NXP Semiconductors SE98ATL,147

Overview

SE98ATL,147 from NXP Semiconductors is a JEDEC JC-42.4-compliant digital temperature sensor IC for DDR2/DDR3 memory modules, delivering ±0.5 °C (typ.) accuracy between +75 °C and +95 °C, 11-bit ΔΣ ADC resolution of 0.125 °C, and I²C/SMBus interface operation from 1.7 V to 3.6 V - deployed directly on DIMMs to monitor DRAM junction temperature in enterprise servers and laptops.

For engineers reviewing the SE98ATL,147 datasheet, SE98ATL,147 pinout, SE98ATL,147 application, or SE98ATL,147 equivalent, key selection considerations include its HXSON8 2 mm × 3 mm × 0.5 mm thermal-enhanced package, programmable EVENT output polarity and hysteresis (0 °C/1.5 °C/3 °C/6 °C), SMBus TIMEOUT/ALERT support, 8 Hz conversion rate, and JEDEC Grade B thermal specification compliance.

Technical Context

The SE98ATL,147 implements an on-die bandgap sensor feeding an 11-bit ΔΣ ADC updated at 8 Hz (125 ms conversion period), with internal registers for upper/lower/critical trip points, hysteresis configuration, and EVENT output mode selection (comparator or interrupt). Its SMBus TIMEOUT function resets the state machine if SCL is held low 25–35 ms, preventing bus lock-up across the full 1.7–3.6 V supply range.

Three address pins (A0–A2) enable up to eight devices on one bus; A0 is overvoltage-tolerant (10 V) for SPD-shared write protection. The open-drain EVENT output supports active-HIGH/active-LOW polarity, critical-only or window-based alarm modes, and SMBus ALERT arbitration - all configurable via the 16-bit Configuration register (01h) and trip-point registers (02h–04h).

Key Specifications

Pinout & Package

SE98ATL,147 is housed in an HXSON8 (SOT1052-1) package: plastic thermal-enhanced extremely thin small outline, no leads, 8 terminals, body dimensions 2 mm × 3 mm × 0.5 mm, compliant with JEDEC VCED-3 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature sensor applications.

Compared with SE98ATL,147, SE98APW,118 trades package miniaturization for ease of soldering and test access, while SE98ATP,118 offers improved thermal performance at the cost of 0.3 mm greater height - making SE98ATL,147 optimal for sub-0.6 mm z-height DDR modules requiring SPD write protection.

Availability

SE98ATL,147 is available at Aetrix Electronics and suitable for DDR3 server memory modules, laptop SO-DIMM thermal management, and enterprise network storage applications requiring stable component supply, JEDEC-compliant thermal accuracy, and long-term industrial lifecycle support.

Supply support for SE98ATL,147 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communications markets.

The SE98A product line was engineered specifically for JEDEC-compliant DDR memory thermal monitoring, addressing the need for high-accuracy, low-power, SMBus-compatible sensors integrated directly onto DIMMs - with SE98ATL,147 representing the ultra-thin HXSON8 variant optimized for next-generation compact memory modules.

FAQ

What is the primary application target for the SE98ATL,147?

The SE98ATL,147 is specifically designed for JEDEC JC-42.4-compliant thermal monitoring on DDR2 and DDR3 memory modules. It is mounted directly on Dual In-Line Memory Modules (DIMMs) to measure DRAM junction temperature, enabling real-time thermal management in laptops, servers, and enterprise networking equipment. Its HXSON8 package and 2 mm × 3 mm footprint make it ideal for space-constrained DIMM layouts where minimal z-height is critical.

Does the SE98ATL,147 support SMBus TIMEOUT and ALERT functions?

Yes, the SE98ATL,147 fully supports both SMBus TIMEOUT and ALERT functions. SMBus TIMEOUT resets the internal state machine if SCL is held low for 25–35 ms, preventing bus lock-up - enabled by default across the full 1.7–3.6 V supply range. SMBus ALERT is active when the device is configured in interrupt mode with active-LOW EVENT polarity, allowing it to participate in multi-device interrupt arbitration via the Alert Response Address (ARA) protocol.

What are the accuracy specifications of the SE98ATL,147 over temperature?

The SE98ATL,147 delivers ±0.5 °C (typical) / ±1 °C (maximum) accuracy between +75 °C and +95 °C, meeting JEDEC TS3000B1 requirements. From +40 °C to +125 °C, accuracy is ±1 °C (typical) / ±2 °C (maximum); from −40 °C to +125 °C, it is ±2 °C (typical) / ±3 °C (maximum). These values reflect factory calibration and are stored in the Capability register (00h = 0037h for B-grade).

How is the EVENT output configured on the SE98ATL,147?

The EVENT output on the SE98ATL,147 is a configurable open-drain signal controlled via the Configuration register (01h). Its mode (comparator, interrupt, or critical-only) is set using bits [2:0], polarity (active-HIGH/active-LOW) via bit [1], and hysteresis via bits [10:9]. The output remains high-impedance at power-up until enabled (bit [3]), and supports external pull-up voltages from 0.9 V to 3.6 V - critical for interfacing with diverse host voltage domains.

What package type does the SE98ATL,147 use and what are its key mechanical features?

The SE98ATL,147 uses the HXSON8 package (SOT1052-1): a plastic thermal-enhanced extremely thin small outline package with no leads, 8 terminals, and dimensions of 2 mm × 3 mm × 0.5 mm. It complies with JEDEC VCED-3 standard and is optimized for minimal z-height on DDR modules. Unlike the TSSOP8 or HWSON8 variants, the HXSON8 provides the lowest profile while maintaining thermal performance and overvoltage-tolerant A0 functionality.