Texas Instruments SM28VLT32SKGD3
- Part No.:
- SM28VLT32SKGD3
- Manufacturer:
- Texas Instruments
- Category:
- Memory
- Package:
- Die
- Datasheet:
-
SM28VLT32SKGD3.pdf
- Description:
- IC FLASH 32MBIT SPI 12MHZ 0XCEPT
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SM28VLT32SKGD3 from Texas Instruments is a 32-Mbit high-temperature serial flash memory with SPI interface (Mode 0/3), 2-M × 16-bit organization, 12-MHz max clock, and dual-supply operation (3.3-V IO / 1.9-V core). It delivers asynchronous read/write/erase in down-hole drilling and seismic data acquisition systems operating continuously at –55°C to 210°C.
For engineers reviewing the SM28VLT32SKGD3 datasheet, SM28VLT32SKGD3 pinout, SM28VLT32SKGD3 application, or SM28VLT32SKGD3 equivalent, key selection factors include extreme-temperature qualification (1000 hrs @ 210°C), sector-level hardware write protection via WP#, HOLD#-enabled SPI freeze, and KGD die form factor for hermetic module integration.
Technical Context
The SM28VLT32SKGD3 implements an SPI-compatible flash controller supporting Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1), with CS#-gated communication and HOLD#-initiated transaction suspension. Its architecture partitions memory into 2-M word sectors, requiring 21-bit addressing and enabling burst read/write via auto-incrementing address pointers.
It features dual-voltage operation: VIO (3.1–3.6 V) powers I/O circuitry including SCK/SI/SO/CS#/HOLD#/WP#/RST#/FLCLK, while VCORE (1.8–1.98 V) supplies the flash array and pump. Erase operations are restricted to –55°C to 125°C per specification, and WP# assertion disables all program/erase commands regardless of temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (2-M × 16-bit words), enabling compact firmware/data storage in space-constrained high-temp modules |
| Operating Temperature | –55°C to 210°C continuous junction range, qualified for 1000 hours at max rated temperature |
| SPI Clock Frequency | Up to 12 MHz fCLK (with fSCK ≤ 5/6 × fCLK), supporting fast command execution in real-time logging systems |
| Supply Voltages | VIO = 3.1–3.6 V (I/O), VCORE = 1.8–1.98 V (core); strict sequencing required (VCORE must stabilize before VIO) |
| Endurance & Retention | 1000 program/erase cycles at 30°C; data retention specified for 1000 hours at max operating temperature |
| ESD Protection | 2-kV HBM, 500-V CDM - critical for handling reliability in field-deployed instrumentation |
| Package Form | KGD (Known Good Die), 15-mil thickness, AlCu/TiN bond pads, silicon backside - designed for flip-chip or wire-bond integration into ceramic/metal packages |
Pinout & Package
KGD (Known Good Die) package: bare silicon die with 150-µm bond pad pitch, 381-µm thickness, AlCu/TiN metallization, and floating or grounded substrate. Not housed in leaded or laminate carrier; requires custom assembly into hermetic modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIO (Pads 6, 13, 150) | Power Input | 3.3-V supply for all digital I/O pins (SCK, SI, SO, CS#, HOLD#, WP#, RST#, FLCLK); decoupling required near die edge |
| VCORE (Pads 7, 14, 1) | Power Input | 1.9-V supply for flash array and pump; must ramp before VIO to prevent latch-up or corruption |
| VSS (Pads 1, 8, 73, 145) | Ground | Dual ground connections for analog/digital separation; substrate potential configurable as float or ground |
| CS# (Pad 149) | Input | Active-low chip select - de-assertion places SO in high-impedance state and halts all SPI activity |
| SCK (Pad 146) | Input | SPI clock input - rising edge latches SI, falling edge drives SO; timing validated from –55°C to 210°C |
| SI (Pad 147) | Input | SPI serial data input - accepts command/address/data frames per Table 3; ignored when CS# is high |
| SO (Pad 148) | Output | SPI serial data output - returns quick status byte first, then requested data; tri-states when CS# is high |
| HOLD# (Pad 74) | Input | Active-low hold - freezes ongoing SPI transaction without deselecting device; retains internal state during host interruption |
| WP# (Pad 76) | Input | Active-low write protect - globally inhibits erase/program commands; enables hardware-based sector locking |
| RST# (Pad 75) | Input | Active-low reset - forces device into known state; required before power-down if VIO drops before VCORE |
