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Skyworks Solutions Inc. SI8273BBD-IS1R

Part No.:
SI8273BBD-IS1R
Manufacturer:
Skyworks Solutions Inc.
Category:
Isolators - Gate Drivers
Package:
16-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSI8273BBD-IS1R.pdf
Description:
DGTL ISO 2.5KV 2CH GT DVR 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,368

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Product details

Overview

SI8273BBD-IS1R from Skyworks Solutions is a dual-channel isolated gate driver IC designed for high-side/low-side MOSFET and IGBT control in half-bridge power stages. It delivers 4 A peak output current per channel, supports 2.5 kVRMS isolation (UL1577), achieves ≤60 ns propagation delay, and features built-in overlap protection - enabling robust operation in solar inverters, motor drives, and onboard chargers.

For engineers reviewing the SI8273BBD-IS1R datasheet, SI8273BBD-IS1R pinout, SI8273BBD-IS1R application, or SI8273BBD-IS1R equivalent, key selection considerations include its dual independent digital inputs (VIA/VIB), separate pull-up/pull-down outputs for slew rate control, 200 kV/µs CMTI immunity, and AEC-Q100 qualification for automotive-grade reliability.

Technical Context

The SI8273BBD-IS1R implements two independent RF-based isolation channels with semiconductor barrier technology, each driving a high-side/low-side pair via dedicated VO+ and VO– outputs per channel. Its logic inputs are TTL-compatible with >400 mV hysteresis, and it incorporates per-channel undervoltage lockout (UVLO) on both input (VDDI) and output supplies (VDDA/VDDB).

It provides hardware-level overlap protection to prevent shoot-through by forcing complementary outputs into safe states during simultaneous high inputs, and supports flexible grounding - allowing VOA/VOB outputs to reference same or separate grounds, or connect to positive/negative voltages up to 30 V.

Key Specifications

Parameter Value and Actual Design Meaning
Isolation Withstand Voltage 2.5 kVRMS per UL1577 - enables reinforced insulation in 1000 V DC bus systems
Peak Output Current 4 A per channel - sufficient to drive high-gate-charge SiC/GaN FETs without external buffers
Propagation Delay ≤60 ns max - ensures tight timing control in high-frequency (>100 kHz) PWM applications
CMTI Immunity 200 kV/µs - maintains signal integrity in noisy inverter switching environments
Supply Voltage Range VDDI: 2.5–5.5 V; VDDA/VDDB: 4.2–30 V - supports wide-input microcontrollers and diverse gate drive rail configurations
Operating Temperature –40 °C to +125 °C - qualified for under-hood automotive and industrial ambient conditions
Timing Jitter 200 ps p-p - minimizes phase error in synchronized multi-phase power converters

Pinout & Package

SI8273BBD-IS1R is housed in a 16-pin SOIC package with creepage/clearance optimized for reinforced isolation. Pin assignments follow the Si8273 family layout with dual independent control inputs and separated driver supplies.

Pin/Terminal Circuit Role Design Meaning
1, 2 VIA / VIB Dual TTL-compatible digital inputs - control VOA and VOB independently; >400 mV hysteresis rejects noise
3, 8 VDDI Input-side power supply - powers isolation transmitter and logic; 2.5–5.5 V range matches MCU I/O rails
4 GNDI Input-side ground reference - forms isolation barrier boundary with GNDx pins
5 EN Global enable - forces both outputs low when asserted; critical for fault-safe shutdown
6, 7, 12, 13 NC No-connect - must remain unconnected per datasheet; no internal connection or function
9, 11 GNDB / GNDA Driver-side ground references - separate grounds allow floating high-side operation
10, 15 VOB / VOA Complementary gate drive outputs - VO+ pulls high, VO– pulls low; 4 A peak sustains fast FET switching
14, 16 VDDB / VDDA Driver-side power supplies - independently powered rails (4.2–30 V) enable asymmetric gate biasing

