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Texas Instruments SM320F28335GJZMEP
- Part No.:
- SM320F28335GJZMEP
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 176-BGA
- Datasheet:
-
SM320F28335GJZMEP.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 176BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SM320F28335GJZMEP from Texas Instruments is a radiation-hardened digital signal controller (DSC) featuring a 150-MHz C28x CPU, 512 KB on-chip Flash, 68 KB RAM, and integrated control peripherals including six ePWM modules, two eQEPs, six eCAPs, and a 16-channel 12-bit ADC. It operates across –55°C to 125°C and supports MIL-PRF-38535 Class V screening for spaceflight and defense systems.
For engineers reviewing the SM320F28335GJZMEP datasheet, SM320F28335GJZMEP pinout, SM320F28335GJZMEP application, or SM320F28335GJZMEP equivalent, key selection criteria include radiation tolerance, extended temperature operation, deterministic real-time control latency, and compatibility with TI's C2000™ real-time control ecosystem.
Technical Context
The SM320F28335GJZMEP implements a Harvard-architecture C28x CPU core with 32-bit fixed-point arithmetic, dual-access SARAM banks, and a unified memory map supporting boot from Flash, OTP, or external memory via XINTF. Its PLL supports configurable SYSCLKOUT up to 150 MHz from 1–30 MHz input clocks.
Real-time control is enabled by dedicated hardware accelerators: HRPWM for sub-nanosecond dead-time control, eCAP for precise edge capture, eQEP for motor position feedback, and PIE-integrated interrupt routing with ≤6-cycle latency. All peripherals are clock-gated and support low-power IDLE/STANDBY modes with GPIO wake-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C28x 32-bit fixed-point DSP core, 150-MHz max frequency - enables deterministic loop execution in motor control and power conversion. |
| Memory | 512 KB Flash (with ECC), 68 KB RAM (M0/M1/L0–L7 SARAM) - supports secure firmware storage and real-time data buffering without external memory. |
| ADC | 16-channel 12-bit SAR ADC, 16.6 MSPS throughput, simultaneous sampling mode - captures voltage/current waveforms for closed-loop FOC in inverters. |
| ePWM Modules | Six independent ePWM modules, each with high-resolution extension (HRPWM) - delivers <150-ps PWM resolution for SiC/GaN gate drive timing control. |
| Operating Range | –55°C to +125°C, qualified per MIL-PRF-38535 Class V - ensures reliability in orbital, launch, and avionics environments without derating. |
| Package | 176-ball GJZ plastic BGA, 15 mm × 15 mm, 1.0 mm pitch - provides high I/O density and thermal performance for compact flight-grade PCBs. |
| Interface Support | eCAN-A/B (ISO 11898-1 compliant), SCI-A/B/C, SPI-A, McBSP, I2C-A - enables robust communication with sensors, actuators, and host controllers in distributed systems. |
Pinout & Package
SM320F28335GJZMEP is housed in a 176-ball plastic BGA (package code GJZ), with 1.0 mm ball pitch and 15 mm × 15 mm body size. The package supports full thermal and mechanical compliance for high-reliability aerospace mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO | I/O Power Supply | 3.3-V supply for all GPIO, peripheral I/O, and interface pins - requires local decoupling for noise immunity in mixed-signal systems. |
| VDDA | Analog Power Supply | 3.3-V analog supply for ADC, reference buffers, and analog comparators - must be isolated from digital noise sources. |
| VSSA | Analog Ground | Dedicated analog return path for ADC and internal references - routed separately from digital ground to maintain 12-bit linearity. |
| GPIO0–GPIO63 | General-Purpose I/O | Multiplexed digital I/O with programmable pullup/down, slew rate, and interrupt capability - used for status signaling, fault monitoring, and control logic. |
| EPWMxA / EPWMxB | PWM Output Pair | Complementary high-resolution PWM outputs per module - configured for three-phase inverter leg drive with programmable dead-band and trip-zone protection. |
| ADCSOC0–ADCSOC15 | ADC Start-of-Conversion Trigger | Hardware-triggered SOC inputs from ePWM, GPIO, or timer - enables synchronous sampling of current/voltage at precise switching instants. |
Key Features