| FLCLK (Pad 77) | Input | Flash pump clock - internal timing reference for erase/program algorithms; default 12 MHz, adjustable down to 2 MHz via register writes |
Key Features
| Feature | Design Value |
|---|---|
| Extreme-Temperature Qualification | 1000-hour continuous operation at 210°C junction temperature - validated for down-hole energy applications where thermal derating is non-negotiable |
| Hardware Write Protection | WP# pin disables all erase/program operations unconditionally - eliminates software vulnerability in safety-critical logging systems |
| SPI Transaction Freeze | HOLD# suspends active SPI frame without losing address/command context - enables deterministic multi-master arbitration in shared bus topologies |
| Quick Status Feedback | 8-bit status byte returned on every SO frame - provides immediate visibility into Command Error, Invalid Data, Device Busy, and Erase/Write progress |
| Configurable Flash Timing | Memory-mapped registers (F004, 8006–8018) allow fCLK scaling from 2–12 MHz - supports low-power wake-up modes while preserving algorithmic integrity |
| KGD Form Factor | Bare die with defined bond pad coordinates and metallization - enables direct integration into high-reliability ceramic/metal packages with custom thermal paths |
Applications
| Down-Hole Drilling Sensors | Seismic Data Recorders |
|---|---|
Use Scenario: Embedded in MWD/LWD tools deployed at >150°C bottom-hole temperatures for real-time formation evaluation and telemetry buffering. IC Role / Device Role / Timing Role: Nonvolatile storage for firmware, calibration tables, and acquired sensor data; operates autonomously during intermittent surface communication windows. Use Value: Eliminates need for external temperature compensation or cooling subsystems - reduces tool diameter and increases operational depth ceiling. |
Use Scenario: Mounted on geophone arrays in desert/arctic environments to log vibration waveforms over extended deployments without maintenance. IC Role / Device Role / Timing Role: High-integrity data logger with sector-locked configuration storage and burst-write capability for transient event capture. Use Value: Guarantees data persistence across thermal cycling from –55°C to +210°C - avoids data loss during diurnal or seasonal ambient swings. |
| High-Temp Test Equipment | Aerospace Engine Monitoring |
Use Scenario: Integrated into burn-in chambers and environmental stress screening (ESS) fixtures to store test profiles, pass/fail logs, and calibration history. IC Role / Device Role / Timing Role: Trusted configuration and results storage under sustained 180°C+ chamber conditions; accessed via host MCU over SPI during idle cycles. Use Value: Removes reliance on external EEPROM or FRAM with narrower temp specs - simplifies fixture certification and reduces recalibration frequency. |
Use Scenario: Mounted on turbine casings to record vibration, pressure, and temperature trends during engine ground tests and flight trials. IC Role / Device Role / Timing Role: Fault-tolerant black-box recorder with WP#-protected boot code and HOLD#-enabled safe interrupt handling during transient events. Use Value: Survives repeated thermal shock from cold start to full thrust - ensures mission-critical data capture even after 500+ thermal cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-temperature serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF321A-SSH-B | 32-Mbit SPI flash, rated –40°C to +105°C only; no KGD option; lacks FLCLK pin and programmable timing registers | Restricted to industrial-grade enclosures with active thermal management; unsuitable for direct down-hole mounting | Select only when ambient temperature remains below 105°C and KGD integration is unnecessary |
| MX25L3233FZNI-10G | 32-Mbit SPI flash, –40°C to +85°C rating; no dual-supply (VIO/VCORE) architecture; no HOLD# or FLCLK pins | Requires external voltage regulation and thermal shielding; cannot meet 210°C continuous operation requirement | Use only in cost-sensitive, non-extreme-temperature applications where TI's qualification data is not mandated |
Compared with AT25DF321A-SSH-B and MX25L3233FZNI-10G, the SM28VLT32SKGD3 uniquely delivers verified 210°C junction operation, KGD form factor for hermetic packaging, and hardware-controlled timing flexibility - making it the sole option for uncooled, embedded high-temperature data logging.
