Renesas SLG59M1736C
- Part No.:
- SLG59M1736C
- Manufacturer:
- Renesas
- Package:
- 4-XFBGA, WLCSP
- Datasheet:
-
SLG59M1736C.pdf
- Description:
- A 33 MO, 2.2 A PFET IPS WITH CON
- Quantity:
- Payment:

- Shipping:

Inventory:5,370
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Product details
Overview
SLG59M1736C from Renesas Electronics is a single-channel pFET load switch optimized for space-constrained portable electronics, featuring 33 mΩ RDS(ON) at 5.5 V, 2.2 A continuous current capability, controlled inrush current limiting (16.5 mA typical), and ultra-small 0.8 mm × 0.8 mm 4-pin WLCSP packaging. It operates from 2.5 V to 5.5 V and delivers 0.1 µA no-load supply current.
For engineers reviewing the SLG59M1736C datasheet, SLG59M1736C pinout, SLG59M1736C application, or SLG59M1736C equivalent, key selection criteria include inrush-controlled turn-on timing (7.6 ms typical rise time with 30 µF load), integrated VOUT discharge (90 Ω typical), thermal performance (110 °C/W θJA), and compatibility with health-monitoring and wearable power sequencing requirements.
Technical Context
The SLG59M1736C integrates a proprietary CuFET p-channel MOSFET with voltage-dependent RDS(ON) (33–56.1 mΩ across 2.5–5.5 V input range) and an internal inrush current control circuit that activates only after VIN exceeds 0.9×VIN threshold (VSUCC(TH)). Its ON pin is a CMOS-level-sensitive input without internal pull-down, requiring active drive from a microcontroller GPO.
Turn-on behavior is defined by slew-rate-limited VOUT ramp-up (0.54 V/ms typical), governed by fixed IRISE (16.5 mA) and external CLOAD, while turn-off is fast (4.5 µs OFF delay). The device includes an integrated 90 Ω VOUT discharge path and supports safe operation up to 2.2 A continuous load at 5 V input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5 V to 5.5 V - Enables direct integration into common Li-ion battery and USB-powered rails without level-shifting. |
| RDS(ON) @ 5.5 V | 33 mΩ typical - Minimizes conduction loss (≤150 mW at 2.2 A), critical for thermal management in 0.64 mm² WLCSP. |
| Continuous Output Current | 2.2 A @ 5 V - Supports high-current peripherals like OLED displays or sensor arrays in wearables. |
| Inrush Current Limit (IRISE) | 16.5 mA typical - Prevents input rail collapse during hot-plug of large output capacitance (up to 30 µF). |
| No-load Supply Current | 0.1 µA typical - Extends battery life in always-on monitoring modes of health devices. |
| VOUT Discharge Resistance | 90 Ω typical - Ensures rapid, controlled VOUT decay (<10 ms for 30 µF) after shutdown, avoiding floating nodes. |
| Thermal Resistance θJA | 110 °C/W - Validated on 1 in², 2 oz copper pad; requires PCB layout adherence for junction temperature control. |
Pinout & Package
SLG59M1736C uses a Pb-free, halogen-free 4-pin Wafer-Level Chip-Scale Package (WLCSP) measuring 0.8 mm × 0.8 mm with 0.4 mm pitch. The package features laser-marked pin 1 index (A1 corner) and is rated MSL-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | ON | CMOS-level input controlling switch state; requires active HIGH drive (VIH > 0.85 V); no internal pull-down - must not float. |
| B1 | VIN | pFET source terminal; connects to input power rail and requires ≥10 µF low-ESR bypass capacitor to ground. |
| B2 | VOUT | pFET drain terminal; connects to load and requires ≤30 µF capacitor for controlled inrush profile. |
| A2 | GND | Analog/power ground reference; must connect directly to system ground plane for stable operation and thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Controlled Inrush Current Profile | Fixed 16.5 mA charging current limits dV/dt on VOUT, preventing input droop when powering 30 µF capacitive loads. |
| Ultra-Small 0.64 mm² WLCSP | 0.8 mm × 0.8 mm footprint enables placement in tight spaces such as smartwatch bezels or hearing aid PCBs. |
