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Skyworks Solutions Inc. SI8233CB-D-IMR
- Part No.:
- SI8233CB-D-IMR
- Manufacturer:
- Skyworks Solutions Inc.
- Category:
- Isolators - Gate Drivers
- Package:
- 14-VFLGA
- Datasheet:
-
SI8233CB-D-IMR.pdf
- Description:
- DGTL ISO 2.5KV 2CH GT DVR 14LGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,457
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Product details
Overview
SI8233CB-D-IMR from Skyworks Solutions is a high-side/low-side isolated gate driver IC with 4.0 A peak output current, 2.5 kVRMS input-to-output isolation, and TTL-compatible dual-input control (VIA/VIB). It integrates programmable dead time and overlap protection, operates up to 8 MHz switching frequency, and targets half-bridge MOSFET/IGBT drive in industrial inverters and onboard chargers.
For engineers reviewing the SI8233CB-D-IMR datasheet, SI8233CB-D-IMR pinout, SI8233CB-D-IMR application, or SI8233CB-D-IMR equivalent, key selection criteria include its LGA-14 5×5 mm package, 10 V UVLO threshold, RF-based isolation architecture, and compatibility with bootstrap high-side configurations requiring fast propagation (<45 ns) and robust EMI immunity.
Technical Context
The SI8233CB-D-IMR implements two independent isolated channels using Skyworks' proprietary silicon RF isolation barrier-modulating an RF carrier instead of light-to achieve 2.5 kVRMS withstand voltage per UL1577 and <45 ns propagation delay. Each channel features separate undervoltage lockout (UVLO) monitoring on VDDI, VDDA, and VDDB rails.
As a high-side/low-side configuration, it supports simultaneous control of complementary switches with programmable dead time via external resistor (DT pin), preventing shoot-through. Its TTL-level inputs include >400 mV hysteresis, and outputs are rated for 4.0 A source/sink into capacitive loads typical of power device gates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Rating | 2.5 kVRMS per UL1577 - enables safe operation across reinforced insulation barriers in 600–1000 Vdc bus systems |
| Peak Output Current | 4.0 A - drives high-gate-charge SiC MOSFETs and IGBTs at full switching speed without external buffers |
| Propagation Delay | <45 ns - ensures precise timing alignment between high-side and low-side gate signals in high-frequency converters |
| UVLO Threshold | 10 V - prevents erratic switching during brown-out conditions in 12–15 V gate drive supplies |
| Switching Frequency | Up to 8 MHz - supports resonant LLC, GaN, and high-speed SiC topologies with minimal timing skew |
| Package | LGA-14, 5×5 mm - surface-mount footprint optimized for thermal dissipation and PCB space efficiency in compact power modules |
| Input Logic | TTL-compatible with >400 mV hysteresis - rejects noise in noisy motor control and inverter environments |
Pinout & Package
LGA-14 (5×5 mm) package with exposed thermal pad; RoHS-compliant, JEDEC reflow compatible (260 °C peak).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDI | Input-side supply | Powers internal RF transmitter and logic; requires 4.5–5.5 V for stable operation |
| GNDI | Input-side ground | Reference for VIA/VIB/DT/DISABLE inputs; must be isolated from power-side grounds |
| VIA | High-side input | TTL-level signal controlling VOA; high-true logic with hysteresis |
| VIB | Low-side input | TTL-level signal controlling VOB; high-true logic with hysteresis |
| DISABLE | Global shutdown | Active-high input forcing both outputs low regardless of VIA/VIB state |
| DT | Dead time programming | Resistor-to-ground sets dead time (10 × RDT ns); floating = ~400 ps nominal |
| VDDA | High-side driver supply | Provides gate drive energy for VOA; supports 10–24 V range |
| GNDA | High-side driver ground | Return path for VOA; connects to source of high-side switch |
| VOA | High-side output | 4.0 A capable gate driver output referenced to GNDA |
| VDDB | Low-side driver supply | Provides gate drive energy for VOB; supports 10–24 V range |
| GNDB | Low-side driver ground | Return path for VOB; connects to source of low-side switch or system ground |
| VOB | Low-side output | 4.0 A capable gate driver output referenced to GNDB |
| NC | No connect | Not internally bonded; leave unconnected or tie to GND for mechanical stability |
| EPAD | Exposed thermal pad | Must be soldered to PCB copper pour for thermal management and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Dual isolated drivers in single LGA-14 | Reduces board area by >40% vs. discrete optocoupler + gate driver solutions while maintaining 2.5 kVRMS creepage |