Availability
SM28VLT32SKGD3 is available at Aetrix Electronics and suitable for down-hole drilling sensors, seismic data recorders, and aerospace engine monitoring systems requiring stable component supply across extended temperature extremes and long product lifecycles.
Supply support for SM28VLT32SKGD3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and high-reliability products, with leadership in automotive, industrial, and aerospace markets.
The SM28VLT32SKGD3 belongs to TI's high-temperature flash memory product line, engineered specifically for data acquisition and firmware storage in environments where conventional flash fails - targeting energy exploration, geophysical sensing, and propulsion system monitoring.
FAQ
What is the maximum continuous operating temperature for SM28VLT32SKGD3?
The SM28VLT32SKGD3 is characterized and qualified for continuous operation at a junction temperature of –55°C to 210°C, with 1000 hours of life validation at the maximum 210°C rating. This exceeds standard industrial or automotive flash specifications and is confirmed by TI's reliability modeling and qualification testing per SLVSAO2C.
Does SM28VLT32SKGD3 support standard SPI modes, and how is communication initiated?
Yes, SM28VLT32SKGD3 supports SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1). Communication begins when CS# is asserted low; SCK then clocks SI data (command/address/data) into the device, and SO returns the quick status byte followed by requested data. All activity is ignored when CS# is high.
How does the WP# pin function on SM28VLT32SKGD3, and what operations does it disable?
The WP# pin on SM28VLT32SKGD3 is an active-low hardware write protect. When WP# is low, all erase and program operations are inhibited - including sector erase, word write, and register writes - regardless of temperature or command sequence. Read operations remain fully functional.
What is the purpose of the FLCLK pin on SM28VLT32SKGD3, and can its frequency be adjusted?
The FLCLK pin on SM28VLT32SKGD3 provides the internal clock source for flash pump and timing-critical erase/program algorithms. Its default frequency is 12 MHz, but it can be scaled down to 2 MHz using memory-mapped register writes (e.g., addresses F004, 8006–8018) to maintain algorithm integrity at lower power levels.
Is SM28VLT32SKGD3 supplied in a packaged format, or is it only available as bare die?
SM28VLT32SKGD3 is exclusively offered as a Known Good Die (KGD) in XCEPT format - no leaded or laminate package. It features defined bond pad coordinates, AlCu/TiN metallization, and 381-µm thickness, intended for direct integration into custom hermetic modules via wire bonding or flip-chip assembly.
SM28VLT32SKGD3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- SPI
- Clock Frequency:
- 12 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.8V ~ 3.6V
- Operating Temperature:
- -55°C ~ 210°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- 0-XCEPT
SM28VLT32SKGD3 FAQ
1.How can I place an order for SM28VLT32SKGD3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SM28VLT32SKGD3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SM28VLT32SKGD3 reliable?
The price and inventory of SM28VLT32SKGD3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SM28VLT32SKGD3 is usually 5 days.
3.What payment methods are accepted for SM28VLT32SKGD3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SM28VLT32SKGD3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SM28VLT32SKGD3?
SM28VLT32SKGD3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SM28VLT32SKGD3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SM28VLT32SKGD3?
For technical support, including SM28VLT32SKGD3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SM28VLT32SKGD3 requirements.
6.How does Aetrix verify that SM28VLT32SKGD3 is sourced from the original manufacturer or authorized distributors?
All SM28VLT32SKGD3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SM28VLT32SKGD3 meets industry standards.
7.What is the process for return or replacement of SM28VLT32SKGD3?
All SM28VLT32SKGD3 units undergo pre-shipment inspection (PSI). If there is an issue with SM28VLT32SKGD3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SM28VLT32SKGD3 part is unused and in its original packaging.
Return procedure for SM28VLT32SKGD3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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