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NXP Semiconductors SM912F634DV2AER2

Part No.:
SM912F634DV2AER2
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP Exposed Pad
Datasheet:
AetrixSM912F634DV2AER2.pdf
Description:
IC MCU 16BIT 32KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,306

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Product details

Overview

SM912F634DV2AER2 from NXP Semiconductors is an integrated S12-based relay driver with LIN physical layer interface, combining an HCS12 microcontroller (32 kB Flash, 2 kB RAM) and SMARTMOS analog control IC in a single 48-pin LQFP-EP package. It delivers two protected high-side outputs, two protected low-side drivers, LIN 2.1 transceiver, 10-bit 15-channel ADC, and wake-up-capable high-voltage inputs for automotive body electronics control.

For engineers reviewing the SM912F634DV2AER2 datasheet, SM912F634DV2AER2 pinout, SM912F634DV2AER2 application, or SM912F634DV2AER2 equivalent, key selection considerations include its dual high-/low-side drive capability, integrated LIN PHY, cyclic sense low-power operation, and analog die Option 2 configuration (no current sense module, L0–L3 wake-up inputs only).

Technical Context

The SM912F634DV2AER2 implements a die-to-die (D2D) architecture linking an HCS12 MCU die and an analog die via transparent memory-mapped bus. Its analog functionality includes voltage-regulated HSUP (18 V Hall supply), reverse-battery-protected VSENSE input, and six high-voltage wake-up inputs (L0–L3 active; L4/L5 disabled per Option 2).

MCU features include 16-bit S12 CPU core, background debug (BDM), two independent watchdogs (COP and window), on-chip oscillator, and peripheral modules: TIM16B4C timer, PWM8B2C, SPI, SCI, and 10-bit ADC with selectable input dividers for 0–5 V / 0–18 V ranges. Bus frequency is 16 MHz per ordering code DV2.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS12 16-bit CPU with D2D interface to analog die
Flash / RAM32 kB Flash program memory; 2.0 kB on-chip RAM for real-time control execution
Bus Frequency16 MHz maximum - determines real-time response timing for PWM, ADC sampling, and LIN frame handling
LIN InterfaceLIN 2.1 physical layer compliant; integrated SCI enables protocol stack implementation without external transceiver
Analog Die OptionOption 2: supports L0–L3 wake-up inputs only; excludes current sense module (ISENSEL/ISENSEH not functional)
High-Voltage InputsSix pins (L0–L5) rated for automotive battery voltage; L0–L3 enabled for wake-up and analog measurement in Option 2
Output DriversTwo protected high-side (HS1/HS2) and two protected low-side (LS1/LS2) outputs for driving relays, LEDs, or small solenoids

Pinout & Package

SM912F634DV2AER2 is housed in a 48-pin LQFP-EP (exposed pad) package (98ASA00173D), 7.0 mm × 7.0 mm, with thermal pad recommended to be connected to ground for enhanced thermal performance in automotive under-hood environments.

Pin/TerminalCircuit RoleDesign Meaning
HS1 / HS2High-side power switch outputsDrive resistive or inductive loads directly from VS2 rail; support PWM dimming and cyclic sense activation in low-power mode
LS1 / LS2Low-side power switch outputsShort-circuit protected; include active clamp for inductive load flyback; controllable via PWM or GPIO
L0–L3Wake-up & analog inputsDual-role pins: digital wake-up source (with transient protection) and ADC channels with selectable 0–5 V / 0–18 V dividers
LINLIN bus I/OSingle-wire physical layer interface compliant with LIN 2.1; connects directly to LIN bus with no external components required
VSENSEBattery voltage monitor inputReverse-battery protected; routes scaled battery voltage to ADC for system-level voltage supervision and diagnostics
HSUPHall sensor supply outputRegulated 18 V output referenced to VS1; powers Hall-effect sensors with external CHSUP capacitor
RESET / RESET_AReset coordination signalsRESET (MCU) and RESET_A (analog) are bidirectional and internally tied; enable synchronized reset across both dies
PA0–PA5, PTB0–PTB2Shared-function GPIOsSupport SPI (MISO/MOSI/SCK/SS), UART (SCI), PWM, timer capture, and ADC inputs - multiplexed per application needs

Key Features

FeatureDesign Value
Integrated LIN PHY + MCUEliminates need for external LIN transceiver; reduces BOM count and PCB area in body control modules
Cyclic Sense Low-Power ModeEnables periodic wake-up of HS/LS outputs and ADC sampling without full MCU activation - extends battery life in always-on systems
Reverse-Battery Protected InputsVSENSE, VS1, VS2 include internal diode protection - meets ISO 16750-2 requirements for automotive electrical abuse
Protected High-/Low-Side OutputsHS1/HS2 and LS1/LS2 integrate short-circuit, overtemperature, and open-load diagnostics - simplifies fault management in relay applications
Hall Sensor Supply (HSUP)On-chip 18 V regulator eliminates external DC-DC converter for Hall-effect position sensing in motorized actuators

Applications

Body Control Module (BCM)Smart Junction Box

Use Scenario: Centralized control of door locks, interior lighting, and window lifts in modern vehicles.