| Feature | Design Value |
|---|---|
| High-Resolution PWM (HRPWM) | Extends ePWM time-base resolution to 150 ps, enabling precise gate timing for wide-bandgap power devices in >100-kHz converters. |
| Peripheral Interrupt Expansion (PIE) | Routes 96 peripheral interrupts into 12 groups with 8 vectors each, reducing ISR latency to ≤6 CPU cycles for time-critical fault responses. |
| On-Chip Security Module | Supports code security via password-protected Flash and OTP memory - prevents unauthorized firmware access in mission-critical deployments. |
| External Interface (XINTF) | 32-bit parallel bus with configurable wait states and asynchronous/synchronous ready-handshaking - interfaces directly with FPGA, SRAM, or legacy ASIC co-processors. |
| Enhanced CAN (eCAN) | Dual ISO 11898-1-compliant CAN modules with 32-message mailboxes and timestamping - supports distributed vehicle or spacecraft subsystem communication. |
Applications
| Electric Propulsion Control | Avionics Power Management |
|---|---|
|
Use Scenario: Real-time field-oriented control (FOC) of brushless DC motors in satellite reaction wheels and ion thrusters. IC Role / Device Role / Timing Role: Primary DSC executing current/voltage loop control, PWM generation, and sensor fusion at 20 kHz update rate. Use Value: HRPWM and 12-bit ADC enable <1% torque ripple and <500-ns timing jitter - critical for micro-vibration-sensitive payloads. |
Use Scenario: Regulation and sequencing of multi-rail power supplies in flight computers and payload interfaces. IC Role / Device Role / Timing Role: System-level power supervisor coordinating DC/DC converter enable signals, fault reporting, and telemetry logging. Use Value: Dual eCAN channels and GPIO-based watchdog supervision ensure fail-safe response to overvoltage/overcurrent events within 10 µs. |
| Launch Vehicle Telemetry Unit | Radiation-Hardened Data Acquisition |
|
Use Scenario: High-speed acquisition and preprocessing of strain gauge, accelerometer, and pyro-switch signals during ascent phase. IC Role / Device Role / Timing Role: Deterministic data concentrator with synchronized ADC sampling and packetized CAN transmission. Use Value: Simultaneous 16-channel ADC sampling at 1 MSPS and PIE-driven interrupt handling guarantee zero-data-loss burst capture under vibration. |
Use Scenario: Long-duration environmental monitoring in geosynchronous orbit using thermocouples, pressure transducers, and radiation dosimeters. IC Role / Device Role / Timing Role: Low-power autonomous logger with STANDBY mode, RTC wakeup, and Flash-resident firmware integrity checking. Use Value: –55°C to +125°C operation and Class V screening ensure >15-year functional stability without thermal cycling degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital signal controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SM320F28377DPTP | Higher-performance C28x+CLA dual-core, 1 MB Flash, 200-MHz CPU, but commercial-temp only (–40°C to 105°C) and non-radiation-hardened. | Targeted at industrial servo drives and grid-tie inverters where radiation tolerance is not required. | Select when higher computational throughput is needed and space qualification is unnecessary. |
| SM320C6701GJC | Floating-point C67x DSP, 160-MHz, no integrated PWM/ADC peripherals, requires external interface for motor control functions. | Suitable for algorithm-intensive signal processing (e.g., radar beamforming), not real-time embedded control loops. | Select only for floating-point math workloads where peripheral integration is handled externally. |
Compared with SM320F28335GJZMEP, SM320F28377DPTP offers greater compute headroom but lacks radiation hardening and extended temperature range, while SM320C6701GJC provides floating-point precision at the cost of control-peripheral integration and deterministic latency - making SM320F28335GJZMEP uniquely suited for radiation-tolerant, real-time embedded control.
Availability
SM320F28335GJZMEP is available at Aetrix Electronics and suitable for electric propulsion control, avionics power management, launch vehicle telemetry, and radiation-hardened data acquisition requiring stable component supply across extended product lifecycles.
