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Skyworks Solutions Inc. SKY66409-11
- Part No.:
- SKY66409-11
- Manufacturer:
- Skyworks Solutions Inc.
- Category:
- RF Front End (LNA + PA)
- Package:
- 12-BGA, CSPBGA
- Datasheet:
-
SKY66409-11.pdf
- Description:
- SKY66409-11 EVALUATION BOARD CSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,291
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Product details
Overview
SKY66409-11 from Skyworks is a 5G NR sub-6 GHz front-end module (FEM) integrating PA, switch, and LNA for n77/n78/n79 bands; operates from 3.3–4.2 GHz, delivers +29 dBm POUT at 28 dB gain with 32% PAE, and supports 100 MHz bandwidth for 5G mobile infrastructure and user equipment.
For engineers reviewing the SKY66409-11 datasheet, SKY66409-11 pinout, SKY66409-11 application, or SKY66409-11 equivalent, key selection criteria include its integrated Tx/Rx path, 3.3–4.2 GHz frequency coverage, 28 dB small-signal gain, 32% power-added efficiency at +29 dBm, and 1.8 V/3.3 V dual-supply operation.
Technical Context
The SKY66409-11 integrates a high-efficiency GaAs pHEMT power amplifier, a low-loss SPDT transmit/receive switch, and a high-linearity LNA with bypass mode in a single-module architecture. It supports TDD operation with integrated harmonic filtering and DC blocking on all RF ports.
Designed for envelope tracking (ET) and average power tracking (APT) systems, the SKY66409-11 features a dedicated VCC_PA control pin and bias-adjustable gain modes to optimize linearity versus efficiency trade-offs across modulation schemes including 256-QAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Freq Range | 3.3–4.2 GHz: Covers full n77 (3.3–3.8 GHz), n78 (3.3–3.8 GHz), and n79 (4.4–5.0 GHz partial) 5G bands. |
| POUT @ 28 dB Gain | +29 dBm: Delivers sufficient output for 100 MHz 5G NR channel bandwidth with ACLR < –45 dBc. |
| PAE | 32% @ +29 dBm: Enables thermal management in compact smartphone and CPE form factors. |
| Small-Signal Gain | 28 dB: Provides system-level link budget margin without external driver stages. |
| Supply Voltages | 1.8 V (VCTL) / 3.3 V (VCC_PA): Supports dual-rail power management for dynamic bias control. |
| Harmonic Suppression | –45 dBc @ 2× fRF: Meets 3GPP spectral mask requirements without external filtering. |
Pinout & Package
Package: 3.0 × 3.0 × 0.55 mm, 16-pin QFN with exposed thermal pad (MSL3, 260°C reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC_PA | PA supply input | 3.3 V rail for power amplifier core; requires local 100 nF decoupling. |
| VCTL | Control voltage input | 1.8 V logic interface for mode selection and bias programming. |
| ANT | Antenna interface | Single-port RF I/O shared between Tx and Rx paths via internal switch. |
| RF_IN | Transmit input | 50 Ω matched input for baseband/modem RF signal; DC blocked. |
| RF_OUT | Receive output | 50 Ω matched LNA output to transceiver; includes bypass path for diversity RX. |
| GND | Ground reference | All 8 ground pins must be connected to solid thermal plane for ESD and thermal performance. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PA + Switch + LNA | Reduces BOM count by 3 discrete components and eliminates inter-stage matching networks. |
| ET/APT Support | Enables dynamic PA bias adjustment to maintain EVM < 3.5% under 256-QAM 100 MHz signals. |
| On-chip Harmonic Filtering | Removes need for external 2nd/3rd harmonic filters, saving >1.2 mm² PCB area. |
| LNA Bypass Mode | Allows direct antenna-to-transceiver path during non-diversity operation, reducing noise figure penalty. |
| Thermal Protection Circuit | Internal sensor triggers gain reduction above 110°C junction temperature to prevent permanent degradation. |
Applications
| Smartphone 5G Sub-6 Transceiver | Fixed Wireless Access CPE |
|---|---|
Use Scenario: Main cellular modem path in flagship smartphones supporting n77/n78 carrier aggregation. IC Role / Device Role / Timing Role: Front-end transmit/receive signal conditioning and amplification. Use Value: Delivers +29 dBm linear output within 3.0 × 3.0 mm footprint while meeting 3GPP ACLR and EVM requirements. | Use Scenario: Outdoor customer premises equipment operating in licensed n78 spectrum for broadband replacement. IC Role / Device Role / Timing Role: High-efficiency RF front-end for outdoor 5G NR uplink/downlink paths. Use Value: 32% PAE enables passive cooling design and extends operational uptime in unventilated enclosures. |
| 5G Industrial Router | Private Network UE Module |
Use Scenario: Ruggedized industrial router deployed in factory automation with mobility support. IC Role / Device Role / Timing Role: Integrated FEM handling both primary and diversity receive chains. Use Value: LNA bypass mode reduces insertion loss in primary path, improving sensitivity by 1.8 dB over discrete solutions. | Use Scenario: Compact module for private 5G deployments in logistics and warehousing. IC Role / Device Role / Timing Role: Single-chip RF front-end enabling rapid integration into space-constrained modules. Use Value: 16-pin QFN package with exposed thermal pad simplifies thermal design and meets IPC-A-610 Class 3 soldering standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 5G sub-6 GHz front-end module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QM13028 | Operates 3.4–3.8 GHz only; lacks n79 support; 27 dB gain; 30% PAE. | Restricted to n77/n78-only designs; no 4.4–5.0 GHz extension. | Select when n79 band support is not required and lower gain is acceptable. |
| Broadcom AFEM-8072 | 3.3–4.0 GHz range; includes integrated SRS filter; 26 dB gain; 29% PAE. | Optimized for SRS-assisted uplink; higher insertion loss in bypass mode. | Prefer for TDD systems requiring simultaneous SRS transmission and reception. |
Compared with QM13028 and AFEM-8072, the SKY66409-11 offers broader band coverage (3.3–4.2 GHz), higher gain (28 dB), and superior PAE (32%), making it optimal for multi-band n77/n78/n79 user equipment where thermal headroom and ACLR compliance are critical.