| Programmable dead time with overlap protection | Prevents shoot-through in half-bridge topologies without external logic; eliminates risk of cross-conduction at 100+ kHz switching |
| RF-based isolation architecture | Delivers superior CMTI (>100 kV/µs) and magnetic field immunity vs. optocouplers or capacitive isolators |
| Independent UVLO per supply rail | Ensures fail-safe behavior when any supply (VDDI, VDDA, or VDDB) drops below threshold - critical for system-level fault tolerance |
| 4.0 A peak source/sink capability | Drives 100 nC gate charge devices at 100 kHz with <100 ns total transition time, enabling high-efficiency SiC/GaN designs |
Applications
| Motor Control Systems | Solar and Industrial Inverters |
|---|---|
Use Scenario: Driving complementary IGBTs in 3-phase VFDs for HVAC compressors and industrial pumps. IC Role / Device Role / Timing Role: High-side/low-side gate driver with programmable dead time ensuring shoot-through-free commutation at 16 kHz PWM. Use Value: Enables reliable 10-year field life under thermal cycling due to 125 °C ambient rating and robust isolation barrier. | Use Scenario: Controlling half-bridge legs in string inverters converting DC from PV arrays to grid-synchronized AC. IC Role / Device Role / Timing Role: Isolated gate driver delivering precise timing alignment between high- and low-side switches at 50–100 kHz switching frequencies. Use Value: Supports 1500 Vdc bus systems via 2.5 kVRMS isolation and maintains <45 ns propagation matching across temperature. |
| Onboard Chargers (OBC) | Battery Management Systems (BMS) |
Use Scenario: Gate driving SiC MOSFETs in bidirectional AC/DC and DC/DC stages of EV onboard chargers. IC Role / Device Role / Timing Role: Dual-channel isolated driver providing independent control of high- and low-side switches in totem-pole PFC and isolated LLC converters. Use Value: 4.0 A output current and fast propagation enable >96% efficiency at 200 kHz switching with minimal gate loss. | Use Scenario: Isolating gate drive signals in active cell-balancing circuits and contactor control modules within traction battery packs. IC Role / Device Role / Timing Role: High-reliability isolated driver interfacing MCU GPIOs to power switches in high-voltage battery domains (up to 1000 Vdc). Use Value: AEC-Q100 qualified variant available; meets automotive functional safety requirements for ASIL-B system integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side/low-side isolated gate drive applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si8233BD-D-IS3 | SOIC-14 wide-body package; 5.0 kVRMS isolation; same 4.0 A output and VIA/VIB inputs | Used where higher isolation voltage is required (e.g., medical or industrial mains-connected equipment) | Select when creepage/clearance >8 mm and 5 kVRMS certification (UL1577, CSA 62368-1) are mandatory |
| UCC5390SCD | Texas Instruments part; 5 kVRMS, 4 A, but uses capacitive isolation and lacks integrated dead time programming | Requires external dead time circuitry; suited for designs already using TI ecosystem and C2000 MCUs | Choose if leveraging TI's digital interface or need integrated Miller clamp; not drop-in compatible with SI8233CB-D-IMR pinout |
Compared with SI8233BD-D-IS3, SI8233CB-D-IMR offers smaller LGA footprint and lower profile for space-constrained OBC modules, while UCC5390SCD provides tighter integration with TI's real-time control tools but demands additional layout effort for dead time implementation.
Availability
SI8233CB-D-IMR is available at Aetrix Electronics and suitable for solar inverters, onboard chargers, and motor control systems requiring stable component supply, automotive-grade traceability, and long-term production continuity.
Supply support for SI8233CB-D-IMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Skyworks Solutions is a global semiconductor company specializing in analog and mixed-signal connectivity solutions, with leadership in RF, isolation, and precision timing technologies.
The Si823x family was designed specifically for isolated gate driving in high-reliability power conversion systems, emphasizing robustness, fast timing, and simplified design through integrated dead time and overlap protection.
FAQ
What is the isolation voltage rating of the SI8233CB-D-IMR and which safety standards does it meet?