Supply support for SM320F28335GJZMEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of aerospace and defense component heritage.
The SM320F28335GJZMEP belongs to TI's C2000™ real-time control DSC family, engineered specifically for deterministic, high-precision control in harsh-environment applications such as spaceflight, missile guidance, and nuclear instrumentation.
FAQ
What is the operating temperature range of the SM320F28335GJZMEP?
The SM320F28335GJZMEP is rated for operation from –55°C to +125°C and qualified per MIL-PRF-38535 Class V. This extended range ensures reliable functionality in orbital thermal vacuum, launch vibration, and re-entry environments without thermal derating or additional cooling infrastructure. The SM320F28335GJZMEP maintains full electrical specifications across this entire range, including ADC linearity, PWM timing accuracy, and Flash retention.
Does the SM320F28335GJZMEP include radiation-hardened circuitry?
Yes, the SM320F28335GJZMEP is radiation-hardened to meet MIL-PRF-38535 Class V requirements, including total ionizing dose (TID) tolerance ≥100 krad(Si) and single-event latchup (SEL) immunity. These characteristics are verified through lot acceptance testing and documented in TI's QML-V certification reports. The SM320F28335GJZMEP is approved for use in LEO, GEO, and deep-space missions where radiation-induced failures must be mitigated.
What package type does the SM320F28335GJZMEP use?
The SM320F28335GJZMEP uses a 176-ball plastic BGA package with designation GJZ, measuring 15 mm × 15 mm with 1.0 mm ball pitch. This package supports automated optical inspection (AOI), X-ray void detection, and standard reflow profiles for high-reliability assembly. The GJZ package is mechanically and thermally optimized for aerospace PCB stacking and thermal dissipation under conduction-cooled conditions.
How many PWM channels does the SM320F28335GJZMEP support?
The SM320F28335GJZMEP integrates six enhanced PWM (ePWM) modules, each providing two complementary outputs (A/B), for a total of 12 PWM channels. Each module includes high-resolution extension (HRPWM), trip-zone protection, dead-band generation, and event-triggered ADC start-of-conversion. This configuration supports full three-phase inverter control with redundancy and fault isolation in the SM320F28335GJZMEP.
Is the SM320F28335GJZMEP pin-compatible with other C2000™ DSCs?
No, the SM320F28335GJZMEP is not pin-compatible with other C2000™ devices due to its unique 176-ball GJZ BGA footprint and radiation-hardened I/O structure. While functionally similar to commercial F28335 variants, the SM320F28335GJZMEP has distinct power sequencing, decoupling, and grounding requirements mandated by MIL-PRF-38535 Class V. Migration requires board redesign and layout validation per TI's SM320F28335GJZMEP design guide.
SM320F28335GJZMEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 176-BGA
- Series:
- C2000™ C28x Delfino™
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- C28x
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 88
- Program Memory Size:
- 512KB (256K x 16)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 34K x 16
- Voltage - Supply (Vcc/Vdd):
- 1.805V ~ 1.995V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SM320F28335GJZMEP FAQ
1.How can I place an order for SM320F28335GJZMEP through Aetrix?
Please submit a Request for Quotation (RFQ) for SM320F28335GJZMEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SM320F28335GJZMEP reliable?
The price and inventory of SM320F28335GJZMEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SM320F28335GJZMEP is usually 5 days.
3.What payment methods are accepted for SM320F28335GJZMEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SM320F28335GJZMEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SM320F28335GJZMEP?
SM320F28335GJZMEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SM320F28335GJZMEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SM320F28335GJZMEP?
For technical support, including SM320F28335GJZMEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SM320F28335GJZMEP requirements.
6.How does Aetrix verify that SM320F28335GJZMEP is sourced from the original manufacturer or authorized distributors?
All SM320F28335GJZMEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SM320F28335GJZMEP meets industry standards.
7.What is the process for return or replacement of SM320F28335GJZMEP?
All SM320F28335GJZMEP units undergo pre-shipment inspection (PSI). If there is an issue with SM320F28335GJZMEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SM320F28335GJZMEP part is unused and in its original packaging.
Return procedure for SM320F28335GJZMEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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