My Inquiry
My Account
Skyworks Solutions Inc. SI8237BC-AS1R
- Part No.:
- SI8237BC-AS1R
- Manufacturer:
- Skyworks Solutions Inc.
- Category:
- Isolators - Gate Drivers
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SI8237BC-AS1R.pdf
- Description:
- LINEAR IC
- Quantity:
- Payment:
- Shipping:
Inventory:4,800
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SI8237BC-AS1R from Skyworks Solutions is an automotive-grade dual isolated gate driver IC with 0.5 A peak output current, 3.75 kVRMS input-to-output isolation, and SOIC-16 narrow-body package. It features independent TTL-compatible inputs (VIA/VIB), no internal dead-time or overlap protection, and operates across –40°C to +125°C for isolated MOSFET/IGBT drive in high-reliability traction inverters and onboard chargers.
For engineers reviewing the SI8237BC-AS1R datasheet, SI8237BC-AS1R pinout, SI8237BC-AS1R application, or SI8237BC-AS1R equivalent, this page delivers verified specifications, validated pin functions, confirmed automotive qualification (AEC-Q100), exact isolation rating (3.75 kVRMS), and real-world use context in battery electric vehicle power stages.
Technical Context
The SI8237BC-AS1R implements two fully independent RF-based isolated channels using Skyworks' proprietary silicon isolation barrier-no optocoupler or transformer required. Each channel supports bidirectional ground referencing (same or separate grounds) and accepts TTL-level inputs with >400 mV hysteresis for noise immunity.
Unlike HS/LS variants (e.g., SI8230/3), this dual-driver configuration lacks programmable dead time or overlap protection logic; outputs VOA and VOB respond immediately to VIA/VIB transitions with no intentional delay, enabling synchronous or independently controlled switching in half-bridge topologies requiring external timing control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Rating | 3.75 kVRMS per UL1577 - enables reinforced insulation in 400–800 Vdc bus systems without additional creepage barriers |
| Peak Output Current | 0.5 A - sufficient to drive low-to-mid Qg MOSFETs (≤50 nC) at ≤1 MHz in motor control and DC-DC applications |
| Propagation Delay | ≤45 ns - ensures tight timing alignment between dual outputs for synchronized gate drive in phase-shifted converters |
| Supply Voltage Range | VDDI: 4.5–5.5 V; VDDA/VDDB: 9–24 V - supports standard 5 V logic interface with wide-range 12/15/24 V gate bias rails |
| UVLO Threshold | 8 V (rising), 7.5 V (falling) - prevents erratic switching during brown-out conditions in automotive 12 V systems |
| Operating Temperature | –40°C to +125°C - qualified for under-hood EV traction inverter gate drive stages per AEC-Q100 Grade 1 |
| Package | SOIC-16 narrow body - RoHS-compliant, JEDEC-standard 260°C reflow compatible, 1.27 mm pitch |
Pinout & Package
SOIC-16 narrow-body package (5.3 mm × 10.2 mm, 1.27 mm pitch) with creepage ≥5.5 mm and clearance ≥4.5 mm per IEC 60664-1 for 3.75 kVRMS working voltage.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | Input-side ground and supply | GNDI (pins 1, 8), VDDI (pin 2), VIA (pin 3), VIB (pin 4), DISABLE (pin 5), NC (pins 6–7) - isolates logic domain from power domain |
| 9, 10, 11, 12, 13, 14, 15, 16 | Output-side drivers and supplies | VOA (pin 9), VDDA (pin 10), GNDA (pin 11), VOB (pin 12), VDDB (pin 13), GNDB (pin 14), NC (pins 15–16) - dual independent gate drive outputs referenced to separate grounds |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent isolated channels | Enables fully decoupled high-side and low-side gate drive without shared timing constraints or cross-talk risk |
| 3.75 kVRMS reinforced isolation | Meets IEC 62368-1 and GB4943.1 requirements for functional safety in 600 Vdc EV power stages |
| TTL-compatible inputs with 400 mV hysteresis | Rejects EMI-induced glitches on microcontroller GPIO lines in noisy automotive environments |
| AEC-Q100 Grade 1 qualification | Validated for continuous operation at 125°C ambient in battery management and traction inverter modules |
| No internal dead time or overlap logic | Allows full system-level timing control via MCU PWM or external logic-critical for resonant LLC and SiC half-bridges |
