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NXP Semiconductors SE98ATP,147

Part No.:
SE98ATP,147
Manufacturer:
NXP Semiconductors
Category:
Thermal Management
Package:
8-WFDFN Exposed Pad
Datasheet:
AetrixSE98ATP,147.pdf
Description:
IC TEMPERATURE SENSOR DDR 8HWSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,744

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Product details

Overview

SE98ATP,147 from NXP Semiconductors is a JEDEC JC-42.4-compliant digital temperature sensor IC designed for DDR2/DDR3 memory module thermal monitoring. It delivers ±0.5 °C (typ.) accuracy between +75 °C and +95 °C, operates from 1.7 V to 3.6 V, features an open-drain EVENT output, and communicates via I²C/SMBus up to 400 kHz - deployed directly on DIMMs to protect DRAM under thermal stress.

For engineers reviewing the SE98ATP,147 datasheet, SE98ATP,147 pinout, SE98ATP,147 application, or SE98ATP,147 equivalent, this page provides verified JEDEC-grade accuracy specs, HWSON8 package details, EVENT output configuration modes (comparator/interrupt/critical), 11-bit ADC resolution (0.125 °C), and real-world DIMM thermal management design guidance.

Technical Context

The SE98ATP,147 integrates an 11-bit ΔΣ ADC with 8 Hz conversion rate (125 ms period), continuously updating local temperature readings into latched registers. Its SMBus TIMEOUT and ALERT functions are hardware-supported, with programmable hysteresis (0 °C/1.5 °C/3 °C/6 °C) and three independent trip thresholds: Lower Alarm, Upper Alarm, and Critical Trip - all configurable via I²C registers.

It uses a 7-bit slave address (4-bit fixed + 3-bit A0/A1/A2 pins), supports hot-plug operation with 50 ns noise filtering, and initializes to comparator mode with EVENT disabled and hysteresis = 0 °C. The open-drain EVENT output is overvoltage tolerant up to 10 V on A0 and compatible with pull-up voltages from 0.9 V to 3.6 V.

Key Specifications

Parameter Value and Actual Design Meaning
Temp Range −40 °C to +125 °C operating range; ±1 °C max error across full range per JEDEC Grade B
Accuracy ±0.5 °C (typ.) / ±1 °C (max) from +75 °C to +95 °C - meets JEDEC TS3000B1 DIMM spec
Resolution 0.125 °C (11-bit ADC output); enables fine-grained thermal throttling decisions in memory controllers
Supply Voltage 1.7 V to 3.6 V - matches DDR module VDDQ rails without level-shifting
Interface Speed I²C/SMBus up to 400 kHz Fast-mode - supports rapid polling in high-density DIMM configurations
Quiescent Current 250 μA (typ.) active; 0.1 μA (typ.) shutdown - minimizes thermal self-heating and power budget impact
ESD Rating 2000 V HBM, 250 V MM, 1000 V CDM - ensures robustness during DIMM handling and system integration

Pinout & Package

SE98ATP,147 is housed in a 2 mm × 3 mm × 0.8 mm HWSON8 (SOT1069-2) thermally enhanced, leadless package optimized for surface-mount on DDR memory modules.

Pin/Terminal Circuit Role Design Meaning
A0 I²C slave address bit 0 (input) Internally pulled down; overvoltage tolerant to 10 V for SPD software write protection
A1 I²C slave address bit 1 (input) Internally pulled down; enables up to eight SE98ATP,147 devices on one bus
A2 I²C slave address bit 2 (input) Internally pulled down; completes 3-bit address selection
VSS Ground reference Device ground terminal; must be connected to DIMM ground plane for accurate thermal measurement
SDA I²C serial data (I/O) Open-drain bidirectional line; requires external pull-up resistor to VDD or host rail
SCL I²C serial clock (input) Open-drain input; synchronized with host controller; no internal driver
EVENT Thermal alarm output (output) Open-drain interrupt/comparator signal; configurable polarity; pulls up externally to 0.9–3.6 V
VDD Power supply 1.7–3.6 V input; powers internal bandgap, ADC, and logic; decoupling capacitor required

