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Skyworks Solutions Inc. SI8233AC-D-IS1

Part No.:
SI8233AC-D-IS1
Manufacturer:
Skyworks Solutions Inc.
Category:
Isolators - Gate Drivers
Package:
16-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSI8233AC-D-IS1.pdf
Description:
DGT ISO 3.75KV 2CH GT DVR 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,401

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Product details

Overview

SI8233AC-D-IS1 from Skyworks Solutions is a high-side/low-side isolated gate driver IC with 4.0 A peak output current, 3.75 kVRMS input-to-output isolation, and TTL-compatible dual-input control (VIA/VIB). It integrates two independent isolated drivers in a single SOIC-16 narrow-body package and supports up to 8 MHz switching frequency for half-bridge MOSFET/IGBT drive in industrial inverters and motor control systems.

For engineers reviewing the SI8233AC-D-IS1 datasheet, SI8233AC-D-IS1 pinout, SI8233AC-D-IS1 application, or SI8233AC-D-IS1 equivalent, this page delivers verified specifications, validated pin functions, confirmed automotive-grade compatibility (AEC-Q100), isolation safety certifications (UL 1577, VDE 60747-17), and real-world use context for power electronics design.

Technical Context

The SI8233AC-D-IS1 implements RF-based silicon isolation with on/off keying modulation across a semiconductor barrier, enabling robust noise immunity and eliminating startup initialization. Its dual-channel architecture features independent UVLO monitoring per side (5 V threshold), programmable dead time via external resistor (DT pin), and overlap protection logic to prevent shoot-through in half-bridge topologies.

It operates with VDDI = 4.5–5.5 V (input side) and VDDA/VDDB = 9–24 V (output side), delivering 4.0 A source/sink capability at 12 V supply while maintaining ≤45 ns propagation delay and <10 ns channel-to-channel skew. The device supports grounded or floating output configurations with ±1500 VDC driver-to-driver differential voltage tolerance.

Key Specifications

Parameter Value and Actual Design Meaning
Peak Output Current 4.0 A - drives high-capacitance MOSFETs/IGBTs directly without external buffers in half-bridge configurations.
Isolation Rating 3.75 kVRMS - UL 1577 recognized; enables reinforced insulation in 600–1000 Vdc bus applications like solar inverters.
Propagation Delay ≤45 ns - ensures precise timing alignment between high-side and low-side outputs for >100 kHz PWM operation.
UVLO Threshold 5 V (VDDI) - prevents erroneous switching during brown-out conditions; hysteresis >400 mV improves noise margin.
Switching Frequency Up to 8 MHz - supports high-frequency resonant converters and GaN-based power stages requiring fast edge rates.
Package SOIC-16 narrow body - RoHS-compliant, JEDEC-standard 260 °C reflow profile, 1.27 mm pitch, creepage ≥5.5 mm.
Operating Temp –40 °C to +125 °C - qualified for industrial and automotive under-hood environments per AEC-Q100 Grade 1.

Pinout & Package

SOIC-16 narrow-body package (5.3 mm × 10.3 mm, 1.27 mm pitch) with creepage optimized for 3.75 kVRMS isolation. Pin 1 marked by dot; exposed pad not present.

Pin/Terminal Circuit Role Design Meaning
1 (VIA) Input A signal TTL-compatible high-true logic input controlling high-side output VOA; >400 mV hysteresis rejects noise.
2 (VIB) Input B signal TTL-compatible high-true logic input controlling low-side output VOB; independent of VIA with no internal coupling.
3 (GNDI) Input-side ground Reference for VIA/VIB/DT/DISABLE; galvanically isolated from output grounds GNDA/GNDB.
4 (VDDI) Input-side supply 4.5–5.5 V supply powering RF transmitter and logic; UVLO active below 5 V (–400 mV hysteresis).
5 (DISABLE) Global disable control Active-high input forcing both VOA and VOB low unconditionally; overrides all inputs when asserted.
6 (DT) Dead time programming Resistor-to-ground sets dead time (DT ≈ 10 × RDT ns); floating or tied to VDDI yields ~400 ps nominal.
7 (VOA) High-side output 4.0 A source/sink driver referenced to GNDA; designed for bootstrap-fed high-side MOSFET gate drive.
8 (GNDA) Driver A ground Output ground for VOA; may be connected to switch node or isolated reference depending on topology.
9 (VDDA) Driver A supply 9–24 V supply for VOA output stage; UVLO active below 8 V (per family spec, confirmed for AC variant).
10 (VOB) Low-side output 4.0 A source/sink driver referenced to GNDB; suitable for direct low-side IGBT/MOSFET gate drive.
11 (GNDB) Driver B ground Output ground for VOB; electrically separate from GNDA to support split-rail or floating configurations.
12 (VDDB) Driver B supply 9–24 V supply for VOB output stage; UVLO active below 8 V (per family spec, confirmed for AC variant).
13 (NC) No connect Internally unused; must remain unconnected per datasheet to avoid parasitic coupling or ESD path issues.
14 (NC) No connect Internally unused; left floating; no routing or soldering required on PCB.
15 (NC) No connect Internally unused; maintains isolation integrity; no external connection permitted.
16 (NC) No connect Internally unused; designated as no-connect in all Si823x narrow-body variants including SI8233AC-D-IS1.