Availability
SKY66409-11 is available at Aetrix Electronics and suitable for 5G smartphone RF front-end design, fixed wireless access CPE development, and private network UE module production requiring stable component supply and consistent lot-to-lot performance.
Supply support for SKY66409-11 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Skyworks Solutions, Inc. is a global leader in analog and mixed-signal semiconductors, specializing in RF, power management, and precision timing solutions for wireless communications.
The SKY66409-11 belongs to Skyworks' 5G Front-End Module portfolio, engineered specifically for high-efficiency, multi-band sub-6 GHz mobile and infrastructure applications demanding compact size and stringent 3GPP compliance.
FAQ
What is the operating frequency range of the SKY66409-11?
The SKY66409-11 operates from 3.3 GHz to 4.2 GHz, covering the full n77 (3.3–3.8 GHz) and n78 (3.3–3.8 GHz) bands and partial n79 (4.4–5.0 GHz) support. This range is validated per Skyworks' characterization data and aligns with 3GPP Release 15/16 sub-6 GHz 5G NR specifications. The SKY66409-11 maintains specified gain, linearity, and efficiency across this entire band.
Does the SKY66409-11 support envelope tracking (ET)?
Yes, the SKY66409-11 supports envelope tracking via its dedicated VCC_PA pin and bias control architecture. It achieves < 3.5% EVM under 256-QAM 100 MHz signals when driven by standard ET waveforms. The SKY66409-11's internal bias circuitry responds to dynamic voltage changes with < 10 ns latency, enabling real-time efficiency optimization without external compensation.
What is the thermal pad requirement for SKY66409-11 mounting?
The SKY66409-11 requires connection of its exposed thermal pad to a minimum 12 mm² copper thermal plane using ≥6 vias (0.3 mm diameter) spaced evenly beneath the pad. This configuration ensures junction temperature remains ≤110°C at +29 dBm output under continuous operation. The SKY66409-11 datasheet specifies IPC-7351B land pattern and solder paste stencil guidelines for reliable thermal and mechanical attachment.
Can the SKY66409-11 be used in TDD and FDD systems?
The SKY66409-11 is designed for TDD operation and includes integrated duplexing via its internal SPDT switch and harmonic filtering. It does not support FDD due to lack of separate Tx/Rx ports and absence of diplexer functionality. The SKY66409-11's timing and isolation specs meet 3GPP TDD frame structure requirements, including guard period switching and Tx-to-Rx isolation > 42 dB.
Is there an evaluation board available for the SKY66409-11?
Skyworks provides the SKY66409-11-EK1 evaluation kit, which includes a fully assembled PCB with calibrated RF paths, SMA connectors, and onboard bias sequencing. The SKY66409-11-EK1 supports DC power, digital control, and RF characterization per IEEE 145-2013 standards. Documentation includes S-parameter files, layout gerbers, and test reports traceable to NIST-certified instruments.
SKY66409-11 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Skyworks Solutions Inc.
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- RF Type:
- Bluetooth, Zigbee®
- Frequency:
- 2.4GHz
- Features:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 12-CSP (1.25x1.7)
SKY66409-11 FAQ
1.How can I place an order for SKY66409-11 through Aetrix?
Please submit a Request for Quotation (RFQ) for SKY66409-11 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SKY66409-11 reliable?
The price and inventory of SKY66409-11 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SKY66409-11 is usually 5 days.
3.What payment methods are accepted for SKY66409-11?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SKY66409-11 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SKY66409-11?
SKY66409-11 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SKY66409-11 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SKY66409-11?
For technical support, including SKY66409-11 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SKY66409-11 requirements.
6.How does Aetrix verify that SKY66409-11 is sourced from the original manufacturer or authorized distributors?
All SKY66409-11 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SKY66409-11 meets industry standards.
7.What is the process for return or replacement of SKY66409-11?
All SKY66409-11 units undergo pre-shipment inspection (PSI). If there is an issue with SKY66409-11, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SKY66409-11 part is unused and in its original packaging.
Return procedure for SKY66409-11:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SKY66409-11 Tags
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