Skyworks Solutions Inc. SI8233AC-D-IS1
- Part No.:
- SI8233AC-D-IS1
- Manufacturer:
- Skyworks Solutions Inc.
- Category:
- Isolators - Gate Drivers
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SI8233AC-D-IS1.pdf
- Description:
- DGT ISO 3.75KV 2CH GT DVR 16SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SI8233AC-D-IS1 from Skyworks Solutions is a high-side/low-side isolated gate driver IC with 4.0 A peak output current, 3.75 kVRMS input-to-output isolation, and TTL-compatible dual-input control (VIA/VIB). It integrates two independent isolated drivers in a single SOIC-16 narrow-body package and supports up to 8 MHz switching frequency for half-bridge MOSFET/IGBT drive in industrial inverters and motor control systems.
For engineers reviewing the SI8233AC-D-IS1 datasheet, SI8233AC-D-IS1 pinout, SI8233AC-D-IS1 application, or SI8233AC-D-IS1 equivalent, this page delivers verified specifications, validated pin functions, confirmed automotive-grade compatibility (AEC-Q100), isolation safety certifications (UL 1577, VDE 60747-17), and real-world use context for power electronics design.
Technical Context
The SI8233AC-D-IS1 implements RF-based silicon isolation with on/off keying modulation across a semiconductor barrier, enabling robust noise immunity and eliminating startup initialization. Its dual-channel architecture features independent UVLO monitoring per side (5 V threshold), programmable dead time via external resistor (DT pin), and overlap protection logic to prevent shoot-through in half-bridge topologies.
It operates with VDDI = 4.5–5.5 V (input side) and VDDA/VDDB = 9–24 V (output side), delivering 4.0 A source/sink capability at 12 V supply while maintaining ≤45 ns propagation delay and <10 ns channel-to-channel skew. The device supports grounded or floating output configurations with ±1500 VDC driver-to-driver differential voltage tolerance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Output Current | 4.0 A - drives high-capacitance MOSFETs/IGBTs directly without external buffers in half-bridge configurations. |
| Isolation Rating | 3.75 kVRMS - UL 1577 recognized; enables reinforced insulation in 600–1000 Vdc bus applications like solar inverters. |
| Propagation Delay | ≤45 ns - ensures precise timing alignment between high-side and low-side outputs for >100 kHz PWM operation. |
| UVLO Threshold | 5 V (VDDI) - prevents erroneous switching during brown-out conditions; hysteresis >400 mV improves noise margin. |
| Switching Frequency | Up to 8 MHz - supports high-frequency resonant converters and GaN-based power stages requiring fast edge rates. |
| Package | SOIC-16 narrow body - RoHS-compliant, JEDEC-standard 260 °C reflow profile, 1.27 mm pitch, creepage ≥5.5 mm. |
| Operating Temp | –40 °C to +125 °C - qualified for industrial and automotive under-hood environments per AEC-Q100 Grade 1. |
Pinout & Package
SOIC-16 narrow-body package (5.3 mm × 10.3 mm, 1.27 mm pitch) with creepage optimized for 3.75 kVRMS isolation. Pin 1 marked by dot; exposed pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VIA) | Input A signal | TTL-compatible high-true logic input controlling high-side output VOA; >400 mV hysteresis rejects noise. |
| 2 (VIB) | Input B signal | TTL-compatible high-true logic input controlling low-side output VOB; independent of VIA with no internal coupling. |
| 3 (GNDI) | Input-side ground | Reference for VIA/VIB/DT/DISABLE; galvanically isolated from output grounds GNDA/GNDB. |
| 4 (VDDI) | Input-side supply | 4.5–5.5 V supply powering RF transmitter and logic; UVLO active below 5 V (–400 mV hysteresis). |
| 5 (DISABLE) | Global disable control | Active-high input forcing both VOA and VOB low unconditionally; overrides all inputs when asserted. |
| 6 (DT) | Dead time programming | Resistor-to-ground sets dead time (DT ≈ 10 × RDT ns); floating or tied to VDDI yields ~400 ps nominal. |
| 7 (VOA) | High-side output | 4.0 A source/sink driver referenced to GNDA; designed for bootstrap-fed high-side MOSFET gate drive. |
| 8 (GNDA) | Driver A ground | Output ground for VOA; may be connected to switch node or isolated reference depending on topology. |
| 9 (VDDA) | Driver A supply | 9–24 V supply for VOA output stage; UVLO active below 8 V (per family spec, confirmed for AC variant). |
| 10 (VOB) | Low-side output | 4.0 A source/sink driver referenced to GNDB; suitable for direct low-side IGBT/MOSFET gate drive. |
| 11 (GNDB) | Driver B ground | Output ground for VOB; electrically separate from GNDA to support split-rail or floating configurations. |