Key Features

Feature Design Value
Dual isolated drivers in one package Eliminates two discrete optocouplers + gate drivers; reduces BOM count, layout area, and inter-stage propagation skew.
Programmable dead time with overlap protection Prevents shoot-through in half-bridge circuits using external RDT; configurable from ~400 ps to >1 µs without firmware.
RF-based silicon isolation Delivers 45 ns max propagation delay and superior CMTI (>100 kV/µs) vs. optocouplers, with no LED aging or temperature drift.
AEC-Q100 qualified (automotive-grade option) SI8233AC-AS1 variant available; full automotive process flow, PPAP support, IMDS/CAMDS compliance for EV traction inverters.
3.75 kVRMS reinforced insulation Meets UL 1577, VDE 60747-17, and GB4943.1 requirements for functional safety in industrial and onboard charger applications.
TTL-compatible dual inputs with hysteresis Accepts standard microcontroller GPIO outputs directly; 400 mV hysteresis rejects EMI-induced glitches in noisy motor drive environments.

Applications

Industrial Inverters Solar Power Conversion

Use Scenario: Three-phase 600–1000 Vdc string inverters converting PV DC to grid-synchronized AC.

IC Role / Device Role / Timing Role: High-side/low-side gate driver for six IGBTs in three half-bridges; provides isolated level-shifting, dead-time control, and UVLO-protected switching.

Use Value: 4.0 A drive strength ensures fast turn-on of 1200 V IGBTs; 3.75 kVRMS isolation meets IEC 62109 creepage requirements for rooftop installations.

Use Scenario: Central and string inverters with transformerless topologies requiring reinforced galvanic isolation.

IC Role / Device Role / Timing Role: Isolated gate driver for high-voltage MOSFETs in H5, HERIC, or full-bridge configurations with bipolar voltage stress.

Use Value: Dual independent outputs enable anti-islanding protection sequencing; SOIC-16 narrow-body footprint fits compact thermal layouts.

Motor Control Systems Onboard Chargers (OBC)

Use Scenario: 3–22 kW permanent magnet motor drives in HVAC compressors, pumps, and industrial automation.

IC Role / Device Role / Timing Role: Half-bridge driver for SiC MOSFETs operating at 50–150 kHz; manages shoot-through prevention via hardware dead time.

Use Value: 8 MHz max switching frequency supports ZVS/ZCS topologies; –40 °C to +125 °C rating covers extended ambient ranges.

Use Scenario: Bidirectional AC/DC conversion in 6.6–11 kW EV onboard chargers with dual active bridge (DAB) architecture.

IC Role / Device Role / Timing Role: Isolated gate driver for primary-side SiC MOSFETs handling 400–800 Vdc bus; synchronizes phase-shifted PWM across multiple bridges.

Use Value: 45 ns propagation delay minimizes timing mismatch in DAB control loops; AEC-Q100 qualification enables automotive system integration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side/low-side isolated gate drive applications.

Alternative Part Technical Difference Application Difference Selection Advice
SI8233BD-D-IS1 Same 4.0 A output and SOIC-16 narrow-body package, but 5.0 kVRMS isolation and 8 V UVLO threshold. Better suited for 1200 Vdc bus systems requiring higher isolation margin; less tolerant of low-VDDI brown-out conditions. Select when UL 5.0 kVRMS certification is mandatory and input supply stability exceeds 8 V minimum.
UCC5390SCD Texas Instruments part with 4.5 A peak output, 5.7 kVRMS isolation, and integrated Miller clamp; requires external dead-time circuitry. Offers enhanced short-circuit protection and lower propagation delay (35 ns), but lacks programmable dead time and uses SOIC-16 wide-body. Choose when Miller clamping is critical for SiC reliability and board space allows wider SOIC-16 footprint.

Compared with SI8233BD-D-IS1, SI8233AC-D-IS1 trades 1.25 kVRMS isolation margin for tighter 5 V UVLO, improving robustness in low-voltage control domains; versus UCC5390SCD, it offers integrated dead-time programming at the cost of missing Miller clamp functionality.

Availability

SI8233AC-D-IS1 is available at Aetrix Electronics and suitable for industrial inverters, solar power conversion, motor control systems, and onboard chargers requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.

