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Texas Instruments SM32C6414DGLZ50AEP

Part No.:
SM32C6414DGLZ50AEP
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
532-BFBGA, FCBGA
Datasheet:
AetrixSM32C6414DGLZ50AEP.pdf
Description:
IC DSP FIXED-POINT 532-FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,181

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Product details

Overview

SM32C6414DGLZ50AEP from Texas Instruments is a radiation-tolerant, high-performance fixed-point digital signal processor (DSP) based on the VelociTI.2 VLIW architecture, delivering 4000 MIPS at 500 MHz with 2-ns instruction cycle time, 128K-byte L1P/L1D cache, and 1024K-byte unified L2 memory - deployed in defense radar signal processing, satellite telemetry decoding, and secure comms baseband engines.

For engineers reviewing the SM32C6414DGLZ50AEP datasheet, SM32C6414DGLZ50AEP pinout, SM32C6414DGLZ50AEP application, or SM32C6414DGLZ50AEP equivalent, key selection criteria include EMIFA/EMIFB dual external memory interface support, EDMA controller with 64 independent channels, HPI interface configurability (16-/32-bit), and -55°C to +105°C extended temperature operation for space-grade embedded systems.

Technical Context

The SM32C6414DGLZ50AEP implements an eight-functional-unit VelociTI.2 DSP core with two 32-register files (64 total), dual multipliers enabling 2400 MMACS at 500 MHz, and nonaligned load/store architecture supporting byte/halfword/word/doubleword addressing. Its instruction set includes quad-8-bit and dual-16-bit operations optimized for voice and channel coding.

It integrates two glueless external memory interfaces - 64-bit EMIFA (SDRAM/SBSRAM/SRAM) and 16-bit EMIFB (asynchronous/synchronous peripherals) - plus three McBSPs for T1/E1/AC97/SCSA framing, 32-bit timers, 16 GPIO pins, and IEEE 1149.1 JTAG boundary scan. PCI and UTOPIA peripherals are disabled per C6414-specific configuration.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreVelociTI.2 VLIW architecture with eight functional units (.L1/.S1/.M1/.D1/.D2/.M2/.S2/.L2) and 64 × 32-bit registers
Clock Rate500 MHz (2-ns cycle time), enabled by PLL with x1/x6/x12 multiplier options and 1.25-V core / 3.3-V I/O supply
L1 Memory128K-bit (16K-byte) direct-mapped L1P program cache + 128K-bit (16K-byte) 2-way set-associative L1D data cache
L2 Memory8M-bit (1024K-byte) unified mapped RAM/cache, configurable as full RAM or mixed RAM/cache up to 256K bytes cache
External InterfacesDual EMIFs: 64-bit EMIFA (CE0–CE3, SDRAM support) and 16-bit EMIFB (CE0–CE3); no PCI or UTOPIA - C6414-specific peripheral subset
PeripheralsEDMA (64 channels), HPI (16-/32-bit selectable), 3× McBSPs, 3× 32-bit timers, 16 GPIO, JTAG boundary scan, no VCP/TCP coprocessors
Package & Temp532-pin GLZ BGA (23 mm × 23 mm, 0.8-mm ball pitch), rated for -55°C to +105°C (S-version extended temperature)

Pinout & Package

SM32C6414DGLZ50AEP uses a 532-pin Ball Grid Array (BGA) package with 0.8-mm ball pitch and 23 mm × 23 mm footprint. Pin functions follow TI's standardized C64x GLZ mapping, where signal names include prefixes "A" (EMIFA), "B" (EMIFB), and "HPI" (host-port interface). All pins are electrically validated per SM320C6414-EP datasheet SGUS043D.

Pin/TerminalCircuit RoleDesign Meaning
A1EMIFA_A[22]Address line 22 for 64-bit external memory interface A; supports SDRAM row/column addressing
B2HPI_HD[0]Host-port interface bidirectional data bit 0; operates in 16- or 32-bit mode per HPICTL register setting
C3EMIFB_BE[3:0]Byte-enable signals for 16-bit EMIFB; control 8-bit granularity access to CE0–CE3 spaces
D4CLKINPrimary oscillator input (12.5 MHz typical); feeds PLL for internal 500-MHz CPU clock generation
E5GPIO[0]General-purpose input/output pin; configurable as interrupt source or level-triggered status indicator
F6McBSP0_FSXFrame sync output for multichannel buffered serial port 0; defines start of word transmission in TDM mode

