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Alternative Part Technical Difference Application Difference Selection Advice
SE98ATP,118 HWSON8 (2 mm × 3 mm × 0.8 mm) thermal-enhanced package; identical electrical specs and register map. Better thermal coupling to PCB due to exposed thermal pad; preferred for high-power DIMMs with limited airflow. Select SE98ATP,118 when board layout allows soldering to thermal pad and JEDEC VCED-3 footprint is acceptable.
SE97APW,118 Same TSSOP8 package but narrower VDD range (2.7–5.5 V); lacks SMBus TIMEOUT; ±1 °C accuracy only over +40 °C to +125 °C. Not JEDEC JC-42.4 compliant; unsuitable for DDR3 DIMM thermal spec; usable in legacy 3.3 V systems. Choose SE97APW,118 only if supply voltage exceeds 3.6 V and JEDEC-grade accuracy is not required.

Compared with SE98APW,118, SE98ATP,118 offers superior thermal dissipation in space-constrained DIMMs, while SE97APW,118 trades JEDEC compliance and low-voltage operation for higher supply tolerance - making SE98APW,118 the optimal choice for modern DDR2/DDR3 modules requiring 1.7–3.6 V compatibility and ±0.5 °C accuracy.

Availability

SE98APW,118 is available at Aetrix Electronics and suitable for DDR2/DDR3 memory module manufacturing, enterprise server thermal management, and laptop motherboard design requiring stable component supply, JEDEC-compliant accuracy, and long-term industrial lifecycle support.

Supply support for SE98APW,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communication infrastructure markets.

The SE98A family was designed specifically to meet JEDEC JC-42.4 thermal sensor requirements for DDR memory modules, emphasizing precision, low-power operation, and SMBus interoperability in high-density memory subsystems.

FAQ

What is the guaranteed accuracy of SE98APW,118 across its full operating range?

The SE98APW,118 guarantees ±1 °C (maximum) accuracy from +40 °C to +125 °C and ±2 °C (maximum) from −40 °C to +125 °C. Its key specification is ±0.5 °C (typical) / ±1 °C (maximum) between +75 °C and +95 °C - the JEDEC JC-42.4 TS3000B1 DIMM thermal zone - confirmed in NXP's Rev. 04 datasheet Section 2.

Does SE98APW,118 require external components for basic I²C operation?

Yes, SE98APW,118 requires external pull-up resistors on both SDA and SCL lines (typically 2.2–10 kΩ depending on bus capacitance and speed), plus a 100 nF ceramic decoupling capacitor between VDD and VSS close to the package. The EVENT pin also needs a pull-up resistor (0.9–3.6 V) to function as an active-HIGH or active-LOW alarm signal.

How is the EVENT output configured for critical temperature shutdown in SE98APW,118?

The SE98APW,118 configures critical shutdown by writing the desired threshold to the Critical Alarm Trip register (04h), setting CONFIG[7] = 1 (TCRIT enable), CONFIG[2] = 1 (TCRIT-only mode), and CONFIG[3] = 1 (EVENT output enabled). Once triggered, the EVENT pin remains asserted until temperature falls below Tth(crit) − Thys - it cannot be cleared via software or SMBus ALERT.

Can SE98APW,118 operate on a 1.8 V DDR3 memory bus without level shifters?

Yes, SE98APW,118 operates natively from 1.7 V to 3.6 V, making it fully compatible with standard 1.8 V DDR3 VDDQ rails. Its I²C/SMBus interface tolerates VDD-referenced logic levels, and its open-drain SDA/SCL pins eliminate need for external level translators when interfacing with 1.8 V host controllers.

What initialization steps are mandatory before SE98APW,118 begins accurate temperature reporting?

Before reliable operation, SE98APW,118 requires programming of the Configuration register (01h) to set hysteresis, EVENT mode, and enable; Upper (02h), Lower (03h), and Critical (04h) trip registers; and optionally disabling SMBus TIMEOUT (bit 7 of 22h). Default values are all zero - unconfigured, the device outputs 0 °C and EVENT remains disabled.

SE98APW,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Function:
Temp Monitoring System (Sensor)
Sensor Type:
Internal
Sensing Temperature:
-40°C ~ 125°C
Accuracy:
±4°C(Max)
Topology:
ADC (Sigma Delta), Register Bank
Output Type:
I2C/SMBus
Output Alarm:
Yes
Output Fan:
Yes
Voltage - Supply:
1.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSSOP

SE98APW,118 FAQ

1.How can I place an order for SE98APW,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for SE98APW,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SE98APW,118 reliable?

The price and inventory of SE98APW,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SE98APW,118 is usually 5 days.

3.What payment methods are accepted for SE98APW,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SE98APW,118 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SE98APW,118?

SE98APW,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SE98APW,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SE98APW,118?

For technical support, including SE98APW,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SE98APW,118 requirements.

6.How does Aetrix verify that SE98APW,118 is sourced from the original manufacturer or authorized distributors?

All SE98APW,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SE98APW,118 meets industry standards.

7.What is the process for return or replacement of SE98APW,118?

All SE98APW,118 units undergo pre-shipment inspection (PSI). If there is an issue with SE98APW,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SE98APW,118 part is unused and in its original packaging.

Return procedure for SE98APW,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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