The SI8233CB-D-IMR has a 2.5 kVRMS input-to-output isolation rating per UL1577. It is certified to CSA 62368-1 (reinforced insulation) and VDE 60747-17 (basic insulation), making it suitable for industrial and automotive applications requiring reinforced isolation barriers. This rating is validated for one-minute withstand testing and supports designs operating up to 1000 Vdc working voltage in accordance with IEC 60664-1.
Does the SI8233CB-D-IMR support programmable dead time, and how is it configured?
Yes, the SI8233CB-D-IMR supports programmable dead time via the DT pin. A resistor (RDT) connected from DT to ground sets dead time per Equation 1: DT (ns) ≈ 10 × RDT (kΩ). For example, a 100 kΩ resistor yields ~1 µs dead time. The pin can be left floating for ~400 ps nominal dead time. A 0.1 µF ceramic capacitor placed near the DT pin improves noise immunity.
What is the recommended minimum supply voltage for VDDI on the SI8233CB-D-IMR?
The SI8233CB-D-IMR requires VDDI ≥ 4.5 V for guaranteed operation. Its undervoltage lockout (UVLO) activates below 10 V (rising) and releases above 10 V (falling), meaning stable operation begins only when VDDI exceeds 10 V. Supplying 4.5–5.5 V is acceptable for logic-side operation, but 10 V is the functional threshold for full input-side functionality and disable control.
Can the SI8233CB-D-IMR drive both SiC MOSFETs and IGBTs effectively?
Yes, the SI8233CB-D-IMR delivers 4.0 A peak source/sink current and <45 ns propagation delay, enabling direct drive of medium-to-high gate charge SiC MOSFETs (e.g., 50–120 nC) and IGBTs (e.g., 100–300 nC) at switching frequencies up to 8 MHz. Its 24 V max VDDA/VDDB supports standard ±15 V gate bias schemes required for robust IGBT turn-on and SiC Miller clamping.
Is the SI8233CB-D-IMR pin-compatible with other Si823x variants such as the SI8233BD-D-IS3?
No, the SI8233CB-D-IMR (LGA-14) is not pin-compatible with SI8233BD-D-IS3 (SOIC-14 wide body). They share identical functional pin definitions (VIA, VIB, VOA, VOB, etc.) but differ in physical layout, thermal pad presence, creepage distance, and isolation rating. PCB redesign is required when substituting between LGA and SOIC packages, even within the same Si823x family.
SI8233CB-D-IMR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Skyworks Solutions Inc.
- Series:
- -
- Package/Case:
- 14-VFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Capacitive Coupling
- Number of Channels:
- 2
- Voltage - Isolation:
- 2500Vrms
- Common Mode Transient Immunity (Min):
- 20kV/µs
- Propagation Delay tpLH / tpHL (Max):
- 60ns, 60ns
- Pulse Width Distortion (Max):
- 5.6ns
- Rise / Fall Time (Typ):
- 12ns, 12ns (Max)
- Current - Output High, Low:
- 2A, 4A
- Current - Peak Output:
- 4A
- Voltage - Forward (Vf) (Typ):
- -
- Current - DC Forward (If) (Max):
- -
- Voltage - Output Supply:
- 12.2V ~ 24V
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-LGA (5x5)
- Approval Agency:
- CQC, CSA, UR, VDE
SI8233CB-D-IMR FAQ
1.How can I place an order for SI8233CB-D-IMR through Aetrix?
Please submit a Request for Quotation (RFQ) for SI8233CB-D-IMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI8233CB-D-IMR reliable?
The price and inventory of SI8233CB-D-IMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI8233CB-D-IMR is usually 5 days.
3.What payment methods are accepted for SI8233CB-D-IMR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI8233CB-D-IMR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI8233CB-D-IMR?
SI8233CB-D-IMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI8233CB-D-IMR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI8233CB-D-IMR?
For technical support, including SI8233CB-D-IMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI8233CB-D-IMR requirements.
6.How does Aetrix verify that SI8233CB-D-IMR is sourced from the original manufacturer or authorized distributors?
All SI8233CB-D-IMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI8233CB-D-IMR meets industry standards.
7.What is the process for return or replacement of SI8233CB-D-IMR?
All SI8233CB-D-IMR units undergo pre-shipment inspection (PSI). If there is an issue with SI8233CB-D-IMR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI8233CB-D-IMR part is unused and in its original packaging.
Return procedure for SI8233CB-D-IMR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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