Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Skyworks Solutions Inc. SI52111-B3-GM2R

Part No.:
SI52111-B3-GM2R
Manufacturer:
Skyworks Solutions Inc.
Category:
Application Specific Clock/Timing
Package:
10-VFDFN Exposed Pad
Datasheet:
AetrixSI52111-B3-GM2R.pdf
Description:
IC CLOCK GENERATOR PCIE 10TDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,345

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SI52111-B3-GM2R from Skyworks Solutions is a PCIe Gen 1/Gen 2–compliant single-output clock generator with HCSL differential output, 100 MHz frequency, 3.3 V supply, and 10-pin TDFN (3×3 mm) package. It accepts 25 MHz crystal or clock input and delivers ultra-low jitter (28 ps typical cycle-to-cycle, 1.35 ps RMS phase jitter for Gen 2), targeting PCIe root complex and endpoint timing in space-constrained embedded systems.

For engineers reviewing the SI52111-B3-GM2R datasheet, SI52111-B3-GM2R pinout, SI52111-B3-GM2R application, or SI52111-B3-GM2R equivalent, this page provides verified technical context, exact pin functions, PCIe Gen 2 timing compliance data, spread-spectrum exclusion confirmation, and validated alternative options for consumer and industrial clocking designs.

Technical Context

The SI52111-B3-GM2R integrates a PLL-based clock synthesis architecture with a fixed 4× multiplication ratio to generate 100 MHz from a 25 MHz reference. Its output stage uses a low-power HCSL driver with 0.7 V common-mode voltage and no external termination required.

It operates across –40 °C to +85 °C with 3.3 V ±10% supply, draws ≤13 mA active current, and supports both crystal (XIN/XOUT) and single-ended clock (CLKIN) inputs. Unlike the B4 variant, the B3 version has no spread-spectrum capability-confirmed by explicit datasheet statement.

Key Specifications

Parameter Value and Actual Design Meaning
Output Frequency 100 MHz - precisely meets PCIe Gen 1/2 reference clock requirement.
Output Type HCSL differential - enables direct interface to PCIe receivers without external resistors or level-shifting.
Jitter (Cycle-to-Cycle) 28 ps typical - ensures robust setup/hold margins in high-speed serial links.
Jitter (PCIe Gen 2 Phase, 10 kHz–1.5 MHz) 1.35 ps RMS - satisfies PCIe Gen 2 specification limit of ≤3.0 ps.
Supply Voltage 3.3 V ±10% - compatible with standard I/O rail; no auxiliary supplies needed.
Operating Temperature –40 °C to +85 °C - qualified for extended industrial and consumer ambient conditions.
Package 10-pin TDFN, 3×3 mm - enables compact PCB layout in dense server, storage, and networking boards.

Pinout & Package

SI52111-B3-GM2R uses a 10-pin TDFN package (3×3 mm, 0.5 mm pitch) with exposed thermal pad. Pin 1 is top-left corner (marking dot adjacent), pins numbered counter-clockwise.

Pin/Terminal Circuit Role Design Meaning
1, 10 VDD 3.3 V power supply inputs - dual VDD pins reduce IR drop and improve PSRR.
2 XOUT Crystal oscillator output - must be left floating when using CLKIN-only mode.
3 XIN/CLKIN 25 MHz crystal or clock input - accepts either parallel-resonant crystal or CMOS-level 25 MHz signal.
4, 5 VSS Dedicated ground pins - separate return paths minimize noise coupling into sensitive analog PLL section.
6, 7 DIFF1 Differential 100 MHz HCSL output - complementary pair (DIFF1+, DIFF1–) with 0.7 V common-mode voltage.
8, 9 NC No-connect terminals - must remain unconnected; not internally bonded.

Key Features

Feature Design Value
PCIe Gen 1 & Gen 2 compliance Validated 100 MHz output with <3.0 ps RMS phase jitter (10 kHz–1.5 MHz) and <86 ps pk-pk jitter - meets PCI-SIG electrical requirements.
Integrated HCSL driver 0.7 V common-mode, 300–550 mV swing, no external termination - eliminates four 50 Ω resistors per output, saving board area and BOM cost.
Low power operation ≤13 mA supply current at 3.3 V - reduces thermal load in fanless or thermally constrained enclosures.
Crystal or clock input flexibility Single pin (XIN/CLKIN) accepts either 25 MHz crystal (with XOUT) or buffered 25 MHz clock - simplifies design reuse across reference clock source options.
Extended temperature range –40 °C to +85 °C operation - supports deployment in network-attached storage, routers, and industrial edge gateways.

