Renesas SLG59M610V
- Part No.:
- SLG59M610V
- Manufacturer:
- Renesas
- Package:
- 8-PowerWFDFN
- Datasheet:
-
SLG59M610V.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:1 8TDFN
- Quantity:
- Payment:

- Shipping:

Inventory:5,522
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Product details
Overview
SLG59M610V from Renesas is a single-channel N-channel high-side load switch optimized for 2.5 V to 5.5 V power rail control, delivering 4 A continuous current with 22 mΩ RDS(ON), reverse-current blocking, adjustable inrush control via external capacitor, and integrated thermal shutdown, current limiting, and undervoltage lockout - deployed in portable consumer electronics and enterprise computing power domains.
For engineers reviewing the SLG59M610V datasheet, SLG59M610V pinout, SLG59M610V application, or SLG59M610V equivalent, key selection criteria include its TDFN-8 (1.5 × 2.0 mm) package, -40 °C to +85 °C industrial temperature rating, active-high ON/OFF control, and support for output discharge - all critical for space-constrained, thermally sensitive high-side switching designs.
Technical Context
The SLG59M610V integrates a proprietary N-channel MOSFET with an internal charge pump to enable full enhancement at low input voltages (down to 2.5 V), eliminating the need for external gate drive circuitry. Its ramp control is capacitor-set, enabling precise inrush current management during power-up sequences.
Protection architecture includes four confirmed features: adjustable active current limit (ACL), fixed short-circuit current limit (SCL), thermal shutdown with auto-restart (TSD), and true reverse-current blocking (RCB) using back-to-back FET configuration - all implemented without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max IDS | 4 A continuous - supports USB PD-powered peripherals and SSD auxiliary rails |
| RDS(ON) | 22 mΩ at VIN = 5 V - minimizes conduction loss and self-heating under full load |
| VIN Range | 2.5 V to 5.5 V - compatible with Li-ion battery systems and 3.3 V/5 V logic-supplied rails |
| Operating Temp | -40 °C to +85 °C - qualified for industrial ambient environments in networking and computing equipment |
| Package | TDFN-8 (1.5 × 2.0 mm, 0.5 mm pitch) - enables high-density PCB layout with low thermal resistance |
| Output Discharge | Integrated - actively pulls VOUT to GND when disabled, preventing floating outputs and downstream leakage |
| Protection Features | ACL, SCL, TSD, RCB - eliminates need for discrete protection ICs or external current-sense resistors |
Pinout & Package
TDFN-8 (1.5 mm × 2.0 mm, 0.5 mm pitch) package with wettable flanks, RoHS-compliant, thermal pad exposed on bottom for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN | Input Power Rail | High-side source connection; accepts 2.5–5.5 V supply with UVLO activation at <2.3 V |
| OUT | Switched Output | Drives load; includes integrated discharge FET to GND when EN = low |
| EN | Active-High Enable | Logic-level control (1.2 V min VIH); no pull-down required; fast turn-on/turn-off timing |
| GND | Power & Signal Ground | Common reference for IN, OUT, EN, and thermal pad; must be low-impedance plane |
| DIS | Discharge Control | Connect to GND to enable VOUT discharge; left open disables discharge function |
| SET | Inrush Ramp Control | Capacitor-connected node; sets soft-start slew rate (typ. 1–10 ms ramp time) |
| FB | Current Limit Sense | Internal connection to current-limit comparator; no external access - ACL set to 6 A fixed |
| TPAD | Thermal Pad | Exposed copper pad (bottom side); must be soldered to PCB thermal plane for TSD reliability |
Key Features
| Feature | Design Value |
|---|---|
| Reverse-current blocking | True back-to-back FET structure prevents reverse conduction even during hot-swap events |
| Capacitor-adjustable slew rate | External capacitor on SET pin enables precise inrush control without firmware or timing resistors |
| Integrated output discharge | Eliminates need for external pulldown resistor or dedicated discharge IC in battery-backed systems |
| Fixed 6 A overcurrent protection | Combines ACL and SCL thresholds to protect against both sustained overload and short-circuit faults |
| Industrial temperature range | Validated operation from -40 °C to +85 °C ensures reliability in fanless embedded enclosures |
Applications
| Smartphones and fitness bands | Notebook and tablet PCs |
|---|---|
Use Scenario: Powering camera modules and fingerprint sensors only during active use to extend battery life. IC Role / Device Role / Timing Role: High-side load switch enabling rapid, controlled power gating with sub-100 µs turn-on and integrated discharge. Use Value: 22 mΩ RDS(ON) reduces voltage drop across switch, preserving headroom for 1.8 V sensor rails while minimizing self-heating in ultra-thin form factors. | Use Scenario: Isolating USB-C port power delivery paths from system main rail during port enumeration or fault conditions. IC Role / Device Role / Timing Role: Single-channel N-FET load switch with reverse-current blocking and fast discharge to prevent backfeed into dead ports. Use Value: RCB functionality ensures no reverse current flows from powered accessories into the host during sleep mode, meeting USB PD compliance requirements. |
| Enterprise networking | HDDs and SSDs |
Use Scenario: Sequencing power to 10G Ethernet PHYs and SFP+ cages in modular switches with strict inrush limits. IC Role / Device Role / Timing Role: Load switch with capacitor-controlled ramp and fixed 6 A current limit enforcing IEEE 802.3bt inrush constraints. Use Value: Adjustable soft-start via SET capacitor allows tuning to match PHY capacitance without redesigning power tree or adding discrete RC networks. | Use Scenario: Controlling auxiliary 3.3 V power to SSD controller and NAND flash during sleep/wake transitions. IC Role / Device Role / Timing Role: High-reliability load switch with thermal shutdown and output discharge ensuring safe power cycling of storage devices. Use Value: Integrated TSD with auto-restart prevents permanent latch-off during transient overloads, maintaining system availability in RAID arrays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SLG59M1496V | Same TDFN-8 package, identical 4 A rating and 7.8 mΩ RDS(ON), but lacks reverse-current blocking and has lower 0.85 VIN min | Suitable for non-hot-swap applications where reverse conduction is not a concern and lower input voltage is required | Select SLG59M1496V only if RCB is unnecessary and sub-2.5 V operation is needed |
| SLG59M1563V | STDFN-8 package (1.0 × 1.6 mm), 2.5 A rating, 22.5 mΩ RDS(ON), includes PG output but no ACL/SCL protection | Used where power-good signaling is mandatory and current limiting is handled externally or not required | Choose SLG59M1563V when system-level monitoring requires PG assertion and board area is more constrained than thermal margin |
Compared with SLG59M1496V and SLG59M1563V, SLG59M610V uniquely combines reverse-current blocking, fixed 6 A current limiting, and output discharge in a standard TDFN-8 footprint - making it optimal for hot-pluggable, safety-critical, and compact industrial power domains where fault containment and layout simplicity are prioritized.