| Temperature-Stable RDS(ON) | 40.2 mΩ max at 85 °C and 5.5 V - ensures predictable conduction loss across industrial temperature range. |
| Integrated VOUT Discharge | 90 Ω on-chip resistor eliminates need for external discharge circuitry, reducing BOM count and board area. |
| Low Quiescent Current | 0.1 µA typical supply current in ON state - preserves battery capacity during standby in always-on health sensors. |
Applications
| Smart Wearable Power Sequencing | Portable Health Monitor Subsystem Enable |
|---|---|
|
Use Scenario: Enabling/disabling display backlight or ECG front-end amplifier in a wrist-worn fitness tracker during sleep mode transitions. IC Role / Device Role / Timing Role: Load switch controlling power delivery to high-capacitance subsystems with precise inrush control to avoid brownout. Use Value: Prevents 5.5 V rail collapse during VOUT ramp-up with 30 µF local capacitance, ensuring uninterrupted MCU operation. |
Use Scenario: Isolating a blood oxygen (SpO₂) sensor module powered from a shared 3.3 V rail in a clinical-grade pulse oximeter. IC Role / Device Role / Timing Role: Single-pole power gate with fast 4.5 µs OFF delay and integrated discharge for clean signal-domain isolation. Use Value: Eliminates floating VOUT during disable, preventing erroneous analog readings from residual charge on sensor bias networks. |
| Compact Hearing Aid Audio Path Enable | Low-Power IoT Edge Node Peripheral Management |
|
Use Scenario: Powering MEMS microphone and audio codec in a rechargeable hearing aid using a 2.5 V Li-ion cell. IC Role / Device Role / Timing Role: High-efficiency pFET switch operating down to 2.5 V with 56.1 mΩ RDS(ON) and sub-µA quiescent draw. Use Value: Delivers 1.2 A continuous current at 2.5 V while consuming only 0.06 µA off-state leakage, extending per-charge runtime. |
Use Scenario: Managing power to BLE radio, environmental sensor cluster, and flash memory in a coin-cell-powered asset tracker. IC Role / Device Role / Timing Role: Low-footprint load switch enabling firmware-controlled subsystem wake/sleep cycles with minimal PCB real estate. Use Value: 0.8 mm × 0.8 mm WLCSP allows placement adjacent to QFN-packaged MCU, reducing interconnect inductance and routing congestion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pFET load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS22915BYFPR | 0.7 mm × 0.7 mm DSBGA, 37 mΩ RDS(ON) @ 5 V, 2 A rating, no integrated VOUT discharge. | Lacks built-in discharge path; requires external 100 kΩ resistor for VOUT bleed-down, increasing BOM and layout complexity. | Choose when footprint is primary constraint and discharge can be added externally; not drop-in for SLG59M1736C's discharge-integrated use cases. |
| ROHM BD75020GUL | 0.8 mm × 0.8 mm UCSP, 45 mΩ RDS(ON) @ 5 V, 2 A rating, 1 µA quiescent current, no inrush control. | No controlled inrush - relies on external RC network for dV/dt limiting, adding design overhead and component count. | Select when inrush control is unnecessary and lower cost is prioritized over guaranteed startup reliability with large CLOAD. |
Compared with TPS22915BYFPR and BD75020GUL, the SLG59M1736C uniquely combines integrated VOUT discharge, factory-trimmed inrush current limiting, and sub-µA quiescent draw in a 0.8 mm × 0.8 mm WLCSP - making it optimal for battery-sensitive wearables where BOM reduction and startup predictability are critical.
Availability
SLG59M1736C is available at Aetrix Electronics and suitable for smart wearable power sequencing, portable health monitor subsystem enable, compact hearing aid audio path enable, and low-power IoT edge node peripheral management requiring stable component supply and long-term production continuity.
Supply support for SLG59M1736C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power management, and timing solutions for automotive, industrial, and consumer markets.