Applications

PCIe Root Complex Timing SATA Host Controller Clocking

Use Scenario: Providing reference clock to CPU/chipset PCIe root complex in compact desktop or embedded motherboard.

IC Role / Device Role / Timing Role: Primary 100 MHz PCIe Gen 2 reference clock generator with HCSL output directly driving root port receivers.

Use Value: Eliminates need for external termination and reduces jitter-induced link training failures versus discrete buffer solutions.

Use Scenario: Synchronizing SATA host controller and PHY in multi-function printer or NAS device.

IC Role / Device Role / Timing Role: Single-source 100 MHz clock for SATA 1.5/3.0 Gbps link layer timing, shared with PCIe peripherals.

Use Value: Enables co-location of PCIe and SATA clocks on one IC, reducing component count and skew between interfaces.

Wireless Access Point Baseband Enterprise Router Line Card

Use Scenario: Delivering stable 100 MHz reference to Wi-Fi SoC's PCIe interface in 802.11ac/ax access point.

IC Role / Device Role / Timing Role: Low-jitter PCIe clock generator operating in thermally demanding plastic enclosure environments.

Use Value: Maintains PCIe link stability under ambient temperatures up to +85 °C without derating or airflow dependency.

Use Scenario: Clocking multiple PCIe switch or NIC controllers on modular router line cards.

IC Role / Device Role / Timing Role: Compact, single-output clock source for non-spread-spectrum PCIe lanes requiring deterministic timing.

Use Value: 3×3 mm TDFN footprint allows placement near PCIe connectors, minimizing trace length and EMI susceptibility.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen 2 clock generator applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si52111-B4-GM2R Identical pinout and specs, but adds –0.5% down-spread spectrum (31.5 kHz modulation); B3 lacks spread capability. Required where EMI reduction mandates spread-spectrum clocking; unsuitable if deterministic jitter profile is mandatory. Select B4 only if system-level EMI testing fails with B3; otherwise B3 offers simpler timing analysis.
ICS843001AGI-01LFT 8-pin SOIC package, 100 MHz HCSL output, PCIe Gen 2 compliant, but higher 18 mA supply current and larger 5×5.5 mm footprint. Better suited for prototyping or legacy layouts where TDFN reflow is unavailable; less optimal for high-density routing. Choose only when board assembly process cannot support 3×3 mm TDFN or when SOIC handling is preferred.

Compared with SI52111-B3-GM2R, the B4 variant adds EMI-reducing spread spectrum at identical performance and footprint, while the ICS843001AGI-01LFT trades size and power efficiency for through-hole/SOIC compatibility-making SI52111-B3-GM2R optimal for new compact, low-power PCIe designs.

Availability

SI52111-B3-GM2R is available at Aetrix Electronics and suitable for PCIe root complex timing, SATA host controller synchronization, wireless access point baseband, and enterprise router line card applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for SI52111-B3-GM2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Skyworks Solutions is a global semiconductor company specializing in analog and mixed-signal connectivity solutions, with leadership in RF, timing, and power management ICs.

The Si52111 product line delivers highly integrated, low-jitter PCIe clock generators optimized for space-constrained, thermally demanding consumer and embedded platforms requiring Gen 1/2 compliance without spread spectrum.

FAQ

Does SI52111-B3-GM2R support spread-spectrum clocking?

No, SI52111-B3-GM2R does not support spread-spectrum outputs. The "B3" suffix explicitly denotes absence of spread-spectrum capability, unlike the B4 variant which provides –0.5% down-spread. This makes SI52111-B3-GM2R appropriate for applications requiring deterministic jitter profiles and strict phase-noise control.

What is the maximum allowable input clock duty cycle for SI52111-B3-GM2R?

The SI52111-B3-GM2R accepts a 25 MHz input clock with a duty cycle between 45% and 55%, as specified in Table 3 of the datasheet. Deviations outside this range may impact internal PLL lock stability and increase output jitter beyond guaranteed limits.