Key Features

FeatureDesign Value
VelociTI.2 VLIW ArchitectureEnables up to eight parallel 32-bit instructions/cycle via eight independent functional units and dual register files
EDMA Controller64-channel DMA engine with independent parameter RAM and chaining logic - eliminates CPU overhead for memory-to-peripheral transfers
Flexible HPI InterfaceUser-configurable 16-/32-bit host-port bus with programmable endian mode and burst transfer capability for host-side firmware loading
Dual EMIF ArchitectureSimultaneous access to high-bandwidth SDRAM (via EMIFA) and low-latency peripherals (via EMIFB) without glue logic
Extended Temperature OperationQualified for -55°C to +105°C ambient range with controlled baseline and traceable lot tracking per MIL-PRF-38535 Class V

Applications

Radar Signal ProcessingSatellite Telemetry Decoding

Use Scenario: Real-time pulse-Doppler processing in airborne early warning (AEW) radar systems with multi-channel ADC inputs and beamforming requirements.

IC Role / Device Role / Timing Role: Primary DSP engine executing FFT, CFAR, and MTI algorithms with deterministic 2-ns instruction timing and zero-wait-state L1 cache.

Use Value: 4000 MIPS throughput enables >32 simultaneous Doppler filter banks at 10 kHz PRF while sustaining 128 MB/s EMIFA bandwidth to offload processed data to FPGA co-processor.

Use Scenario: Onboard decoding of CCSDS-compliant telemetry frames from LEO satellites with variable-length Reed-Solomon and convolutional coding.

IC Role / Device Role / Timing Role: Fixed-point baseband processor handling symbol synchronization, Viterbi decoding (via software), and frame alignment using McBSP0/1 for serial data ingestion.

Use Value: Dual EMIFs allow concurrent storage of decoded packets in EMIFB SRAM and buffering of raw symbols in EMIFA SDRAM - eliminating external FIFOs.

Secure Tactical Radio BasebandAvionics Data Concentrator

Use Scenario: Embedded crypto-accelerated waveform processing in Type 1-certified HF/VHF radios requiring AES-256, SHA-256, and proprietary spread-spectrum modulation.

IC Role / Device Role / Timing Role: Real-time DSP core executing cipher loops and channel equalization with deterministic interrupt latency under JTAG-debuggable RTOS.

Use Value: 64 general-purpose registers and conditional execution reduce branch penalties in cryptographic kernels - achieving 12.5 cycles/byte for AES round operations.

Use Scenario: ARINC 429/664 (AFDX) message aggregation and protocol translation in flight control computers with deterministic latency budgets.

IC Role / Device Role / Timing Role: High-throughput data concentrator interfacing with multiple sensor buses via McBSP2 and GPIO interrupts, feeding processed streams to PowerPC host via HPI32.

Use Value: HPI32 interface provides 128 MB/s burst transfer to host - meeting ARINC 664 end-system latency < 50 µs for safety-critical actuator commands.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SM320C6415DGLZ50AEPIncludes PCI 32-bit master/slave interface and UTOPIA Level-2 slave ATM controller; same pinout but requires peripheral disable for drop-in replacementTargeted at telecom infrastructure with PCI backplane connectivity; not qualified for S-version temp rangeSelect only if PCI bus integration is required and extended temperature is not mandatory
TMS320C6414GLZ50Commercial-grade (0°C to 90°C), non-radiation-hardened version; identical core/peripherals but lacks EP process controls and MIL-PRF-38535 qualificationUsed in ground-based test equipment and non-flight avionics; no traceability or extended life-cycle supportChoose for cost-sensitive prototyping where radiation tolerance and -55°C operation are unnecessary

Compared with SM32C6414DGLZ50AEP, the SM320C6415DGLZ50AEP adds PCI/UTOPIA at the cost of S-version temperature support, while the TMS320C6414GLZ50 omits radiation hardening and extended temp qualification - making SM32C6414DGLZ50AEP uniquely suited for space-qualified, high-reliability signal processing where deterministic timing and environmental resilience are non-negotiable.

Availability

SM32C6414DGLZ50AEP is available at Aetrix Electronics and suitable for defense radar signal processing, satellite telemetry decoding, and secure tactical radio baseband applications requiring stable component supply across extended product lifecycles.

Supply support for SM32C6414DGLZ50AEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of aerospace and defense component heritage.

The SM320C64x family was designed for high-throughput, radiation-tolerant digital signal processing in mission-critical platforms including radar, electronic warfare, and satellite communications systems.