Key Features

Feature Design Value
JEDEC JC-42.4 Compliance Validated ±0.5 °C (typ.) accuracy in +75 °C to +95 °C range - satisfies DDR2/DDR3 DIMM thermal sensor requirements
Configurable EVENT Output Three operational modes: comparator (thermostat), interrupt (microprocessor alert), or critical-only (system shutdown trigger)
Programmable Hysteresis Four selectable values (0 °C/1.5 °C/3 °C/6 °C) prevent chatter at trip boundaries during thermal transients
SMBus TIMEOUT Support Hardware reset of internal state machine after 25–35 ms SCL low - prevents bus lockup in noisy environments
Hot-Plug Robustness 50 ns glitch filter + high-impedance I/O during power transitions - enables safe insertion/removal in live systems
Multi-Device Addressing Three hardware address pins (A0–A2) allow eight identical SE98ATP,147 sensors on one I²C bus without software arbitration

Applications

DDR Memory Thermal Monitoring Laptop Memory Subsystem

Use Scenario: Real-time DRAM junction temperature tracking on DDR2/DDR3 UDIMMs and RDIMMs during sustained memory bandwidth loads.

IC Role / Device Role / Timing Role: Local temperature sensor feeding thermal feedback to memory controller or platform management controller (PMC).

Use Value: Enables dynamic throttling before JEDEC-specified DRAM thermal limits are exceeded, preventing data corruption and extending module lifetime.

Use Scenario: Compact thermal sensing on SO-DIMM modules in space-constrained laptop motherboards where PCB area is limited.

IC Role / Device Role / Timing Role: Low-profile, leadless HWSON8 temperature monitor interfacing directly with embedded controller (EC) via SMBus.

Use Value: 2 mm × 3 mm footprint and 0.8 mm height minimize board space; 1.7 V operation aligns with low-voltage memory subsystems.

Server DIMM Health Management Enterprise Storage Controller

Use Scenario: Multi-sensor thermal mapping across dual-rank RDIMMs in 1U/2U rack servers to detect localized hotspots and trigger fan ramping.

IC Role / Device Role / Timing Role: One of up to eight addressable sensors per channel, reporting temperature and EVENT status to BMC/IPMI firmware.

Use Value: Configurable critical trip point and hysteresis reduce false alarms in thermally dense server chassis with variable airflow patterns.

Use Scenario: Temperature supervision of DDR3 buffers and PHYs in SAS/SATA RAID controllers exposed to ambient heat from adjacent drive bays.

IC Role / Device Role / Timing Role: Standalone thermal guard IC triggering hardware reset or throttling when buffer die temperature exceeds safe threshold.

Use Value: Open-drain EVENT output directly drives reset logic or FPGA interrupt pins without level translation; SMBus ALERT enables multi-device interrupt aggregation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature sensor applications.

Alternative Part Technical Difference Application Difference Selection Advice
SE98APW,118 TSSOP8 package (4.4 mm width); same electrical specs and register map; higher thermal resistance than HWSON8 Better suited for prototyping or legacy DIMM layouts with larger pad spacing; less optimal for high-density DDR3 modules Select SE98APW,118 only if board layout cannot accommodate 2 mm × 3 mm footprint or requires through-hole-compatible rework.
SE97ATP,118 Same HWSON8 package; narrower voltage range (2.7–3.6 V); lacks SMBus TIMEOUT support; ±1 °C accuracy only above +40 °C Lower-cost option for non-JEDEC-grade applications where 1.7 V operation and sub-40 °C accuracy are not required Choose SE97ATP,118 only for cost-sensitive consumer DIMMs where full JEDEC compliance is waived and supply rails are stable >2.7 V.

Compared with SE98ATP,147, SE98APW,118 trades thermal performance for assembly flexibility, while SE97ATP,118 reduces feature set and accuracy to lower BOM cost - neither offers the combination of JEDEC-grade accuracy, 1.7 V compatibility, and SMBus TIMEOUT found in SE98ATP,147.

Availability

SE98ATP,147 is available at Aetrix Electronics and suitable for DDR2/DDR3 memory module manufacturing, enterprise server thermal management, and laptop SO-DIMM production requiring stable component supply and JEDEC-compliant thermal sensing.

Supply support for SE98ATP,147 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communication infrastructure markets.