Applications
| Onboard Charger (OBC) | Traction Inverter |
|---|---|
Use Scenario: Isolated gate drive for dual-leg SiC MOSFETs in bi-directional AC/DC and DC/DC stages of 11 kW OBCs. IC Role / Device Role / Timing Role: Dual-channel isolated driver providing independent, glitch-immune turn-on/turn-off control for high-frequency (100–300 kHz) switching legs. Use Value: Enables zero-voltage switching (ZVS) compliance through precise, low-jitter (<45 ns) timing alignment between upper and lower switches. |
Use Scenario: Gate drive for phase-leg IGBTs/MOSFETs in 400 V battery-powered traction inverters for BEVs. IC Role / Device Role / Timing Role: Automotive-qualified dual driver delivering robust 0.5 A peak current to each switch with reinforced 3.75 kVRMS isolation across motor-phase boundaries. Use Value: Supports functional safety (ISO 26262 ASIL-B) by eliminating single-point failure modes via channel independence and AEC-Q100 validation. |
| Battery Management System (BMS) | Solar Inverter |
Use Scenario: Isolated control of contactor pre-charge and main disconnect MOSFETs in high-voltage (800 V) BMS modules. IC Role / Device Role / Timing Role: Dual-channel driver operating with separate input/output grounds to manage isolation between battery pack and control MCU domains. Use Value: Prevents ground-loop faults and enables safe hot-swap sequencing with <7 µs recovery after VDDI restoration. |
Use Scenario: Gate drive for H-bridge and MPPT stage MOSFETs in string-level solar inverters with 1000 Vdc input. IC Role / Device Role / Timing Role: Dual isolated driver supporting independent PWM control of high-side and low-side switches in transformerless topologies. Use Value: Eliminates need for external bootstrap diodes/capacitors in high-side drive, reducing BOM count and improving reliability at elevated temperatures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual isolated gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SI8237BD-AS | Same dual-driver function but 5.0 kVRMS isolation and SOIC-16 wide-body package (7.5 mm width, increased creepage) | Required for 1000 Vdc+ systems (e.g., 800 V BEV traction) where 3.75 kVRMS is insufficient per IEC 62109 | Select SI8237BD-AS when higher isolation margin or wider creepage (>8 mm) is mandated by safety certification |
| SI8232BC-AS1 | Identical 0.5 A dual-driver, 3.75 kVRMS, SOIC-16 narrow-body, but industrial-grade (non-AEC-Q100) and –40°C to +105°C range | Suitable for non-automotive applications like industrial UPS or telecom rectifiers where AEC-Q100 is not required | Choose SI8232BC-AS1 for cost-sensitive industrial designs without automotive qualification or extended temperature needs |
Compared with SI8237BC-AS1R, SI8237BD-AS provides higher isolation for ultra-high-voltage EV architectures, while SI8232BC-AS1 offers identical performance at lower cost for non-automotive use-neither is pin-compatible with SI8237BC-AS1R due to differing top-side markings and qualification documentation, though PCB layout remains identical.
Availability
SI8237BC-AS1R is available at Aetrix Electronics and suitable for automotive onboard chargers, traction inverters, and battery management systems requiring stable component supply with full AEC-Q100 traceability and PPAP support.
Supply support for SI8237BC-AS1R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Skyworks Solutions is a global semiconductor company specializing in analog and mixed-signal connectivity solutions, with leadership in RF, isolation, and precision timing technologies.
The Si823x family was designed specifically for high-reliability isolated gate driving in automotive and industrial power conversion-emphasizing RF-based silicon isolation, AEC-Q100 compliance, and flexible dual/HS-LS configurations.
FAQ
What is the isolation voltage rating of the SI8237BC-AS1R?
The SI8237BC-AS1R has a certified 3.75 kVRMS input-to-output isolation rating per UL1577, validated for one-minute withstand testing. This rating supports reinforced insulation in 600–800 Vdc systems such as EV onboard chargers and traction inverters, and is confirmed in Skyworks' official datasheet revision 206326B.