Key Features

Feature Design Value
Separate pull-up/pull-down outputs Enables independent slew rate control of rising/falling edges - reduces EMI and prevents ringing on long gate traces
Hardware overlap protection Prevents shoot-through by forcing safe state when VIA = VIB = high - eliminates need for external dead-time logic
Dedicated enable pin (EN) Unconditionally disables both outputs within tSD - integrates cleanly with system fault detection and safety shutdown paths
AEC-Q100 qualification Validated for automotive use including PPAP support and IMDS/CAMDS compliance - meets functional safety readiness requirements
200 kV/µs CMTI Withstands rapid common-mode transients in high-dV/dt inverter legs - avoids false triggering during IGBT/SiC switching

Applications

Solar Power Inverter Onboard Charger (OBC)

Use Scenario: Driving high-voltage half-bridge SiC FETs in 800 V DC-link battery-to-AC conversion stages.

IC Role / Device Role / Timing Role: Isolated dual gate driver providing independent control of high-side and low-side switches with overlap protection.

Use Value: 4 A peak output current and 60 ns propagation delay enable efficient 100+ kHz switching while maintaining shoot-through immunity.

Use Scenario: Controlling bidirectional AC/DC and DC/DC power stages in EV onboard chargers with 400–1000 V battery interfaces.

IC Role / Device Role / Timing Role: Reinforced-isolation gate driver ensuring safe separation between MCU control domain and high-power primary/secondary sides.

Use Value: 2.5 kVRMS isolation rating and AEC-Q100 qualification meet automotive functional safety and regulatory requirements.

Motor Control Drive Battery Management System (BMS)

Use Scenario: Gate driving IGBTs in industrial servo drives operating at 600 V DC bus with high transient immunity demands.

IC Role / Device Role / Timing Role: High-CMTI isolated driver delivering precise timing and fault-tolerant operation in noisy factory environments.

Use Value: 200 kV/µs CMTI prevents misfiring during motor phase commutation transients, improving system reliability.

Use Scenario: Isolating gate drive signals in active cell-balancing circuits and high-side switch control within modular BMS stacks.

IC Role / Device Role / Timing Role: Dual-channel isolator enabling independent control of multiple balancing FETs across 100+ cell strings.

Use Value: Separate VDDA/VDDB supplies and GNDA/GNDB pins allow fully floating operation across stacked battery modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar isolated gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si8273ABD-IS1R Same pinout and specs, but rated for –55 °C to +125 °C (ZS suffix); higher temp grade with extended UVLO thresholds Required for extreme cold-start automotive applications (e.g., arctic BEV traction inverters) Select when operation below –40 °C is mandatory; otherwise SI8273BBD-IS1R suffices for standard automotive/industrial use
UCC5390SCD TI part with integrated Miller clamp, lower 3.5 A peak output, 3.75 kVRMS isolation, and different enable logic polarity Better suited for designs requiring active Miller clamping in high-dV/dt GaN applications Choose UCC5390SCD only if Miller clamping is required; SI8273BBD-IS1R offers superior CMTI and simpler interface for standard half-bridge control

Compared with SI8273BBD-IS1R, Si8273ABD-IS1R extends temperature capability without changing footprint or timing, while UCC5390SCD trades CMTI and peak current for integrated protection features - making SI8273BBD-IS1R optimal for high-noise, high-current, automotive-qualified half-bridge systems.

Availability

SI8273BBD-IS1R is available at Aetrix Electronics and suitable for solar power inverters, onboard chargers, and motor control drives requiring stable component supply, automotive-grade reliability, and reinforced isolation certification.

Supply support for SI8273BBD-IS1R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Skyworks Solutions is a global leader in analog and mixed-signal semiconductors, specializing in RF, timing, isolation, and power management solutions for high-performance wireless and power systems.

The Si827x product line was engineered specifically for isolated gate driving in high-efficiency, high-reliability power conversion - targeting automotive electrification, renewable energy, and industrial automation where optocoupler limitations are unacceptable.

FAQ

What is the isolation rating and safety certification status of the SI8273BBD-IS1R?

