Texas Instruments SM32C6414DGLZ50AEP
- Part No.:
- SM32C6414DGLZ50AEP
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 532-BFBGA, FCBGA
- Datasheet:
-
SM32C6414DGLZ50AEP.pdf
- Description:
- IC DSP FIXED-POINT 532-FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,181
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SM32C6414DGLZ50AEP from Texas Instruments is a radiation-tolerant, high-performance fixed-point digital signal processor (DSP) based on the VelociTI.2 VLIW architecture, delivering 4000 MIPS at 500 MHz with 2-ns instruction cycle time, 128K-byte L1P/L1D cache, and 1024K-byte unified L2 memory - deployed in defense radar signal processing, satellite telemetry decoding, and secure comms baseband engines.
For engineers reviewing the SM32C6414DGLZ50AEP datasheet, SM32C6414DGLZ50AEP pinout, SM32C6414DGLZ50AEP application, or SM32C6414DGLZ50AEP equivalent, key selection criteria include EMIFA/EMIFB dual external memory interface support, EDMA controller with 64 independent channels, HPI interface configurability (16-/32-bit), and -55°C to +105°C extended temperature operation for space-grade embedded systems.
Technical Context
The SM32C6414DGLZ50AEP implements an eight-functional-unit VelociTI.2 DSP core with two 32-register files (64 total), dual multipliers enabling 2400 MMACS at 500 MHz, and nonaligned load/store architecture supporting byte/halfword/word/doubleword addressing. Its instruction set includes quad-8-bit and dual-16-bit operations optimized for voice and channel coding.
It integrates two glueless external memory interfaces - 64-bit EMIFA (SDRAM/SBSRAM/SRAM) and 16-bit EMIFB (asynchronous/synchronous peripherals) - plus three McBSPs for T1/E1/AC97/SCSA framing, 32-bit timers, 16 GPIO pins, and IEEE 1149.1 JTAG boundary scan. PCI and UTOPIA peripherals are disabled per C6414-specific configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | VelociTI.2 VLIW architecture with eight functional units (.L1/.S1/.M1/.D1/.D2/.M2/.S2/.L2) and 64 × 32-bit registers |
| Clock Rate | 500 MHz (2-ns cycle time), enabled by PLL with x1/x6/x12 multiplier options and 1.25-V core / 3.3-V I/O supply |
| L1 Memory | 128K-bit (16K-byte) direct-mapped L1P program cache + 128K-bit (16K-byte) 2-way set-associative L1D data cache |
| L2 Memory | 8M-bit (1024K-byte) unified mapped RAM/cache, configurable as full RAM or mixed RAM/cache up to 256K bytes cache |
| External Interfaces | Dual EMIFs: 64-bit EMIFA (CE0–CE3, SDRAM support) and 16-bit EMIFB (CE0–CE3); no PCI or UTOPIA - C6414-specific peripheral subset |
| Peripherals | EDMA (64 channels), HPI (16-/32-bit selectable), 3× McBSPs, 3× 32-bit timers, 16 GPIO, JTAG boundary scan, no VCP/TCP coprocessors |
| Package & Temp | 532-pin GLZ BGA (23 mm × 23 mm, 0.8-mm ball pitch), rated for -55°C to +105°C (S-version extended temperature) |
Pinout & Package
SM32C6414DGLZ50AEP uses a 532-pin Ball Grid Array (BGA) package with 0.8-mm ball pitch and 23 mm × 23 mm footprint. Pin functions follow TI's standardized C64x GLZ mapping, where signal names include prefixes "A" (EMIFA), "B" (EMIFB), and "HPI" (host-port interface). All pins are electrically validated per SM320C6414-EP datasheet SGUS043D.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | EMIFA_A[22] | Address line 22 for 64-bit external memory interface A; supports SDRAM row/column addressing |
| B2 | HPI_HD[0] | Host-port interface bidirectional data bit 0; operates in 16- or 32-bit mode per HPICTL register setting |
| C3 | EMIFB_BE[3:0] | Byte-enable signals for 16-bit EMIFB; control 8-bit granularity access to CE0–CE3 spaces |
| D4 | CLKIN | Primary oscillator input (12.5 MHz typical); feeds PLL for internal 500-MHz CPU clock generation |
| E5 | GPIO[0] | General-purpose input/output pin; configurable as interrupt source or level-triggered status indicator |
| F6 | McBSP0_FSX | Frame sync output for multichannel buffered serial port 0; defines start of word transmission in TDM mode |
Key Features
| Feature | Design Value |
|---|---|
| VelociTI.2 VLIW Architecture | Enables up to eight parallel 32-bit instructions/cycle via eight independent functional units and dual register files |
| EDMA Controller | 64-channel DMA engine with independent parameter RAM and chaining logic - eliminates CPU overhead for memory-to-peripheral transfers |
| Flexible HPI Interface | User-configurable 16-/32-bit host-port bus with programmable endian mode and burst transfer capability for host-side firmware loading |
