Texas Instruments SM470R1B1MPGES
- Part No.:
- SM470R1B1MPGES
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SM470R1B1MPGES.pdf
- Description:
- IC MCU 16/32BIT 1MB FLSH 144LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SM470R1B1MPGES from Texas Instruments is a radiation-tolerant, high-temperature 16-/32-bit RISC microcontroller based on the ARM7TDMI™ core, operating at up to 60 MHz with 1 MB flash and 64 KB SRAM. It integrates two High-End CAN Controllers (HECC), five I²C modules, three SCIs, two SPIs, a 12-channel 10-bit MibADC, and a 12-pin High-End Timer Lite (HET) - designed for real-time control in harsh industrial and aerospace environments.
For engineers reviewing the SM470R1B1MPGES datasheet, SM470R1B1MPGES pinout, SM470R1B1MPGES application, or SM470R1B1MPGES equivalent, this device is selected for extreme-temperature embedded systems requiring dual CAN bus redundancy, deterministic timing via HET, secure memory access (MSM/JTAG security), and robust analog-to-digital acquisition with 1.55-µs conversion time.
Technical Context
The SM470R1B1MPGES implements the ARM7TDMI 16-/32-bit RISC CPU in big-endian mode with pipeline execution, delivering high instruction throughput while maintaining code efficiency. Its 470+ system module (SYS) provides address decoding, memory protection, bus supervision, and prioritized interrupt management across 16 external and multiple internal sources.
Timing is governed by a zero-pin PLL (ZPLL) clock module supporting multiply-by-4 or -8 internal scaling and bypass mode, generating ACLK, SYSCLK, MCLK, and ICLK. The HET Lite peripheral uses a reduced-instruction-set micromachine with 64-word RAM and XOR-share capability for sub-channel pulse generation, while the MibADC supports three configurable conversion groups with 64-word FIFO and analog/digital watchdog timers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM7TDMI 16-/32-bit RISC CPU, big-endian, pipeline-capable, 60-MHz max system clock |
| Memory | 1 MB flash (2 banks, 16 sectors), 64 KB SRAM - both support single-cycle byte/half-word/word access |
| Analog Peripherals | 12-channel 10-bit MibADC with 64-word FIFO, 1.55-µs min sample/conversion time, calibration/self-test modes |
| Communication Interfaces | 2 HECC (CAN 2.0B, up to 1 Mbps), 3 SCI, 2 SPI, 5 I²C (up to 400 Kbps), all with programmable baud rates |
| Real-Time Timing | HET Lite with 12 high-resolution I/O pins, 64-instruction RAM, XOR-share feature for sub-channel pulse synthesis |
| Security & Supervision | Memory Security Module (MSM), JTAG security module, Digital Watchdog (DWD), Analog Watchdog (AWD), ICE Breaker |
| Operating Range | –55°C to +150°C (industrial extended range), qualified per controlled baseline with extended product lifecycle |
Pinout & Package
SM470R1B1MPGES is packaged in a 144-pin LQFP (PGE) with exposed thermal pad, optimized for high-reliability PCB mounting in extreme-temperature applications. Pin functions are defined per TI SPNS155I Rev I, including dedicated GIO, peripheral multiplexing, and power/ground segregation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GIOA[0]/INT[0] | General-purpose I/O / Interrupt 0 input | Configurable digital I/O with interrupt capability; primary wake-up source from STANDBY/HALT |
| CAN1HTX / CAN1HRX | HECC1 differential transmit/receive | Dual-pin CAN physical layer interface compliant with ISO 11898; supports arbitration, error handling, and 32-mailbox buffering |
| ADIN[0]–ADIN[11] | Analog input channels 0–11 | 12 single-ended inputs for MibADC; routed through internal sample-and-hold with selectable reference (ADREFHI/LO) |
| HET[0]–HET[8], HET[18], HET[20], HET[22] | HET Lite high-resolution output pins | 12 dedicated timer-controlled outputs; support compare/capture/GPIO; XOR-share enables sub-channel pulse generation |
| VCCIO / VSSIO | I/O power supply and ground | 3.3-V tolerant I/O domain with separate analog (VCCAD/VSSAD) and core (VCC/VSS) rails for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Two HECC controllers | Enables dual-CAN redundancy for fault-tolerant vehicle or industrial network architectures without external transceivers |
