NXP Semiconductors SM912F634DV2AE

Overview

SM912F634DV2AE from NXP Semiconductors is an integrated S12-based relay driver with LIN physical layer interface, combining an HCS12 microcontroller (32 kB Flash, 2 kB RAM) and SMARTMOS analog control IC in a single 48-pin LQFP-EP package. It delivers two protected high-side outputs, two protected low-side drivers, LIN 2.1 transceiver, 10-bit 15-channel ADC, and wake-up-capable high-voltage inputs for automotive body control modules.

For engineers reviewing the SM912F634DV2AE datasheet, SM912F634DV2AE pinout, SM912F634DV2AE application, or SM912F634DV2AE equivalent, this device supports LIN-connected load driving with integrated current sensing, battery voltage monitoring, Hall sensor supply, and cyclic-sense low-power operation - critical for automotive door modules, seat control units, and lighting drivers requiring functional safety-aware power switching.

Technical Context

The SM912F634DV2AE implements a die-to-die (D2D) architecture linking an HCS12 MCU die and an analog die via transparent memory-mapped bus. The analog die integrates LIN 2.1 PHY with SCI, reverse-battery-protected voltage sense (VSENSE), selectable-gain current sense (ISENSEH/ISENSEL), six wake-up-capable HV inputs (L0–L5), and dual high-side/low-side protected drivers with active clamp and short-circuit protection.

It operates across –40 °C to +105 °C with dual regulated supplies (VDD = 2.5 V, VDDX = 5.0 V), supports cyclic sense wake-up in low-power modes, and includes on-chip oscillator, two independent watchdogs (COP and window), and chip temperature sensor - all designed for ASIL-B–capable automotive subsystems without external supervision.

Key Specifications

Pinout & Package

SM912F634DV2AE uses a 48-pin LQFP-EP (7.0 mm × 7.0 mm, exposed pad) package per ordering code AE. The exposed pad must be connected to ground for thermal and EMI performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated relay driver with LIN applications.

Compared with SM912F634DV1AE, SM912F634DV2AE removes current sense functionality but retains identical wake-up, LIN, and driver capabilities - making it optimal for non-diagnostic lighting and switch applications. Versus MC9S12G240MALR, it delivers 40% lower system-level component count and faster time-to-prototype due to full integration.

Availability

SM912F634DV2AE is available at Aetrix Electronics and suitable for automotive door modules, seat control units, roof console lighting, and trunk actuation systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified reliability.

Supply support for SM912F634DV2AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in microcontrollers, secure connectivity, and analog power solutions.

The SM912F634 series belongs to NXP's S12-based automotive system basis chips (SBCs), designed specifically for body electronics control units needing integrated power switching, LIN communication, and functional safety features.

FAQ

What is the operating temperature range for SM912F634DV2AE?

The SM912F634DV2AE is rated for operation from –40 °C to +105 °C, meeting AEC-Q100 Grade 2 requirements for under-hood and cabin-mounted automotive electronics. This range is confirmed in Table 1 of the official NXP datasheet S/MM912F634 Rev. 9.2 and applies directly to the SM912F634DV2AE variant.

Does SM912F634DV2AE include a current sense function?

No, SM912F634DV2AE does not include the current sense module. Per Table 2 ("Analog Options") in the S/MM912F634 datasheet, Option 2 (DV2) explicitly omits the current sense feature present in Option 1 (DV1). Pins ISENSEL and ISENSEH are not functional in SM912F634DV2AE and should be left unconnected.

What package type does SM912F634DV2AE use?

SM912F634DV2AE uses a 48-pin LQFP-EP (leadless quad flat package with exposed pad), specified as package code 98ASA00173D. The "AE" suffix denotes the exposed pad variant, which must be soldered to a thermal pad on the PCB for optimal thermal performance and EMI suppression.

How many high-voltage wake-up inputs does SM912F634DV2AE support?

SM912F634DV2AE supports six high-voltage wake-up inputs (L0 through L5), as defined in Section 4.16 and Table 2 of the S/MM912F634 datasheet. All six are functional in Analog Option 2 (DV2), enabling flexible switch monitoring and cyclic sense operation across multiple vehicle subsystems.

Is SM912F634DV2AE pin-compatible with SM912F634DV1AE?

Yes, SM912F634DV2AE is pin-compatible with SM912F634DV1AE - both use identical 48-pin LQFP-EP packaging, shared pin assignments, and identical footprint. The only functional difference is the absence of current sense in DV2; all other I/O, power, and communication pins retain identical electrical behavior and timing.