FAQ

What is the maximum operating frequency and corresponding instruction cycle time of the SM32C6414DGLZ50AEP?

The SM32C6414DGLZ50AEP operates at a maximum clock rate of 500 MHz, yielding a 2-ns instruction cycle time. This performance is achieved using a 1.25-V core supply and a flexible PLL that accepts a 12.5-MHz CLKIN and multiplies it by 6 or 12. The device maintains this timing across its full -55°C to +105°C operating range, verified per SM320C6414-EP datasheet SGUS043D Section 1.4.1.

Does the SM32C6414DGLZ50AEP include Viterbi or Turbo decoder coprocessors like the C6416 variant?

No, the SM32C6414DGLZ50AEP does not include VCP or TCP coprocessors. As confirmed in Table 1-2 of the SM320C6414-EP datasheet SGUS043D, these hardware accelerators are exclusive to the C6416 device. The SM32C6414DGLZ50AEP retains the full C64x instruction set and EDMA capabilities for software-based decoding but relies on the main CPU for all channel-decoding tasks.

What external memory interfaces are supported by the SM32C6414DGLZ50AEP, and how do they differ?

The SM32C6414DGLZ50AEP supports two independent external memory interfaces: a 64-bit EMIFA for high-bandwidth SDRAM, SBSRAM, and SRAM, and a 16-bit EMIFB for asynchronous peripherals and smaller memory devices. EMIFA uses CE0–CE3 chip selects with dedicated SDRAM control registers (SDCTL/SDTIM), while EMIFB supports narrower bus widths and simpler timing - both operate gluelessly without external logic, as defined in Section 1.4.1 of SGUS043D.

Is the SM32C6414DGLZ50AEP pin-compatible with other C64x-EP devices such as the SM320C6415DGLZ50AEP?

Yes, the SM32C6414DGLZ50AEP is pin-for-pin compatible with the SM320C6415DGLZ50AEP and SM320C6416DGLZ50AEP when PCI and UTOPIA peripherals are disabled. Per Section 1.4.2 of SGUS043D, compatibility requires proper BEA[9:7] pin strapping and shared use of common peripherals (EMIFA, EMIFB, McBSPs, timers, GPIO). Full functional equivalence requires matching peripheral enable configurations.

What temperature range and reliability qualifications apply to the SM32C6414DGLZ50AEP?

The SM32C6414DGLZ50AEP is qualified for the S-version extended temperature range of -55°C to +105°C and conforms to MIL-PRF-38535 Class V standards, including controlled baseline, extended product life cycle, one assembly/test site, and full product traceability. It is manufactured using TI's enhanced process for radiation tolerance and is intended for space, defense, and high-reliability medical applications - as detailed in Section 1.3 of SGUS043D.

SM32C6414DGLZ50AEP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C6414/15/16
Package/Case:
532-BFBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Type:
Fixed Point
Interface:
Host Interface, McBSP
Clock Rate:
500MHz
Non-Volatile Memory:
External
On-Chip RAM:
1.03MB
Voltage - I/O:
3.30V
Voltage - Core:
1.25V
Operating Temperature:
-40°C ~ 105°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
532-FCBGA (23x23)

SM32C6414DGLZ50AEP FAQ

1.How can I place an order for SM32C6414DGLZ50AEP through Aetrix?

Please submit a Request for Quotation (RFQ) for SM32C6414DGLZ50AEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SM32C6414DGLZ50AEP reliable?

The price and inventory of SM32C6414DGLZ50AEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SM32C6414DGLZ50AEP is usually 5 days.

3.What payment methods are accepted for SM32C6414DGLZ50AEP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SM32C6414DGLZ50AEP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SM32C6414DGLZ50AEP?

SM32C6414DGLZ50AEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SM32C6414DGLZ50AEP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SM32C6414DGLZ50AEP?

For technical support, including SM32C6414DGLZ50AEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SM32C6414DGLZ50AEP requirements.

6.How does Aetrix verify that SM32C6414DGLZ50AEP is sourced from the original manufacturer or authorized distributors?

All SM32C6414DGLZ50AEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SM32C6414DGLZ50AEP meets industry standards.

7.What is the process for return or replacement of SM32C6414DGLZ50AEP?

All SM32C6414DGLZ50AEP units undergo pre-shipment inspection (PSI). If there is an issue with SM32C6414DGLZ50AEP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SM32C6414DGLZ50AEP part is unused and in its original packaging.

Return procedure for SM32C6414DGLZ50AEP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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