The SLG59M1736C belongs to Renesas' GreenFET family of ultra-compact, high-efficiency load switches designed specifically for battery-powered portable and medical devices demanding minimal footprint, precise inrush control, and ultra-low quiescent power.
FAQ
What is the maximum recommended output capacitance for SLG59M1736C?
The SLG59M1736C is characterized and specified for operation with up to 30 µF output capacitance (CLOAD). Exceeding this value may degrade inrush current control, extend rise time beyond the 11 ms maximum, and risk violating the device's safe operating area during startup. For loads requiring >30 µF, external inrush limiting or staged enable is required. Always verify stability with actual CLOAD and RLOAD in the target application.
Does SLG59M1736C require an external pull-down resistor on the ON pin?
No, SLG59M1736C does not include an internal pull-down resistor on the ON pin, but an external pull-down is not required if the driving source (e.g., microcontroller GPIO) actively controls the pin state. The datasheet explicitly warns against leaving the ON pin open-circuited. SLG59M1736C expects a clean CMOS-level signal with VIH > 0.85 V and VIL < 0.3 V - best achieved via direct GPO connection.
Can SLG59M1736C operate reliably at 2.5 V input with full 2.2 A load current?
No. At 2.5 V input, the SLG59M1736C's maximum continuous output current is derated to 1.2 A, as specified in the Electrical Characteristics table. Attempting 2.2 A at 2.5 V exceeds the safe operating area, increases RDS(ON) to 68.2 mΩ (at 85 °C), and risks thermal shutdown or premature failure. SLG59M1736C delivers full 2.2 A only at VIN ≥ 5 V.
How does the SLG59M1736C's inrush current control function during power-up?
The SLG59M1736C's inrush control activates automatically once VIN reaches 90% of its nominal value (VSUCC(TH)). Only then will a HIGH transition on the ON pin initiate controlled VOUT ramp-up at 16.5 mA (typical), limiting dV/dt to 0.54 V/ms with 30 µF load. If ON is asserted before VIN reaches VSUCC(TH), inrush control is disabled and uncontrolled turn-on occurs - potentially damaging downstream components.
What is the thermal performance limit of SLG59M1736C under continuous 2.2 A load at 5 V?
Under continuous 2.2 A at 5 V input, SLG59M1736C dissipates approximately 160 mW (P = I² × RDS(ON) = 2.2² × 0.033). With θJA = 110 °C/W and TA = 25 °C, junction temperature rises to ~42.6 °C - well within the -40 °C to 85 °C operating range. This assumes the recommended PCB layout: 1 in², 2 oz copper pads under VIN and VOUT pins. Reduced copper area increases TJ proportionally.
SLG59M1736C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 4-XFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- -
- Voltage - Load:
- -
- Voltage - Supply (Vcc/Vdd):
- 2.5V ~ 5.5V
- Current - Output (Max):
- 2.2A
- Rds On (Typ):
- 33mOhm
- Input Type:
- CMOS
- Features:
- -
- Fault Protection:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.8x0.8)
SLG59M1736C FAQ
1.How can I place an order for SLG59M1736C through Aetrix?
Please submit a Request for Quotation (RFQ) for SLG59M1736C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SLG59M1736C reliable?
The price and inventory of SLG59M1736C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SLG59M1736C is usually 5 days.
3.What payment methods are accepted for SLG59M1736C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SLG59M1736C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SLG59M1736C?
SLG59M1736C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SLG59M1736C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SLG59M1736C?
For technical support, including SLG59M1736C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SLG59M1736C requirements.
6.How does Aetrix verify that SLG59M1736C is sourced from the original manufacturer or authorized distributors?
All SLG59M1736C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SLG59M1736C meets industry standards.
7.What is the process for return or replacement of SLG59M1736C?
All SLG59M1736C units undergo pre-shipment inspection (PSI). If there is an issue with SLG59M1736C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SLG59M1736C part is unused and in its original packaging.
Return procedure for SLG59M1736C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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