The SE98A product line was developed specifically to meet JEDEC JC-42.4 thermal sensor requirements for DDR memory modules, delivering high-accuracy, low-power, and SMBus-integrated temperature monitoring in ultra-compact packages like HWSON8.

FAQ

What is the accuracy specification of the SE98ATP,147 across its full temperature range?

The SE98ATP,147 achieves ±0.5 °C (typical) and ±1 °C (maximum) accuracy between +75 °C and +95 °C per JEDEC JC-42.4 TS3000B1. From +40 °C to +125 °C, accuracy is ±1 °C (typ)/±2 °C (max); from −40 °C to +125 °C, it is ±2 °C (typ)/±3 °C (max). These values are measured under specified test conditions and documented in the official NXP SE98A datasheet Rev. 04.

Does the SE98ATP,147 support SMBus TIMEOUT, and how is it configured?

Yes, the SE98ATP,147 supports SMBus TIMEOUT by default - it resets its internal state machine if SCL is held low for 25–35 ms, preventing bus lockups. TIMEOUT is disabled by writing logic 1 to bit 7 of register 22h (SMBus register). This feature operates across the full 1.7 V to 3.6 V supply range unless shutdown mode is active.

How many SE98ATP,147 devices can share the same I²C bus, and what determines their addresses?

Up to eight SE98ATP,147 devices can coexist on a single I²C bus using the A0, A1, and A2 address pins. Each pin is internally pulled down and sampled at bus access start, forming a 3-bit programmable portion of a 7-bit slave address (fixed 0011xxx pattern). No external pull-ups are needed on A0–A2, and A0 supports 10 V overvoltage tolerance for SPD compatibility.

What are the key differences between the EVENT output's comparator mode and interrupt mode in the SE98ATP,147?

In comparator mode, the SE98ATP,147's EVENT pin behaves like a hardware window comparator - asserting when temperature exits the programmed upper/lower bounds or exceeds critical trip, and remaining asserted until temperature re-enters the window or thresholds are updated. In interrupt mode, EVENT asserts on each boundary crossing and must be cleared via CONFIG register bit 5; it reasserts only on subsequent crossings, enabling precise microprocessor event handling.

Is the SE98ATP,147 compatible with DDR4 memory modules, or is it limited to DDR2/DDR3?

The SE98ATP,147 is explicitly designed and qualified for DDR2 and DDR3 memory modules per JEDEC JC-42.4 Mobile Platform Memory Module Thermal Sensor Component specification. While its electrical interface (I²C/SMBus) and voltage range (1.7–3.6 V) may function in DDR4 systems, it is not validated for DDR4 thermal profiles, timing margins, or JEDEC JC-42.4 revisions applicable to DDR4 - use only in DDR2/DDR3 applications per NXP documentation.

SE98ATP,147 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
8-WFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Function:
Temp Monitoring System (Sensor)
Sensor Type:
Internal
Sensing Temperature:
-40°C ~ 125°C
Accuracy:
±4°C(Max)
Topology:
ADC (Sigma Delta), Register Bank
Output Type:
I2C/SMBus
Output Alarm:
Yes
Output Fan:
Yes
Voltage - Supply:
1.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-HWSON (2x3)

SE98ATP,147 FAQ

1.How can I place an order for SE98ATP,147 through Aetrix?

Please submit a Request for Quotation (RFQ) for SE98ATP,147 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SE98ATP,147 reliable?

The price and inventory of SE98ATP,147 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SE98ATP,147 is usually 5 days.

3.What payment methods are accepted for SE98ATP,147?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SE98ATP,147 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SE98ATP,147?

SE98ATP,147 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SE98ATP,147 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SE98ATP,147?

For technical support, including SE98ATP,147 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SE98ATP,147 requirements.

6.How does Aetrix verify that SE98ATP,147 is sourced from the original manufacturer or authorized distributors?

All SE98ATP,147 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SE98ATP,147 meets industry standards.

7.What is the process for return or replacement of SE98ATP,147?

All SE98ATP,147 units undergo pre-shipment inspection (PSI). If there is an issue with SE98ATP,147, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SE98ATP,147 part is unused and in its original packaging.

Return procedure for SE98ATP,147:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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