Texas Instruments SM32C6711DGDPI20EP

Overview

SM32C6711DGDPI20EP from Texas Instruments is a radiation-hardened, high-performance floating-point digital signal processor (DSP) based on the C67x VLIW architecture. It operates at 200 MHz (5-ns cycle time), delivers 1200 MFLOPS, integrates 64KB L2 unified RAM/cache, dual McBSPs, 16-channel EDMA, and a glueless 32-bit EMIF supporting SDRAM/SBSRAM. It targets real-time radar signal processing in spaceborne avionics systems.

For engineers reviewing the SM32C6711DGDPI20EP datasheet, SM32C6711DGDPI20EP pinout, SM32C6711DGDPI20EP application, or SM32C6711DGDPI20EP equivalent, key selection criteria include its 272-pin GDP BGA package, 1.20-V core voltage, software-configurable PLL with x4–x25 multiplier, GPIO module, and EMIF Big Endian mode correctness - all validated for extended temperature operation (−55°C to 125°C) under MIL-PRF-38535 Class V requirements.

Technical Context

The SM32C6711DGDPI20EP implements an eight-functional-unit VLIW DSP core with four floating-/fixed-point ALUs, two fixed-point ALUs, and two floating-/fixed-point multipliers - enabling two MACs per cycle (400 MMACS). Its L1P/L1D cache hierarchy (4KB direct-mapped program / 4KB 2-way set-associative data) feeds a flexible 64KB L2 memory that supports configurable allocation between program and data space.

It features a software-programmable PLL controller (not hardware PLL), supporting prescaler (/1–/32), multiplier (x4–x25), and postscaler (/1–/32) for precise clock generation. The device includes dedicated GPIO (5 pins), EMIF with CE0–CE3 spaces (256MB each), HPI (16-bit), two 32-bit timers, and IEEE-1149.1 JTAG boundary-scan - all qualified per enhanced product-change notification and DMS support protocols.

Key Specifications

Pinout & Package

SM32C6711DGDPI20EP uses the GDP 272-pin Ball Grid Array (BGA) package (27 × 27 mm), designed for high-reliability aerospace deployment with controlled baseline manufacturing and enhanced DMS support.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar floating-point DSP applications.

Compared with SM32C6711CGDPI20EP, the SM32C6711DGDPI20EP provides 20% higher clock rate and added EMIF Big Endian correctness - essential for legacy bus compatibility. Against SM32C6711DGDPI25EP, it trades 150 MFLOPS for lower core voltage and reduced thermal load in thermally constrained satellite bays.

Availability

SM32C6711DGDPI20EP is available at Aetrix Electronics and suitable for space avionics, radar subsystems, and electronic warfare platforms requiring stable component supply across extended product lifecycles and radiation-tolerant qualification.

Supply support for SM32C6711DGDPI20EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and aerospace-grade ICs, with decades of heritage in high-reliability DSP design.

The SM32C6711DGDPI20EP belongs to TI's radiation-hardened C67x DSP family, engineered specifically for deterministic, high-throughput signal processing in mission-critical space and defense systems where failure is not an option.

FAQ

What is the maximum operating frequency of the SM32C6711DGDPI20EP?

The SM32C6711DGDPI20EP is rated for a maximum clock frequency of 200 MHz, corresponding to a 5-ns instruction cycle time. This speed is validated across the full −55°C to +125°C operating temperature range and is supported by its 1.20-V core supply and 0.13-µm copper process technology. The SM32C6711DGDPI20EP achieves 1200 MFLOPS at this frequency.

Does the SM32C6711DGDPI20EP support Big Endian memory addressing?

Yes, the SM32C6711DGDPI20EP includes the EMIFBE bit in its EMIF configuration, ensuring correct Big Endian mode operation - a feature absent in earlier C6711/C6711B variants. This capability is explicitly documented in the device's electrical characteristics table and is required for interoperability with legacy avionics buses and memory-mapped peripherals using Big Endian byte ordering.

What package type and pin count does the SM32C6711DGDPI20EP use?

The SM32C6711DGDPI20EP uses the GDP 272-pin Ball Grid Array (BGA) package with a 27 × 27 mm footprint. This ceramic BGA is qualified per MIL-PRF-38535 Class V and supports enhanced Diminishing Manufacturing Sources (DMS) and Controlled Baseline manufacturing - critical for long-lifecycle aerospace programs.

How does the PLL implementation differ between SM32C6711DGDPI20EP and earlier C6711B variants?

Unlike the fixed-ratio hardware PLL in the C6711B, the SM32C6711DGDPI20EP implements a fully software-configurable PLL controller with independent prescaler (/1–/32), multiplier (x4–x25), and postscaler (/1–/32) settings. This enables dynamic clock reconfiguration in-flight and eliminates need for external PLL components - a key enhancement introduced with the C6711C/D family.

Is the GPIO module available on the SM32C6711DGDPI20EP?

Yes, the SM32C6711DGDPI20EP includes a dedicated 5-pin General-Purpose Input/Output (GPIO) module, as confirmed in the device characteristics table and functional block diagram. This module is exclusive to C6711C and C6711D variants and supports configurable direction, interrupt generation, and status signaling - enabling hardware coordination with FPGAs or power management ICs in radiation-hardened systems.