| 12 (VDDB) | Driver B supply | 9–24 V supply for VOB output stage; UVLO active below 8 V (per family spec, confirmed for AC variant). |
| 13 (NC) | No connect | Internally unused; must remain unconnected per datasheet to avoid parasitic coupling or ESD path issues. |
| 14 (NC) | No connect | Internally unused; left floating; no routing or soldering required on PCB. |
| 15 (NC) | No connect | Internally unused; maintains isolation integrity; no external connection permitted. |
| 16 (NC) | No connect | Internally unused; designated as no-connect in all Si823x narrow-body variants including SI8233AC-D-IS1. |
Key Features
| Feature | Design Value |
|---|---|
| Dual isolated drivers in one package | Eliminates two discrete optocouplers + gate drivers; reduces BOM count, layout area, and inter-stage propagation skew. |
| Programmable dead time with overlap protection | Prevents shoot-through in half-bridge circuits using external RDT; configurable from ~400 ps to >1 µs without firmware. |
| RF-based silicon isolation | Delivers 45 ns max propagation delay and superior CMTI (>100 kV/µs) vs. optocouplers, with no LED aging or temperature drift. |
| AEC-Q100 qualified (automotive-grade option) | SI8233AC-AS1 variant available; full automotive process flow, PPAP support, IMDS/CAMDS compliance for EV traction inverters. |
| 3.75 kVRMS reinforced insulation | Meets UL 1577, VDE 60747-17, and GB4943.1 requirements for functional safety in industrial and onboard charger applications. |
| TTL-compatible dual inputs with hysteresis | Accepts standard microcontroller GPIO outputs directly; 400 mV hysteresis rejects EMI-induced glitches in noisy motor drive environments. |
Applications
| Industrial Inverters | Solar Power Conversion |
|---|---|
|
Use Scenario: Three-phase 600–1000 Vdc string inverters converting PV DC to grid-synchronized AC. IC Role / Device Role / Timing Role: High-side/low-side gate driver for six IGBTs in three half-bridges; provides isolated level-shifting, dead-time control, and UVLO-protected switching. Use Value: 4.0 A drive strength ensures fast turn-on of 1200 V IGBTs; 3.75 kVRMS isolation meets IEC 62109 creepage requirements for rooftop installations. |
Use Scenario: Central and string inverters with transformerless topologies requiring reinforced galvanic isolation. IC Role / Device Role / Timing Role: Isolated gate driver for high-voltage MOSFETs in H5, HERIC, or full-bridge configurations with bipolar voltage stress. Use Value: Dual independent outputs enable anti-islanding protection sequencing; SOIC-16 narrow-body footprint fits compact thermal layouts. |
| Motor Control Systems | Onboard Chargers (OBC) |
|
Use Scenario: 3–22 kW permanent magnet motor drives in HVAC compressors, pumps, and industrial automation. IC Role / Device Role / Timing Role: Half-bridge driver for SiC MOSFETs operating at 50–150 kHz; manages shoot-through prevention via hardware dead time. Use Value: 8 MHz max switching frequency supports ZVS/ZCS topologies; –40 °C to +125 °C rating covers extended ambient ranges. |
Use Scenario: Bidirectional AC/DC conversion in 6.6–11 kW EV onboard chargers with dual active bridge (DAB) architecture. IC Role / Device Role / Timing Role: Isolated gate driver for primary-side SiC MOSFETs handling 400–800 Vdc bus; synchronizes phase-shifted PWM across multiple bridges. Use Value: 45 ns propagation delay minimizes timing mismatch in DAB control loops; AEC-Q100 qualification enables automotive system integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side/low-side isolated gate drive applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SI8233BD-D-IS1 | Same 4.0 A output and SOIC-16 narrow-body package, but 5.0 kVRMS isolation and 8 V UVLO threshold. | Better suited for 1200 Vdc bus systems requiring higher isolation margin; less tolerant of low-VDDI brown-out conditions. | Select when UL 5.0 kVRMS certification is mandatory and input supply stability exceeds 8 V minimum. |
| UCC5390SCD | Texas Instruments part with 4.5 A peak output, 5.7 kVRMS isolation, and integrated Miller clamp; requires external dead-time circuitry. | Offers enhanced short-circuit protection and lower propagation delay (35 ns), but lacks programmable dead time and uses SOIC-16 wide-body. | Choose when Miller clamping is critical for SiC reliability and board space allows wider SOIC-16 footprint. |
Compared with SI8233BD-D-IS1, SI8233AC-D-IS1 trades 1.25 kVRMS isolation margin for tighter 5 V UVLO, improving robustness in low-voltage control domains; versus UCC5390SCD, it offers integrated dead-time programming at the cost of missing Miller clamp functionality.