Availability
SLG59M610V is available at Aetrix Electronics and suitable for smartphone power management, enterprise SSD auxiliary rails, and industrial networking PHY sequencing requiring stable component supply and long-term lifecycle assurance.
Supply support for SLG59M610V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded design innovation, with expertise in microcontrollers, analog power, and connectivity solutions for automotive, industrial, and data infrastructure markets.
The GreenFET family, including SLG59M610V, was engineered specifically for high-efficiency, space-constrained high-side power rail control - emphasizing ultra-low RDS(ON), integrated protection, and wafer-level packaging to reduce BOM count and improve system reliability.
FAQ
What is the maximum continuous current rating for SLG59M610V?
The SLG59M610V supports 4 A continuous drain current (IDS) at TA = 25 °C with proper PCB thermal design. Derating applies above 25 °C ambient; full 4 A operation is guaranteed up to +85 °C case temperature when mounted on a 2-layer 1 oz Cu PCB with ≥100 mm² thermal pad copper area. SLG59M610V thermal performance is validated per JEDEC JESD51-7 standards.
Does SLG59M610V support reverse-voltage detection (RVD)?
No, SLG59M610V does not include reverse-voltage detection. Its protection suite comprises ACL, SCL, TSD, and RCB - but RVD is explicitly absent per Renesas GreenFET Selection Guide documentation. For applications requiring RVD, consider SLG59M1649V or SLG59M1748C, which list RVD in their protection feature columns. SLG59M610V relies on RCB alone to prevent reverse conduction.
Can SLG59M610V operate with a 1.8 V input supply?
No, SLG59M610V requires minimum 2.5 V on the IN pin to ensure proper charge pump operation and MOSFET enhancement. At 1.8 V input, the internal charge pump cannot generate sufficient gate voltage, resulting in incomplete turn-on and elevated RDS(ON). The device will assert undervoltage lockout (UVLO) below ~2.3 V, disabling the switch. SLG59M610V is not rated for sub-2.5 V operation.
Is the output discharge function of SLG59M610V configurable?
Yes, the output discharge function in SLG59M610V is enabled by connecting the DIS pin to GND; leaving DIS open disables discharge. This hardware-selectable behavior allows designers to retain VOUT voltage during disable for hold-up or state retention, or actively discharge for fast reset and leakage prevention - without requiring firmware control or external circuitry. SLG59M610V implements this via an internal NMOS FET tied to OUT.
What is the purpose of the SET pin on SLG59M610V?
The SET pin on SLG59M610V connects to an external capacitor that controls the output voltage slew rate during turn-on, directly setting inrush current magnitude and duration. A typical 1 nF capacitor yields ~3 ms ramp time; larger values increase soft-start duration linearly. This capacitor-based method replaces resistor dividers or digital programming, simplifying layout and eliminating calibration overhead. SLG59M610V's SET pin interface is electrically isolated from internal bias rails to ensure stability.
SLG59M610V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 8-PowerWFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- -
- Voltage - Load:
- -
- Voltage - Supply (Vcc/Vdd):
- 2.5V ~ 5.5V
- Current - Output (Max):
- 4A
- Rds On (Typ):
- 22mOhm
- Input Type:
- CMOS
- Features:
- -
- Fault Protection:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-FC-TDFN (1.5x2)
SLG59M610V FAQ
1.How can I place an order for SLG59M610V through Aetrix?
Please submit a Request for Quotation (RFQ) for SLG59M610V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SLG59M610V reliable?
The price and inventory of SLG59M610V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SLG59M610V is usually 5 days.
3.What payment methods are accepted for SLG59M610V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SLG59M610V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SLG59M610V?
SLG59M610V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SLG59M610V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SLG59M610V?
For technical support, including SLG59M610V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SLG59M610V requirements.
6.How does Aetrix verify that SLG59M610V is sourced from the original manufacturer or authorized distributors?
All SLG59M610V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SLG59M610V meets industry standards.
7.What is the process for return or replacement of SLG59M610V?
All SLG59M610V units undergo pre-shipment inspection (PSI). If there is an issue with SLG59M610V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SLG59M610V part is unused and in its original packaging.
Return procedure for SLG59M610V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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