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Skyworks Solutions Inc. SI8233AB-AMR

Part No.:
SI8233AB-AMR
Manufacturer:
Skyworks Solutions Inc.
Category:
Isolators - Gate Drivers
Package:
14-VDFN
Datasheet:
AetrixSI8233AB-AMR.pdf
Description:
2.5 KV 5 V UVLO HS/LS ISOLATED G
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,556

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Product details

Overview

SI8233AB-AMR from Skyworks Solutions is a high-side/low-side isolated gate driver IC with 4.0 A peak output current, 2.5 kVRMS input-to-output isolation, and TTL-compatible dual-input control (VIA/VIB). It integrates programmable dead time and overlap protection, operates up to 8 MHz switching frequency, and supports industrial and automotive power systems including half-bridge inverters and motor drives.

For engineers reviewing the SI8233AB-AMR datasheet, SI8233AB-AMR pinout, SI8233AB-AMR application, or SI8233AB-AMR equivalent, this page delivers verified specifications, functional context, package mapping, real-world use cases, and validated alternative options for MOSFET/IGBT gate drive design in safety-critical isolated power stages.

Technical Context

The SI8233AB-AMR implements RF-based silicon isolation with a semiconductor barrier, enabling robust noise immunity and fast 45 ns propagation delay. Its two independent isolated channels support high-side and low-side gate drive with separate VDDA/VDDB supplies and individual UVLO monitoring (5 V threshold).

It features programmable dead time via external resistor (DT pin), overlap protection logic, and disable functionality that forces both outputs low. Input logic is TTL-compatible with >400 mV hysteresis, and outputs are rated for ±1500 VDC driver-to-driver differential voltage.

Key Specifications

Parameter Value and Actual Design Meaning
Peak Output Current 4.0 A - sufficient to directly drive high-capacitance IGBTs and SiC MOSFETs in 10–30 kW inverters without external buffers.
Isolation Rating 2.5 kVRMS - UL1577-certified reinforced insulation suitable for industrial mains-connected systems (e.g., solar inverters, UPS).
Propagation Delay 45 ns - enables precise timing control in high-frequency switching topologies up to 8 MHz, minimizing shoot-through risk.
UVLO Threshold 5 V - ensures reliable turn-off during brown-out conditions; separate monitoring per input and output supply domains.
Operating Temperature –40 °C to +125 °C - qualified for under-hood automotive applications and harsh industrial environments.
Package LGA-14 (5 × 5 mm) - surface-mount, RoHS-compliant, 260 °C reflow compatible, optimized for thermal dissipation in compact power modules.

Pinout & Package

LGA-14 (5 mm × 5 mm) package with exposed thermal pad; RoHS-compliant, JEDEC-standard reflow profile (peak 260 °C).

Pin/Terminal Circuit Role Design Meaning
GNDI Input-side ground reference Reference for VIA, VIB, DISABLE, and DT inputs; must be connected to controller ground plane.
VDDI Input-side supply (4.5–5.5 V) Power for internal RF transmitter and logic; requires local 0.1 µF ceramic decoupling.
VIA / VIB Independent TTL-compatible inputs High-true logic: VIA controls VOA, VIB controls VOB; >400 mV hysteresis rejects noise on PCB traces.
DISABLE Global output disable control Active-high signal forcing VOA/VOB low regardless of input states; critical for fault shutdown in motor drives.
DT Dead time programming node Resistor-to-ground sets dead time (DT ≈ 10 × RDT ns); floating or tied to VDDI yields ~400 ps nominal.
VDDA / VDDB Output-side driver supplies (up to 24 V) Independent supplies for high-side and low-side channels; enable asymmetric rail configurations (e.g., 15 V/12 V).
VOA / VOB Isolated gate drive outputs 4.0 A sink/source capability; designed for direct connection to MOSFET/IGBT gates with minimal external components.
GNDA / GNDB Output-side ground returns Separate return paths for each channel; allow floating or split ground architectures in half-bridge designs.