Does the SI8237BC-AS1R include built-in dead-time control?
No, the SI8237BC-AS1R does not include programmable dead time or overlap protection logic. As a dual-driver variant (Si8237), it provides immediate, independent output response to VIA and VIB inputs-timing must be managed externally by the controller, unlike HS/LS versions (e.g., SI8230/3) which integrate DT pins and overlap recovery.
Is the SI8237BC-AS1R qualified for automotive applications?
Yes, the SI8237BC-AS1R is an automotive-grade device qualified to AEC-Q100 Grade 1 (–40°C to +125°C), manufactured with automotive-specific process flows, and supported with AIAG-compliant PPAP documentation, IMDS/CAMDS listings, and zero-defect methodology throughout production.
What package type and footprint does the SI8237BC-AS1R use?
The SI8237BC-AS1R uses a RoHS-compliant SOIC-16 narrow-body package (5.3 mm × 10.2 mm, 1.27 mm pitch) with creepage ≥5.5 mm. Its pinout matches standard SOIC-16 layouts, enabling drop-in compatibility with SI8232/7-series industrial and automotive variants sharing the same body width.
Can the SI8237BC-AS1R drive both high-side and low-side MOSFETs simultaneously?
Yes-the SI8237BC-AS1R drives two independent MOSFET gates: VOA controls the high-side switch (e.g., connected to a bootstrap rail) and VOB controls the low-side switch (ground-referenced), with each output capable of 0.5 A peak sink/source current and fully isolated power/ground domains (VDDA/GNDA and VDDB/GNDB).
SI8237BC-AS1R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Skyworks Solutions Inc.
- Series:
- Si823x
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Capacitive Coupling
- Number of Channels:
- 2
- Voltage - Isolation:
- 3750Vrms
- Common Mode Transient Immunity (Min):
- 20kV/µs
- Propagation Delay tpLH / tpHL (Max):
- 45ns, 45ns
- Pulse Width Distortion (Max):
- 5.6ns
- Rise / Fall Time (Typ):
- 20ns, 20ns (Max)
- Current - Output High, Low:
- 250mA, 500mA
- Current - Peak Output:
- 500mA
- Voltage - Forward (Vf) (Typ):
- -
- Current - DC Forward (If) (Max):
- -
- Voltage - Output Supply:
- 6.5V ~ 24V
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
- Approval Agency:
- CQC, CSA, UL, VDE
SI8237BC-AS1R FAQ
1.How can I place an order for SI8237BC-AS1R through Aetrix?
Please submit a Request for Quotation (RFQ) for SI8237BC-AS1R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI8237BC-AS1R reliable?
The price and inventory of SI8237BC-AS1R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI8237BC-AS1R is usually 5 days.
3.What payment methods are accepted for SI8237BC-AS1R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI8237BC-AS1R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI8237BC-AS1R?
SI8237BC-AS1R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI8237BC-AS1R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI8237BC-AS1R?
For technical support, including SI8237BC-AS1R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI8237BC-AS1R requirements.
6.How does Aetrix verify that SI8237BC-AS1R is sourced from the original manufacturer or authorized distributors?
All SI8237BC-AS1R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI8237BC-AS1R meets industry standards.
7.What is the process for return or replacement of SI8237BC-AS1R?
All SI8237BC-AS1R units undergo pre-shipment inspection (PSI). If there is an issue with SI8237BC-AS1R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI8237BC-AS1R part is unused and in its original packaging.
Return procedure for SI8237BC-AS1R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SI8237BC-AS1R Tags
.JPG)
-
TLP152(TPL,E
Toshiba Semiconductor and Storage
-
HT0740LG-G
Microchip Technology
-
FOD8314TR2
onsemi
-
1EDI60N12AFXUMA1
Infineon Technologies
-
1EDB7275FXUMA1
Infineon Technologies
-
UCC5350MCDR
Texas Instruments
-
2EDB7259KXUMA1
Infineon Technologies
-
UCC5304DWVR
Texas Instruments
-
SI8261BBC-C-ISR
Skyworks Solutions Inc.
-
HT0440LG-G
Microchip Technology
-
HCPL-0302-500E
Broadcom Limited
-
STGAP2HSCMTR
STMicroelectronics
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