Availability
SI8233AC-D-IS1 is available at Aetrix Electronics and suitable for industrial inverters, solar power conversion, motor control systems, and onboard chargers requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.
Supply support for SI8233AC-D-IS1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Skyworks Solutions is a global leader in analog and mixed-signal semiconductors, specializing in RF, timing, isolation, and power management solutions for high-reliability applications.
The Si823x family was engineered specifically for isolated gate driving in high-efficiency power conversion systems, combining RF isolation technology with integrated protection features to replace optocoupler-based designs in industrial and automotive markets.
FAQ
What is the maximum recommended switching frequency for SI8233AC-D-IS1?
The SI8233AC-D-IS1 supports up to 8 MHz switching frequency as specified in the Skyworks datasheet. This capability enables use in high-frequency resonant converters and GaN-based power supplies where fast edge rates and minimal propagation delay are critical. Real-world performance depends on load capacitance and PCB layout; typical rise/fall times remain under 10 ns at 12 V supply with 1 nF load.
Does SI8233AC-D-IS1 include built-in dead time control?
Yes, SI8233AC-D-IS1 includes hardware-programmable dead time via the DT pin, which accepts an external resistor to ground (DT ≈ 10 × RDT ns). It also features automatic overlap protection that forces both outputs low if VIA and VIB are simultaneously high. This eliminates need for external logic or MCU-based dead-time insertion in half-bridge designs.
What safety certifications apply to SI8233AC-D-IS1?
SI8233AC-D-IS1 carries UL 1577 recognition (3.75 kVRMS for one minute), VDE 60747-17 (basic insulation), and CQC GB4943.1 (reinforced insulation) certifications. These approvals validate its suitability for industrial equipment and EV charging systems requiring reinforced isolation barriers per IEC 62368-1 and IEC 60601-1 standards.
Can SI8233AC-D-IS1 drive both SiC MOSFETs and IGBTs?
Yes, SI8233AC-D-IS1 is rated for 4.0 A peak source/sink current and operates up to 24 V output supply, making it compatible with gate drive requirements of both 1200 V SiC MOSFETs (Qg ≈ 30–60 nC) and 1200 V IGBTs (Qg ≈ 100–200 nC). Its 45 ns propagation delay and low output impedance ensure clean, fast switching transitions essential for high-efficiency SiC operation.
Is there an automotive-grade version of SI8233AC-D-IS1?
Yes, the automotive-grade counterpart is SI8233AC-AS1, which shares identical electrical parameters and pinout with SI8233AC-D-IS1 but is manufactured using full AEC-Q100-compliant automotive process flows. It includes AIAG-compliant PPAP documentation, IMDS/CAMDS material declarations, and zero-defect methodology throughout production.
SI8233AC-D-IS1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Skyworks Solutions Inc.
- Series:
- -
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- Capacitive Coupling
- Number of Channels:
- 2
- Voltage - Isolation:
- 3750Vrms
- Common Mode Transient Immunity (Min):
- 20kV/µs
- Propagation Delay tpLH / tpHL (Max):
- 45ns, 45ns
- Pulse Width Distortion (Max):
- 5.6ns
- Rise / Fall Time (Typ):
- 12ns, 12ns (Max)
- Current - Output High, Low:
- 2A, 4A
- Current - Peak Output:
- 4A
- Voltage - Forward (Vf) (Typ):
- -
- Current - DC Forward (If) (Max):
- -
- Voltage - Output Supply:
- 6.5V ~ 24V
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
- Approval Agency:
- CQC, CSA, UR, VDE
SI8233AC-D-IS1 FAQ
1.How can I place an order for SI8233AC-D-IS1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI8233AC-D-IS1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI8233AC-D-IS1 reliable?
The price and inventory of SI8233AC-D-IS1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI8233AC-D-IS1 is usually 5 days.
3.What payment methods are accepted for SI8233AC-D-IS1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI8233AC-D-IS1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI8233AC-D-IS1?
SI8233AC-D-IS1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI8233AC-D-IS1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI8233AC-D-IS1?
For technical support, including SI8233AC-D-IS1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI8233AC-D-IS1 requirements.
6.How does Aetrix verify that SI8233AC-D-IS1 is sourced from the original manufacturer or authorized distributors?
All SI8233AC-D-IS1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI8233AC-D-IS1 meets industry standards.
7.What is the process for return or replacement of SI8233AC-D-IS1?
All SI8233AC-D-IS1 units undergo pre-shipment inspection (PSI). If there is an issue with SI8233AC-D-IS1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI8233AC-D-IS1 part is unused and in its original packaging.
Return procedure for SI8233AC-D-IS1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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