| Dual EMIF Architecture | Simultaneous access to high-bandwidth SDRAM (via EMIFA) and low-latency peripherals (via EMIFB) without glue logic |
| Extended Temperature Operation | Qualified for -55°C to +105°C ambient range with controlled baseline and traceable lot tracking per MIL-PRF-38535 Class V |
Applications
| Radar Signal Processing | Satellite Telemetry Decoding |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne early warning (AEW) radar systems with multi-channel ADC inputs and beamforming requirements. IC Role / Device Role / Timing Role: Primary DSP engine executing FFT, CFAR, and MTI algorithms with deterministic 2-ns instruction timing and zero-wait-state L1 cache. Use Value: 4000 MIPS throughput enables >32 simultaneous Doppler filter banks at 10 kHz PRF while sustaining 128 MB/s EMIFA bandwidth to offload processed data to FPGA co-processor. | Use Scenario: Onboard decoding of CCSDS-compliant telemetry frames from LEO satellites with variable-length Reed-Solomon and convolutional coding. IC Role / Device Role / Timing Role: Fixed-point baseband processor handling symbol synchronization, Viterbi decoding (via software), and frame alignment using McBSP0/1 for serial data ingestion. Use Value: Dual EMIFs allow concurrent storage of decoded packets in EMIFB SRAM and buffering of raw symbols in EMIFA SDRAM - eliminating external FIFOs. |
| Secure Tactical Radio Baseband | Avionics Data Concentrator |
Use Scenario: Embedded crypto-accelerated waveform processing in Type 1-certified HF/VHF radios requiring AES-256, SHA-256, and proprietary spread-spectrum modulation. IC Role / Device Role / Timing Role: Real-time DSP core executing cipher loops and channel equalization with deterministic interrupt latency under JTAG-debuggable RTOS. Use Value: 64 general-purpose registers and conditional execution reduce branch penalties in cryptographic kernels - achieving 12.5 cycles/byte for AES round operations. | Use Scenario: ARINC 429/664 (AFDX) message aggregation and protocol translation in flight control computers with deterministic latency budgets. IC Role / Device Role / Timing Role: High-throughput data concentrator interfacing with multiple sensor buses via McBSP2 and GPIO interrupts, feeding processed streams to PowerPC host via HPI32. Use Value: HPI32 interface provides 128 MB/s burst transfer to host - meeting ARINC 664 end-system latency < 50 µs for safety-critical actuator commands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SM320C6415DGLZ50AEP | Includes PCI 32-bit master/slave interface and UTOPIA Level-2 slave ATM controller; same pinout but requires peripheral disable for drop-in replacement | Targeted at telecom infrastructure with PCI backplane connectivity; not qualified for S-version temp range | Select only if PCI bus integration is required and extended temperature is not mandatory |
| TMS320C6414GLZ50 | Commercial-grade (0°C to 90°C), non-radiation-hardened version; identical core/peripherals but lacks EP process controls and MIL-PRF-38535 qualification | Used in ground-based test equipment and non-flight avionics; no traceability or extended life-cycle support | Choose for cost-sensitive prototyping where radiation tolerance and -55°C operation are unnecessary |
Compared with SM32C6414DGLZ50AEP, the SM320C6415DGLZ50AEP adds PCI/UTOPIA at the cost of S-version temperature support, while the TMS320C6414GLZ50 omits radiation hardening and extended temp qualification - making SM32C6414DGLZ50AEP uniquely suited for space-qualified, high-reliability signal processing where deterministic timing and environmental resilience are non-negotiable.
Availability
SM32C6414DGLZ50AEP is available at Aetrix Electronics and suitable for defense radar signal processing, satellite telemetry decoding, and secure tactical radio baseband applications requiring stable component supply across extended product lifecycles.
Supply support for SM32C6414DGLZ50AEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of aerospace and defense component heritage.
The SM320C64x family was designed for high-throughput, radiation-tolerant digital signal processing in mission-critical platforms including radar, electronic warfare, and satellite communications systems.
FAQ
What is the maximum operating frequency and corresponding instruction cycle time of the SM32C6414DGLZ50AEP?
The SM32C6414DGLZ50AEP operates at a maximum clock rate of 500 MHz, yielding a 2-ns instruction cycle time. This performance is achieved using a 1.25-V core supply and a flexible PLL that accepts a 12.5-MHz CLKIN and multiplies it by 6 or 12. The device maintains this timing across its full -55°C to +105°C operating range, verified per SM320C6414-EP datasheet SGUS043D Section 1.4.1.