| HET Lite with XOR-share | Allows precise sub-microsecond pulse generation using adjacent channel logic sharing - critical for motor phase control and sensor excitation |
| Memory Security Module (MSM) | Prevents unauthorized read/write access to flash/SRAM contents, protecting firmware IP and preventing reverse engineering |
| ZPLL clock architecture | Zero-pin PLL eliminates external loop filter components, reducing BOM count and improving layout reliability in high-temp designs |
| 10-bit MibADC with 64-word FIFO | Supports burst-mode sampling of multi-sensor arrays with hardware-triggered sequences and continuous-conversion capability |
Applications
| Automotive Powertrain Control | Industrial Motor Drive Systems |
|---|---|
|
Use Scenario: Real-time closed-loop control of diesel engine injection timing, exhaust gas recirculation, and turbocharger actuation in under-hood environments. IC Role / Device Role / Timing Role: Primary controller executing safety-critical algorithms with dual HECC for CAN FD-compatible communication to ECU clusters and sensor networks. Use Value: 60-MHz deterministic execution, 1.55-µs ADC conversion, and HET Lite's sub-µs PWM resolution enable precise fuel metering and torque response within ASIL-B constraints. |
Use Scenario: Field-oriented control (FOC) of 3-phase AC induction motors in factory automation drives operating continuously at 125°C ambient. IC Role / Device Role / Timing Role: Central motion controller managing encoder feedback, current sensing, and gate-driver timing via HET Lite outputs synchronized to ADC triggers. Use Value: 12-channel MibADC with 64-word FIFO captures simultaneous phase currents and temperature data; HET XOR-share generates precise dead-time-compensated gate pulses. |
| Aerospace Actuation Units | Energy Grid Protection Relays |
|
Use Scenario: Flight surface actuator control in satellite attitude adjustment systems exposed to thermal cycling from –55°C to +150°C. IC Role / Device Role / Timing Role: Radiation-tolerant MCU executing position servo loops with watchdog-protected execution and secure boot from encrypted flash. Use Value: MSM and JTAG security prevent firmware tampering; DWD/AWD timers ensure fail-safe shutdown upon timing or analog signal deviation beyond thresholds. |
Use Scenario: Fault detection and breaker tripping coordination in high-voltage substations where electromagnetic interference disrupts standard microcontrollers. IC Role / Device Role / Timing Role: Real-time protection processor acquiring voltage/current waveforms via MibADC and issuing trip commands over dual HECC buses to redundant breaker controllers. Use Value: Dual HECC with 32-mailbox capacity handles time-synchronized phasor data exchange (IEC 61850-9-2); ZPLL stability ensures accurate 50/60 Hz sampling under grid frequency drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-temperature microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS570LS1227ZWTQ | ARM Cortex-R4F core, 180 MHz, 3 MB flash, 256 KB RAM, dual-lockstep CPU, higher integration (EMAC, USB), but no HET Lite or HECC | Targets ASIL-D automotive safety systems requiring lockstep redundancy; lacks CAN 2.0B HECC and HET-level timing precision | Select when functional safety certification (ISO 26262) and Ethernet connectivity outweigh need for sub-µs timer resolution and legacy CAN 2.0B compatibility |
| SPC56EL70L5COBR | Power Architecture e200z7, 120 MHz, 2 MB flash, 256 KB RAM, 2x CAN FD, 1x FlexRay, no HET or MibADC with FIFO | Optimized for automotive body control with CAN FD and FlexRay; lacks extreme-temperature qualification and analog acquisition depth | Select for CAN FD-based chassis networks where extended temperature operation and high-resolution analog capture are secondary to protocol modernization |
Compared with TMS570LS1227ZWTQ and SPC56EL70L5COBR, the SM470R1B1MPGES uniquely combines extreme-temperature operation (–55°C to +150°C), dual HECC with 32-mailbox buffers, HET Lite for sub-µs deterministic I/O, and 12-channel MibADC - making it irreplaceable in legacy CAN-based aerospace actuation and high-temp industrial motor control where timing fidelity and analog bandwidth are non-negotiable.