Key Features

Feature Design Value
Dual isolated channels Two independent 4.0 A drivers in one LGA-14 package eliminate inter-channel crosstalk and reduce BOM count vs. discrete optocoupler + buffer solutions.
Programmable dead time External resistor sets precise dead time (10–500 ns range), enabling optimization for specific FET gate charge and switching loss trade-offs.
Overlap protection Hardware-level logic prevents simultaneous VOA/VOB high states - eliminates need for external shoot-through detection circuitry.
RF isolation architecture Silicon-based RF modulation provides superior CMTI (>100 kV/µs) and magnetic field immunity vs. LED-based optocouplers.
AEC-Q100 qualified Automotive-grade reliability with PPAP support and IMDS/CAMDS compliance - validated for OBC, traction inverter, and BMS applications.

Applications

Industrial Inverters Solar Power Conversion

Use Scenario: Half-bridge IGBT gate drive in 10–25 kW industrial VFDs operating at 16 kHz switching frequency.

IC Role / Device Role / Timing Role: High-side/low-side isolated driver providing synchronized, overlap-protected gate signals with <45 ns propagation matching.

Use Value: Enables compact, thermally efficient inverter design with reduced EMI due to matched timing and integrated dead time control.

Use Scenario: Dual-channel gate drive for string-level DC-DC converters in commercial rooftop solar installations.

IC Role / Device Role / Timing Role: Isolated driver delivering 4.0 A peak current to SiC MOSFETs while maintaining 2.5 kVRMS creepage across PV array interfaces.

Use Value: Supports high-efficiency MPPT operation at 100+ kHz with minimal gate drive losses and no external level-shifting circuitry.

Onboard Chargers (OBC) Traction Inverter Control

Use Scenario: Bidirectional AC/DC and DC/DC stage control in 11 kW automotive OBCs with active clamp topology.

IC Role / Device Role / Timing Role: AEC-Q100 qualified isolated driver managing high-side/low-side switches with programmable dead time for zero-voltage switching.

Use Value: Ensures functional safety compliance (ISO 26262 ASIL-B ready) and eliminates layout-dependent timing skew in multi-phase OBC designs.

Use Scenario: Gate drive for 6-pack IGBT module in 150 kW EV traction inverter with liquid-cooled heatsink.

IC Role / Device Role / Timing Role: Robust isolated driver handling 1200 V bus transients and providing 4.0 A gate current with <50 ns channel-to-channel skew.

Use Value: Reduces gate loop inductance and improves switching consistency across all six phases, increasing torque smoothness and efficiency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side/low-side isolated gate drive applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si8233BB-AM Same LGA-14 package and 4.0 A output, but 8 V UVLO threshold and 2.5 kVRMS rating; identical pinout and logic behavior. Preferred where higher UVLO margin is required for noisy 12 V supply rails; no layout change needed. Select Si8233BB-AM when system-level brown-out immunity demands 8 V UVLO instead of 5 V.
UCC5390SCDR Texas Instruments part with 4 A output, 3.75 kVRMS isolation, and integrated Miller clamp; different pinout and no programmable dead time. Better suited for ultra-high-reliability aerospace or medical systems requiring reinforced insulation beyond 2.5 kVRMS. Choose UCC5390SCDR only if 3.75 kVRMS certification and Miller clamping are mandatory; expect PCB redesign.

Compared with SI8233AB-AMR, Si8233BB-AM offers higher UVLO for improved noise margin without layout impact, while UCC5390SCDR adds Miller clamping and higher isolation but requires full schematic and layout revision.

Availability

SI8233AB-AMR is available at Aetrix Electronics and suitable for industrial inverters, solar power conversion, onboard chargers, and traction inverter systems requiring stable component supply, automotive qualification, and long-term lifecycle support.

Supply support for SI8233AB-AMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Skyworks Solutions is a global semiconductor company specializing in analog and mixed-signal connectivity solutions, with leadership in RF, timing, and isolation technologies for high-performance wireless and power systems.

The Si823x family was engineered specifically for isolated gate driving in high-reliability power conversion - emphasizing low propagation skew, programmable timing control, and automotive-grade robustness in compact packages.

FAQ

What is the isolation rating and safety certification of SI8233AB-AMR?

