Texas Instruments SM32C6711DGDPA16EP

Overview

SM32C6711DGDPA16EP from Texas Instruments is a radiation-hardened, high-performance floating-point digital signal processor (DSP) based on the C67x VLIW architecture. It operates at 167 MHz (6 ns cycle time), delivers 1000 MFLOPS, integrates 64KB L2 unified RAM/cache, and supports SDRAM/SDRAM glueless interfacing - deployed in spaceborne radar processing, telemetry compression, and onboard scientific instrument control.

For engineers reviewing the SM32C6711DGDPA16EP datasheet, SM32C6711DGDPA16EP pinout, SM32C6711DGDPA16EP application, or SM32C6711DGDPA16EP equivalent, key selection criteria include its 272-pin GDP BGA package, 1.20V core voltage, software-configurable PLL with 4×–25× multiplier, GPIO module, and EMIF Big Endian mode correctness - all validated for extended temperature operation and TID-rated environments.

Technical Context

The SM32C6711DGDPA16EP implements an eight-functional-unit VLIW DSP core with four floating-/fixed-point ALUs, two fixed-point ALUs, and two floating-/fixed-point multipliers - enabling two MACs per cycle (400 MMACS). Its L1P/L1D cache hierarchy (4KB direct-mapped program / 4KB 2-way set-associative data) feeds into a flexible 64KB L2 unified memory space configurable as RAM, cache, or hybrid.

It features a software-programmable PLL controller (not hardware-fixed), GPIO module with five pins, IEEE-1149.1 JTAG boundary-scan, dual McBSPs supporting AC97 and SPI protocols, 32-bit EMIF with CE0–CE3 spaces (256MB each), and HPI for host co-processing - all built on 0.13-µm copper CMOS for radiation tolerance and thermal stability.

Key Specifications

Pinout & Package

SM32C6711DGDPA16EP uses the GDP 272-pin Ball Grid Array (BGA) package, measuring 27 mm × 27 mm, with bottom-view ball layout optimized for thermal dissipation and signal integrity in space-grade PCB stacks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar floating-point DSP applications.

Compared with SM320C6711CGDPA167EP, the SM32C6711DGDPA16EP adds hardware-corrected Big Endian mode and L1D arbitration control - critical for interoperability with legacy space buses. Versus SM320C6711DGDPA200EP, it trades 200 MHz peak performance for lower core voltage (1.20 V) and reduced thermal load in constrained enclosures.

Availability

SM32C6711DGDPA16EP is available at Aetrix Electronics and suitable for spaceflight avionics, radiation-hardened telemetry systems, and onboard scientific instrument control requiring stable component supply across long-duration missions and Class-S production lifecycles.

Supply support for SM32C6711DGDPA16EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and aerospace-grade ICs, with decades of heritage in radiation-hardened microelectronics for NASA and DoD programs.

The SM32C6711DGDPA16EP belongs to TI's SM320C67x military/aerospace DSP family, engineered specifically for high-reliability, extended-temperature, and TID-rated applications in orbital and deep-space platforms.

FAQ

What is the maximum operating frequency of the SM32C6711DGDPA16EP?

The SM32C6711DGDPA16EP is rated for 167 MHz operation with a 6 ns instruction cycle time. This speed grade is validated across the full −55°C to +125°C temperature range and under total ionizing dose conditions up to 100 krad(Si), making it suitable for low-earth orbit and interplanetary missions where thermal and radiation margins are critical. The SM32C6711DGDPA16EP does not support overclocking beyond this specification.

Does the SM32C6711DGDPA16EP support Little Endian and Big Endian modes?

Yes, the SM32C6711DGDPA16EP supports both Little Endian and Big Endian operation via device configuration registers. Crucially, the SM32C6711DGDPA16EP includes hardware-corrected Big Endian mode for the EMIF - a feature absent in earlier C6711C variants - ensuring reliable byte ordering when interfacing with legacy avionics buses and FPGA-based peripherals that require strict IEEE-754 compliance.

What package type and pin count does the SM32C6711DGDPA16EP use?

The SM32C6711DGDPA16EP uses the GDP 272-pin Ball Grid Array (BGA) package, measuring 27 mm × 27 mm. This package is distinct from the older GFN 256-pin BGA used by C6711/C6711B variants. The GDP footprint supports higher I/O density and improved thermal performance required for sustained 167 MHz operation in sealed, conduction-cooled satellite modules.

How does the PLL architecture of the SM32C6711DGDPA16EP differ from earlier C6711 variants?

The SM32C6711DGDPA16EP implements a software-configurable PLL controller (not a fixed hardware PLL), supporting multiplier values from ×4 to ×25 and divider ratios from /1 to /32. This flexibility enables dynamic clock scaling during mission phases - such as lowering frequency during eclipse periods - unlike the fixed ×4 or bypass-only PLL in C6711/C6711B devices. The SM32C6711DGDPA16EP PLL is fully register-controlled via dedicated PLL controller registers at 0x01B7C000–0x01B7DFFF.

Is the GPIO module available on the SM32C6711DGDPA16EP?

Yes, the SM32C6711DGDPA16EP includes a dedicated General-Purpose Input/Output (GPIO) module with five pins - a feature introduced with the C6711C/D generation and not present in C6711/C6711B. These GPIOs are fully software-configurable for input/output direction, pull-up/down, and interrupt generation, and are mapped to registers at 0x01B00000–0x01B03FFF. They provide essential system-level control signals without requiring external logic in radiation-hardened designs.