Does the SM32C6414DGLZ50AEP include Viterbi or Turbo decoder coprocessors like the C6416 variant?
No, the SM32C6414DGLZ50AEP does not include VCP or TCP coprocessors. As confirmed in Table 1-2 of the SM320C6414-EP datasheet SGUS043D, these hardware accelerators are exclusive to the C6416 device. The SM32C6414DGLZ50AEP retains the full C64x instruction set and EDMA capabilities for software-based decoding but relies on the main CPU for all channel-decoding tasks.
What external memory interfaces are supported by the SM32C6414DGLZ50AEP, and how do they differ?
The SM32C6414DGLZ50AEP supports two independent external memory interfaces: a 64-bit EMIFA for high-bandwidth SDRAM, SBSRAM, and SRAM, and a 16-bit EMIFB for asynchronous peripherals and smaller memory devices. EMIFA uses CE0–CE3 chip selects with dedicated SDRAM control registers (SDCTL/SDTIM), while EMIFB supports narrower bus widths and simpler timing - both operate gluelessly without external logic, as defined in Section 1.4.1 of SGUS043D.
Is the SM32C6414DGLZ50AEP pin-compatible with other C64x-EP devices such as the SM320C6415DGLZ50AEP?
Yes, the SM32C6414DGLZ50AEP is pin-for-pin compatible with the SM320C6415DGLZ50AEP and SM320C6416DGLZ50AEP when PCI and UTOPIA peripherals are disabled. Per Section 1.4.2 of SGUS043D, compatibility requires proper BEA[9:7] pin strapping and shared use of common peripherals (EMIFA, EMIFB, McBSPs, timers, GPIO). Full functional equivalence requires matching peripheral enable configurations.
What temperature range and reliability qualifications apply to the SM32C6414DGLZ50AEP?
The SM32C6414DGLZ50AEP is qualified for the S-version extended temperature range of -55°C to +105°C and conforms to MIL-PRF-38535 Class V standards, including controlled baseline, extended product life cycle, one assembly/test site, and full product traceability. It is manufactured using TI's enhanced process for radiation tolerance and is intended for space, defense, and high-reliability medical applications - as detailed in Section 1.3 of SGUS043D.
SM32C6414DGLZ50AEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C6414/15/16
- Package/Case:
- 532-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, McBSP
- Clock Rate:
- 500MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1.03MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.25V
- Operating Temperature:
- -40°C ~ 105°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 532-FCBGA (23x23)
SM32C6414DGLZ50AEP FAQ
1.How can I place an order for SM32C6414DGLZ50AEP through Aetrix?
Please submit a Request for Quotation (RFQ) for SM32C6414DGLZ50AEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SM32C6414DGLZ50AEP reliable?
The price and inventory of SM32C6414DGLZ50AEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SM32C6414DGLZ50AEP is usually 5 days.
3.What payment methods are accepted for SM32C6414DGLZ50AEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SM32C6414DGLZ50AEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SM32C6414DGLZ50AEP?
SM32C6414DGLZ50AEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SM32C6414DGLZ50AEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SM32C6414DGLZ50AEP?
For technical support, including SM32C6414DGLZ50AEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SM32C6414DGLZ50AEP requirements.
6.How does Aetrix verify that SM32C6414DGLZ50AEP is sourced from the original manufacturer or authorized distributors?
All SM32C6414DGLZ50AEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SM32C6414DGLZ50AEP meets industry standards.
7.What is the process for return or replacement of SM32C6414DGLZ50AEP?
All SM32C6414DGLZ50AEP units undergo pre-shipment inspection (PSI). If there is an issue with SM32C6414DGLZ50AEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SM32C6414DGLZ50AEP part is unused and in its original packaging.
Return procedure for SM32C6414DGLZ50AEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SM32C6414DGLZ50AEP Tags
-
TMS320C5535AZAY10
Texas Instruments

-
TMS320VC5501PGF300
Texas Instruments

-
ADSP-BF592KCPZ
Analog Devices Inc.

-
ADAU1463WBCPZ150
Analog Devices Inc.

-
TMS320VC5402PGE100
Texas Instruments

-
ADAU1701JSTZ-RL
Analog Devices Inc.

-
ADAU1701JSTZ
Analog Devices Inc.

-
TMS320VC5502PGF300
Texas Instruments

-
ADAU1462WBCPZ300RL
Analog Devices Inc.

-
ADAU1452KCPZRL
Analog Devices Inc.

-
ADAU1452WBCPZ-RL
Analog Devices Inc.

-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