Availability
SM470R1B1MPGES is available at Aetrix Electronics and suitable for automotive powertrain control, industrial motor drive systems, aerospace actuation units, and energy grid protection relays requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SM470R1B1MPGES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs for industrial, automotive, and aerospace markets.
The SM470R1x family was engineered for extreme-environment embedded control - emphasizing radiation tolerance, extended temperature operation, CAN-based distributed real-time systems, and secure firmware execution in safety-critical infrastructure.
FAQ
What is the maximum operating temperature range for the SM470R1B1MPGES?
The SM470R1B1MPGES is rated for operation from –55°C to +150°C, qualified per controlled baseline with extended product lifecycle support. This specification is validated per TI SPNS155I Rev I and applies specifically to the PGE (LQFP-144) package variant, enabling deployment in under-hood automotive, downhole oil/gas, and aerospace actuation environments where conventional MCUs fail.
Does the SM470R1B1MPGES support CAN FD or only classical CAN?
The SM470R1B1MPGES implements two High-End CAN Controllers (HECC) compliant exclusively with CAN 2.0B protocol (up to 1 Mbps), not CAN FD. Its HECC modules provide full 32-mailbox buffering, message filtering, and error confinement - optimized for deterministic real-time control in harsh environments, but lacking the higher data-rate and flexible data-length features of CAN FD.
How many analog input channels does the MibADC in the SM470R1B1MPGES support?
The SM470R1B1MPGES integrates a 12-channel, 10-bit Multi-Buffered ADC (MibADC) with dedicated ADIN[0] through ADIN[11] pins. It supports grouped sequential conversions, hardware-triggered acquisition, and a 64-word FIFO - enabling simultaneous sampling of multi-sensor arrays without CPU intervention during critical control cycles.
What is the purpose of the HET Lite peripheral in the SM470R1B1MPGES?
The HET Lite peripheral in the SM470R1B1MPGES is an advanced deterministic timer subsystem with 12 high-resolution I/O pins and 64-word RAM. It executes timing-critical tasks - such as PWM generation, encoder capture, and sensor excitation - using a reduced instruction set micromachine, independent of CPU load. Its XOR-share feature allows adjacent channels to synthesize sub-microsecond pulses essential for motor phase control.
Is the SM470R1B1MPGES pin-compatible with other devices in the SM470R1x family?
The SM470R1B1MPGES shares the same 144-pin LQFP (PGE) footprint and core peripheral mapping with SM470R1B1M-HT variants, but differs in temperature screening and packaging qualification. Pin compatibility is confirmed per TI SPNS155I Rev I Section 5.3; however, users must verify voltage rail assignments, I/O drive strength, and peripheral enable configurations against their specific variant's datasheet revision.
SM470R1B1MPGES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- TMS470
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM7®
- Core Size:
- 16/32-Bit
- Speed:
- 60MHz
- Connectivity:
- CANbus, I2C, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 46
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 2.05V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- External
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SM470R1B1MPGES FAQ
1.How can I place an order for SM470R1B1MPGES through Aetrix?
Please submit a Request for Quotation (RFQ) for SM470R1B1MPGES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SM470R1B1MPGES reliable?
The price and inventory of SM470R1B1MPGES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SM470R1B1MPGES is usually 5 days.
3.What payment methods are accepted for SM470R1B1MPGES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SM470R1B1MPGES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SM470R1B1MPGES?
SM470R1B1MPGES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SM470R1B1MPGES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SM470R1B1MPGES?
For technical support, including SM470R1B1MPGES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SM470R1B1MPGES requirements.
6.How does Aetrix verify that SM470R1B1MPGES is sourced from the original manufacturer or authorized distributors?
All SM470R1B1MPGES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SM470R1B1MPGES meets industry standards.
7.What is the process for return or replacement of SM470R1B1MPGES?
All SM470R1B1MPGES units undergo pre-shipment inspection (PSI). If there is an issue with SM470R1B1MPGES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SM470R1B1MPGES part is unused and in its original packaging.
Return procedure for SM470R1B1MPGES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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