Texas Instruments SM320C6455BGTZSEP

Overview

SM320C6455BGTZSEP from Texas Instruments is a radiation-tolerant, high-performance fixed-point digital signal processor (DSP) based on the C64x+™ VLIW architecture. It delivers 9600 MIPS at 1.2 GHz, integrates dual PLLs (system and EMAC/DDR2-dedicated), DDR2-533 memory controller, four-lane Serial RapidIO v1.2 (1.25–3.125 Gbps), and dual coprocessors (VCP2 and TCP2) for telecom baseband acceleration. It targets hardened satellite communications and radar signal processing.

For engineers reviewing the SM320C6455BGTZSEP datasheet, SM320C6455BGTZSEP pinout, SM320C6455BGTZSEP application, or SM320C6455BGTZSEP equivalent, key selection criteria include radiation-hardened extended temperature operation (–55°C to 105°C), 697-pin ZTZ BGA package with 0.8 mm pitch, IEEE 1149.1/1149.6 JTAG compliance, and deterministic real-time processing capability for space-grade embedded systems.

Technical Context

The SM320C6455BGTZSEP implements an eight-functional-unit C64x+ DSP core with dual 256K-bit L1 caches (L1P/L1D), 16M-bit flexible L2 unified RAM/cache, and time-stamp counter. Its system-level interconnect includes a configurable switch fabric supporting concurrent DDR2, EMIFA, SRIO, PCI, and EMAC traffic with priority arbitration.

It features two independent PLL controllers: PLL1 generates CPU/system clocks up to 1.2 GHz with programmable multipliers/dividers, while PLL2 provides dedicated 266 MHz/533 MHz clocks for DDR2 and EMAC peripherals. All I/Os support 3.3 V/1.8 V/1.5 V/1.25 V/1.2 V mixed-voltage operation with IEEE 1149.6 AC-coupled boundary-scan capability.

Key Specifications

Pinout & Package

ZTZ 697-ball BGA package with 0.8 mm pitch, thermally enhanced construction for space-grade thermal dissipation in vacuum or conduction-cooled environments. Ball composition is lead-free (SnAgCu).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability fixed-point DSP applications.

Compared with SM320C6455BGTZSEP, SM320C6415GLZA lacks DDR2, SRIO, and coprocessors-limiting it to control-plane tasks-while TMS320C6455ZTZ shares full functionality but omits radiation-hardened process and extended temperature qualification, making it unsuitable for space deployment.

Availability

SM320C6455BGTZSEP is available at Aetrix Electronics and suitable for satellite communications payloads, radar signal processing units, secure military data link terminals, and electronic warfare front-end processors requiring stable component supply across long-duration programs.

Supply support for SM320C6455BGTZSEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and aerospace markets.

The SM320C6455BGTZSEP belongs to TI's C6000™ space-enhanced product line, designed specifically for radiation-tolerant, high-reliability signal processing in orbital and defense platforms where deterministic performance and long-term supply assurance are mandatory.

FAQ

What is the maximum operating frequency of the SM320C6455BGTZSEP?

The SM320C6455BGTZSEP operates at a maximum CPU clock frequency of 1.2 GHz, achieving 9600 million instructions per second (MIPS) or 9600 16-bit MMACs per cycle. This performance is enabled by its C64x+ VLIW architecture with eight functional units and dual multipliers capable of four 16×16 MACs per cycle. The 1.2 GHz rate is supported under specified 1.25 V core supply and –55°C to 105°C operating conditions.

Does the SM320C6455BGTZSEP support DDR2 memory?

Yes, the SM320C6455BGTZSEP integrates a dedicated DDR2 memory controller supporting 32-bit DDR2-533 SDRAM operation at 533 MHz data rate. It provides 512 MB of total addressable external memory space, configurable timing parameters, and on-die termination calibration. The controller is clocked by PLL2 to ensure domain isolation from the CPU clock domain, reducing jitter sensitivity in high-speed memory transactions.

What package type and pin count does the SM320C6455BGTZSEP use?

The SM320C6455BGTZSEP uses the ZTZ 697-pin ball grid array (BGA) package with 0.8 mm ball pitch and lead-free (SnAgCu) solder balls. This thermally enhanced package is mechanically identical to the GTZ variant but specifies lead-free assembly compatibility. Pin assignments follow TI's standardized C6455 layout, including dedicated banks for DDR2, SRIO, EMAC, and EMIFA interfaces.

Is the SM320C6455BGTZSEP radiation-tolerant?

Yes, the SM320C6455BGTZSEP is a space-enhanced product qualified per JEDEC and industry extended reliability standards-including Highly Accelerated Stress Test (HAST), temperature cycling (–55°C to 105°C), and bias testing-to ensure reliable operation in radiation-prone environments. Its "EP" suffix denotes enhanced product qualification, and it carries S-temp grading for use in satellite and strategic defense systems without derating.

What high-speed serial interfaces are integrated into the SM320C6455BGTZSEP?

The SM320C6455BGTZSEP integrates four key high-speed serial interfaces: (1) four-lane Serial RapidIO v1.2 (configurable as 4×1 or 1×4) supporting 1.25/2.5/3.125 Gbps per lane; (2) 10/100/1000 Mbps Ethernet MAC with MII/GMII/RMII/RGMII PHY support; (3) PCI 33/66 MHz 3.3 V master/slave interface; and (4) UTOPIA Level 2 ATM controller for telecom backplane connectivity.