The SI8273BBD-IS1R provides 2.5 kVRMS withstand voltage per UL1577 and carries UL recognition, CSA 62368-1 (basic insulation), VDE 60747-17 (basic insulation), and CQC GB4943.1 certifications. These approvals confirm its suitability for reinforced insulation in end equipment requiring functional safety compliance, including automotive and industrial power systems.

Does the SI8273BBD-IS1R support independent high-side and low-side gate drive configurations?

Yes, the SI8273BBD-IS1R supports fully independent high-side and low-side operation: VOA and VOB can each be configured as either high-side or low-side drivers by referencing their respective GNDA/GNDB and VDDA/VDDB supplies to appropriate potentials. Its architecture allows floating operation up to 1500 V differential between outputs without damage.

How does the overlap protection function in the SI8273BBD-IS1R during simultaneous input assertion?

When both VIA and VIB are high simultaneously, the SI8273BBD-IS1R's hardware overlap protection forces VOA and VOB into a safe low state - preventing shoot-through in half-bridge topologies. This behavior is defined in the truth table and requires no external logic or software intervention, enhancing system robustness during fault conditions.

What are the supply voltage requirements for the SI8273BBD-IS1R's input and output sides?

The SI8273BBD-IS1R requires VDDI = 2.5–5.5 V on the input side (compatible with 3.3 V or 5 V MCUs) and separate VDDA/VDDB = 4.2–30 V on the output side for gate driving. Each output supply has independent UVLO monitoring, ensuring safe disablement if either rail drops below specification.

Is the SI8273BBD-IS1R pin-compatible with other Si827x variants such as the Si8274 or Si8275?

No - the SI8273BBD-IS1R uses a 16-pin SOIC package with dual digital inputs (VIA/VIB) and is not pin-compatible with Si8274 (PWM input + DT pin) or Si8275 (dual independent drivers without overlap logic). Pin assignments differ significantly across the Si827x family, requiring PCB redesign for substitution.

SI8273BBD-IS1R Specifications

Product attributes
Attribute value
Manufacturer:
Skyworks Solutions Inc.
Series:
Si827x
Package/Case:
16-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
RF Coupling
Number of Channels:
2
Voltage - Isolation:
2500Vrms
Common Mode Transient Immunity (Min):
150kV/µs
Propagation Delay tpLH / tpHL (Max):
60ns, 60ns
Pulse Width Distortion (Max):
8ns
Rise / Fall Time (Typ):
10.5ns, 13.3ns
Current - Output High, Low:
1.8A, 4A
Current - Peak Output:
4A
Voltage - Forward (Vf) (Typ):
-
Current - DC Forward (If) (Max):
-
Voltage - Output Supply:
9.6V ~ 30V
Grade:
-
Qualification:
-
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Approval Agency:
CQC, CSA, UR, VDE

SI8273BBD-IS1R FAQ

1.How can I place an order for SI8273BBD-IS1R through Aetrix?

Please submit a Request for Quotation (RFQ) for SI8273BBD-IS1R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI8273BBD-IS1R reliable?

The price and inventory of SI8273BBD-IS1R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI8273BBD-IS1R is usually 5 days.

3.What payment methods are accepted for SI8273BBD-IS1R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI8273BBD-IS1R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI8273BBD-IS1R?

SI8273BBD-IS1R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI8273BBD-IS1R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI8273BBD-IS1R?

For technical support, including SI8273BBD-IS1R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI8273BBD-IS1R requirements.

6.How does Aetrix verify that SI8273BBD-IS1R is sourced from the original manufacturer or authorized distributors?

All SI8273BBD-IS1R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI8273BBD-IS1R meets industry standards.

7.What is the process for return or replacement of SI8273BBD-IS1R?

All SI8273BBD-IS1R units undergo pre-shipment inspection (PSI). If there is an issue with SI8273BBD-IS1R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI8273BBD-IS1R part is unused and in its original packaging.

Return procedure for SI8273BBD-IS1R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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