Supply support for SI8233AC-D-IS1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Skyworks Solutions is a global leader in analog and mixed-signal semiconductors, specializing in RF, timing, isolation, and power management solutions for high-reliability applications.

The Si823x family was engineered specifically for isolated gate driving in high-efficiency power conversion systems, combining RF isolation technology with integrated protection features to replace optocoupler-based designs in industrial and automotive markets.

FAQ

What is the maximum recommended switching frequency for SI8233AC-D-IS1?

The SI8233AC-D-IS1 supports up to 8 MHz switching frequency as specified in the Skyworks datasheet. This capability enables use in high-frequency resonant converters and GaN-based power supplies where fast edge rates and minimal propagation delay are critical. Real-world performance depends on load capacitance and PCB layout; typical rise/fall times remain under 10 ns at 12 V supply with 1 nF load.

Does SI8233AC-D-IS1 include built-in dead time control?

Yes, SI8233AC-D-IS1 includes hardware-programmable dead time via the DT pin, which accepts an external resistor to ground (DT ≈ 10 × RDT ns). It also features automatic overlap protection that forces both outputs low if VIA and VIB are simultaneously high. This eliminates need for external logic or MCU-based dead-time insertion in half-bridge designs.

What safety certifications apply to SI8233AC-D-IS1?

SI8233AC-D-IS1 carries UL 1577 recognition (3.75 kVRMS for one minute), VDE 60747-17 (basic insulation), and CQC GB4943.1 (reinforced insulation) certifications. These approvals validate its suitability for industrial equipment and EV charging systems requiring reinforced isolation barriers per IEC 62368-1 and IEC 60601-1 standards.

Can SI8233AC-D-IS1 drive both SiC MOSFETs and IGBTs?

Yes, SI8233AC-D-IS1 is rated for 4.0 A peak source/sink current and operates up to 24 V output supply, making it compatible with gate drive requirements of both 1200 V SiC MOSFETs (Qg ≈ 30–60 nC) and 1200 V IGBTs (Qg ≈ 100–200 nC). Its 45 ns propagation delay and low output impedance ensure clean, fast switching transitions essential for high-efficiency SiC operation.

Is there an automotive-grade version of SI8233AC-D-IS1?

Yes, the automotive-grade counterpart is SI8233AC-AS1, which shares identical electrical parameters and pinout with SI8233AC-D-IS1 but is manufactured using full AEC-Q100-compliant automotive process flows. It includes AIAG-compliant PPAP documentation, IMDS/CAMDS material declarations, and zero-defect methodology throughout production.

SI8233AC-D-IS1 Specifications

Product attributes
Attribute value
Manufacturer:
Skyworks Solutions Inc.
Series:
-
Package/Case:
16-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Active
Technology:
Capacitive Coupling
Number of Channels:
2
Voltage - Isolation:
3750Vrms
Common Mode Transient Immunity (Min):
20kV/µs
Propagation Delay tpLH / tpHL (Max):
45ns, 45ns
Pulse Width Distortion (Max):
5.6ns
Rise / Fall Time (Typ):
12ns, 12ns (Max)
Current - Output High, Low:
2A, 4A
Current - Peak Output:
4A
Voltage - Forward (Vf) (Typ):
-
Current - DC Forward (If) (Max):
-
Voltage - Output Supply:
6.5V ~ 24V
Grade:
Automotive
Qualification:
AEC-Q100
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Approval Agency:
CQC, CSA, UR, VDE

SI8233AC-D-IS1 FAQ

1.How can I place an order for SI8233AC-D-IS1 through Aetrix?

Please submit a Request for Quotation (RFQ) for SI8233AC-D-IS1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI8233AC-D-IS1 reliable?

The price and inventory of SI8233AC-D-IS1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI8233AC-D-IS1 is usually 5 days.

3.What payment methods are accepted for SI8233AC-D-IS1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI8233AC-D-IS1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI8233AC-D-IS1?

SI8233AC-D-IS1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI8233AC-D-IS1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI8233AC-D-IS1?

For technical support, including SI8233AC-D-IS1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI8233AC-D-IS1 requirements.

6.How does Aetrix verify that SI8233AC-D-IS1 is sourced from the original manufacturer or authorized distributors?

All SI8233AC-D-IS1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI8233AC-D-IS1 meets industry standards.

7.What is the process for return or replacement of SI8233AC-D-IS1?

All SI8233AC-D-IS1 units undergo pre-shipment inspection (PSI). If there is an issue with SI8233AC-D-IS1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI8233AC-D-IS1 part is unused and in its original packaging.

Return procedure for SI8233AC-D-IS1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SI8233AC-D-IS1 Tags

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