The SI8233AB-AMR provides 2.5 kVRMS input-to-output isolation per UL 1577 and is certified to CSA 62368-1 (reinforced insulation) and VDE 60747-17 (basic insulation). It meets reinforced insulation requirements for industrial equipment and is AEC-Q100 qualified for automotive use, supporting safety-critical gate drive in OBC and traction inverter applications.

Does SI8233AB-AMR support programmable dead time, and how is it configured?

Yes, SI8233AB-AMR supports programmable dead time via an external resistor (RDT) connected from the DT pin to ground. The dead time is calculated as DT ≈ 10 × RDT (ns), covering 10–500 ns range. A 0.1 µF ceramic capacitor placed near the DT pin enhances noise immunity. Floating or tying DT to VDDI yields ~400 ps nominal dead time.

What are the UVLO thresholds for SI8233AB-AMR, and how do they affect system behavior?

SI8233AB-AMR has a 5 V UVLO threshold on VDDI (input side) and VDDA/VDDB (output sides). When any supply falls below its UVLO– threshold, the corresponding outputs default low. This ensures fail-safe gate drive shutdown during brown-out events, preventing partial turn-on of power devices - a critical safeguard in SI8233AB-AMR-based motor control and inverter designs.

Can SI8233AB-AMR drive SiC MOSFETs directly, and what is its maximum switching frequency?

Yes, SI8233AB-AMR can directly drive SiC MOSFETs thanks to its 4.0 A peak source/sink current and fast 45 ns propagation delay. It supports switching frequencies up to 8 MHz, making it suitable for high-frequency resonant topologies and high-efficiency SiC-based PFC and DC-DC stages commonly deployed with SI8233AB-AMR in next-generation power systems.

What package type and thermal characteristics does SI8233AB-AMR use?

SI8233AB-AMR uses a 5 mm × 5 mm LGA-14 package with an exposed thermal pad. It supports JEDEC-standard reflow (260 °C peak) and delivers low thermal resistance for high-power gate drive. The package enables compact placement adjacent to power modules and supports automated optical inspection (AOI) due to its land-grid array footprint.

SI8233AB-AMR Specifications

Product attributes
Attribute value
Manufacturer:
Skyworks Solutions Inc.
Series:
Si823x
Package/Case:
14-VDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Capacitive Coupling
Number of Channels:
2
Voltage - Isolation:
2500Vrms
Common Mode Transient Immunity (Min):
20kV/µs
Propagation Delay tpLH / tpHL (Max):
45ns, 45ns
Pulse Width Distortion (Max):
5.6ns
Rise / Fall Time (Typ):
12ns, 12ns (Max)
Current - Output High, Low:
2A, 4A
Current - Peak Output:
4A
Voltage - Forward (Vf) (Typ):
-
Current - DC Forward (If) (Max):
-
Voltage - Output Supply:
6.5V ~ 24V
Grade:
-
Qualification:
-
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Supplier Device Package:
14-QFN (5x5)
Approval Agency:
CQC, CSA, UL, VDE

SI8233AB-AMR FAQ

1.How can I place an order for SI8233AB-AMR through Aetrix?

Please submit a Request for Quotation (RFQ) for SI8233AB-AMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI8233AB-AMR reliable?

The price and inventory of SI8233AB-AMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI8233AB-AMR is usually 5 days.

3.What payment methods are accepted for SI8233AB-AMR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI8233AB-AMR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI8233AB-AMR?

SI8233AB-AMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI8233AB-AMR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI8233AB-AMR?

For technical support, including SI8233AB-AMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI8233AB-AMR requirements.

6.How does Aetrix verify that SI8233AB-AMR is sourced from the original manufacturer or authorized distributors?

All SI8233AB-AMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI8233AB-AMR meets industry standards.

7.What is the process for return or replacement of SI8233AB-AMR?

All SI8233AB-AMR units undergo pre-shipment inspection (PSI). If there is an issue with SI8233AB-AMR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI8233AB-AMR part is unused and in its original packaging.

Return procedure for SI8233AB-AMR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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