NXP Semiconductors SE98PW,118

Overview

SE98PW,118 from NXP Semiconductors is a JEDEC JC-42.4-compliant digital temperature sensor optimized for DDR2/DDR3 SO-DIMM modules, measuring −40 °C to +125 °C with ±1 °C typical accuracy from +75 °C to +95 °C, 8 Hz conversion rate, and I²C/SMBus interface operating at 3.0–3.6 V. It delivers precise DRAM case temperature estimation to enable dynamic thermal throttling in thin-and-light notebooks.

For engineers reviewing the SE98PW,118 datasheet, SE98PW,118 pinout, SE98PW,118 application, or SE98PW,118 equivalent, this page provides verified functional context, JEDEC-aligned thermal sensing specifications, TSSOP8 package details, EVENT output configuration options, and validated alternative parts for DIMM thermal monitoring designs.

Technical Context

The SE98PW,118 implements an 11-bit ΔΣ ADC with 8 Hz update rate (125 ms conversion period), supporting SMBus TIMEOUT and ALERT protocols. Its programmable configuration register enables selectable EVENT output modes-comparator, interrupt, or critical-only-with independent UPPER/LOWER and TCRIT trip registers and user-configurable hysteresis (0 °C, 1.5 °C, 3 °C, or 6 °C).

It uses a 7-bit slave address (0011xxx) with three hardware-selectable address pins (A0–A2), allowing up to eight devices on one bus. The open-drain EVENT output supports active-HIGH/LOW polarity and can be configured as thermostat comparator or microprocessor interrupt, with status reporting via CONFIG[4] and clearing via CONFIG[5].

Key Specifications

Pinout & Package

TSSOP8 package (SOT530-1), 4.4 mm body width, lead pitch 0.65 mm, moisture sensitivity level MSL3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature sensing applications.

Compared with SE98PW,118, SE98TK,118 offers identical functionality in a thermally optimized HVSON8 package, while LM75BIMM/NOPB provides basic temperature monitoring but omits JEDEC-specific features like critical trip latching, programmable hysteresis, and SMBus TIMEOUT-making it unsuitable for DDR memory thermal control where reliability and protocol robustness are mandatory.

Availability

SE98PW,118 is available at Aetrix Electronics and suitable for DDR2/DDR3 memory module manufacturing, laptop thermal subsystem integration, and enterprise server memory subsystems requiring stable component supply, JEDEC-compliant thermal sensing, and long-term industrial availability.

Supply support for SE98PW,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communication infrastructure markets.

The SE98 product line was designed specifically for JEDEC JC-42.4-compliant thermal monitoring in DDR memory modules, delivering high-accuracy, low-power, and protocol-robust temperature sensing to enable dynamic thermal management in space- and power-constrained platforms.

FAQ

What is the primary application target for the SE98PW,118?

The SE98PW,118 is engineered for JEDEC JC-42.4-compliant thermal monitoring on DDR2 and DDR3 SO-DIMM modules. Its core function is to provide accurate, localized DRAM temperature measurement-enabling memory controllers to dynamically throttle traffic based on actual module temperature rather than conservative worst-case estimates. This improves thermal efficiency and performance in laptops, servers, and enterprise storage systems where SE98PW,118 serves as the authoritative thermal sensor on the memory module itself.

Does the SE98PW,118 support SMBus TIMEOUT and how does it affect system reliability?

Yes, the SE98PW,118 fully supports SMBus TIMEOUT: if the SCL line is held LOW for 25–35 ms, the device resets its internal state machine to bus idle mode. This prevents system lockups caused by bus contention or master faults. Enabled by default, TIMEOUT ensures deterministic recovery without host intervention-critical for unattended server and storage applications where SE98PW,118 operates as part of a distributed thermal management network.

How is the EVENT output configured on the SE98PW,118 and what are its operational modes?

The EVENT output on the SE98PW,118 is an open-drain pin configurable via the Configuration Register (01h) for three distinct modes: comparator (thermostat-style continuous assertion outside alarm window), interrupt (edge-triggered assertion on boundary crossing, clearable via CONFIG[5]), or critical-only (latched assertion above TCRIT until temperature falls below threshold minus hysteresis). Polarity (active-HIGH/LOW) and hysteresis (0/1.5/3/6 °C) are also programmable-giving designers full flexibility in implementing SE98PW,118 within diverse thermal control architectures.

What accuracy specifications apply to the SE98PW,118 across its operating range?

The SE98PW,118 specifies C-grade accuracy: ±1 °C typical / ±2 °C maximum from +75 °C to +95 °C; ±2 °C typical / ±3 °C maximum from +40 °C to +125 °C; and ±3 °C typical / ±4 °C maximum across the full −40 °C to +125 °C range. These values are validated per JEDEC JC-42.4 test methodology and reflect the device's calibration at manufacture-ensuring SE98PW,118 meets the tight tolerance requirements for DRAM case temperature estimation in production memory modules.

Can multiple SE98PW,118 devices share the same I²C bus and how is addressing managed?

Yes, up to eight SE98PW,118 devices can coexist on a single I²C/SMBus. Addressing uses a fixed 4-bit prefix (0011) plus three hardware-selectable bits (A0, A1, A2), forming a 7-bit slave address. Each pin is sampled at the start of every bus access, enabling static, collision-free addressing without software configuration. This architecture allows SE98PW,118 to scale across multi-rank DIMMs or multi-module systems while maintaining deterministic communication-essential for reliable thermal monitoring in complex memory subsystems.