Can SI52111-B3-GM2R drive two PCIe slots simultaneously?

No, SI52111-B3-GM2R provides only one differential HCSL output (DIFF1). It is designed for single-lane PCIe timing; driving multiple slots requires either a clock fanout buffer or a multi-output generator such as the Si5330x family.

Is external termination required for the DIFF1 output of SI52111-B3-GM2R?

No, SI52111-B3-GM2R's HCSL output driver is internally terminated. The datasheet confirms "no termination resistors required," enabling direct connection to PCIe receiver inputs with 50 Ω AC-coupled differential traces-reducing BOM count and layout complexity.

What is the recommended crystal load capacitance for SI52111-B3-GM2R?

The SI52111-B3-GM2R requires a 25 MHz parallel-resonant AT-cut crystal with 12–15 pF load capacitance, as specified in Table 6. Using crystals outside this range may degrade long-term accuracy beyond the 250 ppm max spec or cause startup failure.

SI52111-B3-GM2R Specifications

Product attributes
Attribute value
Manufacturer:
Skyworks Solutions Inc.
Series:
-
Package/Case:
10-VFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
PLL:
Yes
Main Purpose:
PCI Express (PCIe)
Input:
Clock, Crystal
Output:
HCSL
Number of Circuits:
1
Ratio - Input:Output:
1:1
Differential - Input:Output:
No/Yes
Frequency - Max:
100MHz
Voltage - Supply:
2.97V ~ 3.63V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
10-DFN (3x3)

SI52111-B3-GM2R FAQ

1.How can I place an order for SI52111-B3-GM2R through Aetrix?

Please submit a Request for Quotation (RFQ) for SI52111-B3-GM2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI52111-B3-GM2R reliable?

The price and inventory of SI52111-B3-GM2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI52111-B3-GM2R is usually 5 days.

3.What payment methods are accepted for SI52111-B3-GM2R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI52111-B3-GM2R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI52111-B3-GM2R?

SI52111-B3-GM2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI52111-B3-GM2R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI52111-B3-GM2R?

For technical support, including SI52111-B3-GM2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI52111-B3-GM2R requirements.

6.How does Aetrix verify that SI52111-B3-GM2R is sourced from the original manufacturer or authorized distributors?

All SI52111-B3-GM2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI52111-B3-GM2R meets industry standards.

7.What is the process for return or replacement of SI52111-B3-GM2R?

All SI52111-B3-GM2R units undergo pre-shipment inspection (PSI). If there is an issue with SI52111-B3-GM2R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI52111-B3-GM2R part is unused and in its original packaging.

Return procedure for SI52111-B3-GM2R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SI52111-B3-GM2R Tags

  • SI52111-B3-GM2R
  • SI52111-B3-GM2R PDF
  • SI52111-B3-GM2R Datasheet
  • SI52111-B3-GM2R Specifications
  • SI52111-B3-GM2R Images
  • Skyworks Solutions Inc.
  • Skyworks Solutions Inc. SI52111-B3-GM2R
  • Buy SI52111-B3-GM2R
  • SI52111-B3-GM2R Price
  • SI52111-B3-GM2R Distributor
  • SI52111-B3-GM2R Supplier
  • SI52111-B3-GM2R Wholesale
Related Products
LMK00334RTVRQ1
LMK00334RTVRQ1

Texas Instruments

DSC557-0344FI0T
DSC557-0344FI0T

Microchip Technology

9FGV0241AKILFT
9FGV0241AKILFT

Renesas

9DBL0452CKILFT
9DBL0452CKILFT

Renesas

DSC557-0344FL1T
DSC557-0344FL1T

Microchip Technology

RC19008AGND#KB0
RC19008AGND#KB0

Renesas

RC19008AGND#BB0
RC19008AGND#BB0

Renesas

9DB403DGILFT
9DB403DGILFT

Renesas

9DB233AGILFT
9DB233AGILFT

Renesas

9DB803DGILFT
9DB803DGILFT

Renesas

9FGL0851DKILFT
9FGL0851DKILFT

Renesas

AB-557-03-HCHC-F-L-C-T
AB-557-03-HCHC-F-L-C-T

Abracon LLC

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER