Texas Instruments SM72480SDE-120/NOPB

Overview

SM72480SDE-120/NOPB from Texas Instruments is a factory-preset, dual-output temperature monitoring IC featuring a latching 120°C overtemperature switch (push-pull and open-drain) and a linear analog temperature sensor (VTEMP) with −10.3 mV/°C gain. It operates from 1.6V to 5.5V, draws only 8 μA typical supply current, and delivers ±2.2°C trip accuracy across −50°C to +150°C - used in PV power optimizers for thermal runaway protection and die temperature feedback.

For engineers reviewing the SM72480SDE-120/NOPB datasheet, SM72480SDE-120/NOPB pinout, SM72480SDE-120/NOPB application, or SM72480SDE-120/NOPB equivalent, key selection considerations include its WSON-6 package thermal pad (DAP), dual digital output logic configurations, factory-trimmed 120°C trip point with 4.5–5.5°C hysteresis, and VTEMP's short-circuit protected ±100 μA drive capability for direct ADC interfacing.

Technical Context

The SM72480SDE-120/NOPB integrates two independent temperature-triggered outputs: an active-high push-pull OVERTEMP and an active-low open-drain OVERTEMP, both asserting simultaneously at 120°C and resetting at (120°C − THYST). Its analog VTEMP output provides a monotonic, NTC voltage with second-order linearity (±2.3°C accuracy over full range) and built-in supply-noise rejection.

Internal circuitry includes a precision bandgap reference, rail-to-rail output buffer for VTEMP, and robust ESD protection (4500V HBM). The TRIP TEST pin enables in-situ functional verification by forcing digital outputs high and routing VTRIP to VTEMP - critical for production test and field diagnostics without thermal cycling.

Key Specifications

Pinout & Package

The SM72480SDE-120/NOPB uses a 2.2 mm × 2.5 mm WSON-6 package (NGF0006A/SDB06A) with exposed die attach pad (DAP) for enhanced thermal conduction to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature switch and sensor applications.

Compared with LM50 and MAX6505, the SM72480SDE-120/NOPB uniquely combines factory-trimmed 120°C latching behavior, dual digital output topologies, and high-accuracy analog VTEMP in a compact WSON-6 package - delivering integrated thermal supervision without calibration, external components, or software intervention.

Availability

SM72480SDE-120/NOPB is available at Aetrix Electronics and suitable for PV power optimizers, wireless transceivers, battery management systems, and automotive ECUs requiring stable component supply with guaranteed long-term manufacturability.

Supply support for SM72480SDE-120/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with decades of automotive and industrial qualification expertise.

The SM72480SDE-120/NOPB belongs to TI's SolarMagic™ family - engineered specifically for photovoltaic system reliability, featuring renewable-energy-grade accuracy, extended temperature range (−50°C to +150°C), and robust noise immunity for harsh outdoor environments.

FAQ

What is the exact factory-set temperature trip point for SM72480SDE-120/NOPB?

The SM72480SDE-120/NOPB has a factory-preset temperature trip point of 120°C, with a tolerance of ±125°C as specified in the device marking and datasheet. This value is laser-trimmed during production and does not require external configuration. The hysteresis is guaranteed between 4.5°C and 5.5°C, meaning the device resets when die temperature falls to 115.5°C minimum. This fixed trip point is integral to the SM72480SDE-120/NOPB's role in safety-critical thermal shutdown applications such as PV optimizer overtemperature protection.

Does SM72480SDE-120/NOPB support both push-pull and open-drain digital outputs simultaneously?

Yes, the SM72480SDE-120/NOPB provides two independent digital outputs: pin 5 (OVERTEMP) is an active-high push-pull driver, and pin 3 (OVERTEMP) is an active-low open-drain output. Both assert simultaneously when die temperature reaches 120°C or when the TRIP TEST pin is driven high. They de-assert together when temperature falls below (120°C − THYST). The SM72480SDE-120/NOPB's dual-output architecture allows direct compatibility with different logic families - for example, connecting OVERTEMP to a microcontroller GPIO and OVERTEMP to a hardware reset controller with external pull-up.

How is the VTEMP analog output of SM72480SDE-120/NOPB calibrated, and what is its accuracy?

The VTEMP output of SM72480SDE-120/NOPB is factory-calibrated for a −10.3 mV/°C gain with second-order linearity, achieving ±2.3°C accuracy over −50°C to +150°C. No user calibration is required. The datasheet provides a full conversion table and first-/second-order equations (e.g., VTEMP = 2119 − 10.36 × TDIE) for precise temperature reconstruction. This accuracy includes line regulation effects but excludes load regulation - so keep VTEMP load current ≤±100 μA. The SM72480SDE-120/NOPB's VTEMP is short-circuit protected and can drive ADC input capacitors directly.

Can SM72480SDE-120/NOPB operate reliably at 1.6V supply voltage?

Yes, the SM72480SDE-120/NOPB is fully specified to operate down to 1.6V, with all key parameters - including trip accuracy (±2.2°C), VTEMP accuracy (±2.3°C), and digital output performance - guaranteed across the full 1.6V to 5.5V range. At 1.6V, the push-pull OVERTEMP output maintains VOH ≥ VDD − 0.45V and VOL ≤ 0.45V under load, and quiescent current remains at 8 μA typical. This makes the SM72480SDE-120/NOPB ideal for ultra-low-voltage 1.8V systems where supply headroom is constrained, such as energy-harvesting wireless sensors.

What is the purpose and recommended handling of the DAP (Die Attach Pad) on SM72480SDE-120/NOPB?

The DAP on the SM72480SDE-120/NOPB is an exposed thermal pad that must be soldered to a PCB copper area for optimal thermal conduction and noise immunity. While it may float electrically, TI strongly recommends connecting the DAP directly to pin 4 (GND) - not just to a ground plane - to minimize noise coupling into the VTEMP and digital outputs. This connection reduces self-heating error (θJA = 152°C/W) and improves measurement stability in noisy environments like motor drives or switching power supplies. The SM72480SDE-120/NOPB's DAP is not a functional signal pin but a critical mechanical and thermal interface.