IC Role / Device Role / Timing Role: SM912F634DV2AER2 acts as the primary relay driver and LIN node controller, managing up to four switched loads while communicating status via LIN to the main BCM.

Use Value: Reduces component count by integrating MCU, LIN PHY, and protected drivers - lowers system cost and improves reliability versus discrete solutions.

Use Scenario: Distributed power distribution unit with programmable load switching and diagnostics in electric vehicle architectures.

IC Role / Device Role / Timing Role: SM912F634DV2AER2 serves as a local LIN slave node controlling localized 12 V circuits, performing cyclic voltage monitoring and wake-up event detection.

Use Value: Enables deterministic low-power operation with wake-up on L0–L3 inputs - supports ASAM-compliant sleep/wake protocols without external supervisors.

Seat Position ActuatorRoof Module Controller

Use Scenario: Motorized seat adjustment with Hall-effect position feedback and overload protection.

IC Role / Device Role / Timing Role: SM912F634DV2AER2 drives H-bridge direction control via HS/LS outputs and supplies regulated 18 V to Hall sensors using HSUP, while measuring motor current indirectly via VSENSE scaling.

Use Value: Integrates Hall supply, voltage sensing, and protected switching - eliminates three external ICs and associated passives in compact seat ECU designs.

Use Scenario: Sunroof, panoramic roof, or power shade control with LIN command interface and safety interlocks.

IC Role / Device Role / Timing Role: SM912F634DV2AER2 functions as a LIN-connected actuator driver, using LS1/LS2 for motor control and L0–L3 for limit switch and obstruction detection inputs.

Use Value: Leverages wake-up inputs for mechanical end-stop sensing and LIN for OEM-standard diagnostics - satisfies UNECE R100 functional safety prerequisites at subsystem level.

Equivalent & Alternatives

The following parts are listed as comparable options for similar relay driver with LIN applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12G240F0MLHStandalone HCS12 MCU (no integrated analog die); requires external high-side/low-side drivers and LIN transceiverGreater design flexibility but higher BOM count and layout complexity; lacks integrated VSENSE, HSUP, and wake-up protectionChoose when custom driver topology or higher ADC resolution (12-bit) is required; not drop-in compatible
TLF35584QVVS1Dedicated system basis chip (SBC) with LIN PHY and watchdog; no MCU core or driver outputsProvides power management and communication only; must pair with separate MCU and external drivers for relay controlChoose for centralized power domain control where SM912F634DV2AER2's integrated MCU+drivers are unnecessary

Compared with MC9S12G240F0MLH and TLF35584QVVS1, SM912F634DV2AER2 uniquely combines MCU, LIN PHY, and protected high-/low-side drivers in one package - reducing board space, validation effort, and supply chain complexity for cost-sensitive automotive body electronics.

Availability

SM912F634DV2AER2 is available at Aetrix Electronics and suitable for automotive body control modules, smart junction boxes, seat position actuators, and roof module controllers requiring stable component supply across extended temperature ranges (−40 °C to +105 °C).

Supply support for SM912F634DV2AER2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communications infrastructure markets, delivering secure, energy-efficient, and scalable silicon solutions.

The SM912F634 series belongs to NXP's integrated automotive relay driver product line, designed specifically for LIN-connected body electronics applications requiring robust power switching, diagnostic capability, and automotive-grade reliability.

FAQ

What is the operating temperature range for SM912F634DV2AER2?

SM912F634DV2AER2 is qualified for −40 °C to +105 °C ambient operation, meeting AEC-Q100 Grade 2 requirements for automotive under-hood and cabin applications. This rating applies to the full device including MCU core, analog die, and driver outputs - verified across all specified electrical parameters in the datasheet.

Does SM912F634DV2AER2 include a current sense module?

No, SM912F634DV2AER2 uses Analog Die Option 2, which explicitly excludes the current sense module (ISENSEL and ISENSEH pins are not functional). This distinguishes it from Option 1 variants like SM912F634DV1AE. Designers requiring shunt-based current monitoring must implement external sensing circuitry.

How many wake-up inputs does SM912F634DV2AER2 support?

SM912F634DV2AER2 supports four wake-up inputs: L0, L1, L2, and L3. L4 and L5 are not enabled in Analog Die Option 2. Each wake-up input provides both digital edge-triggered interrupt capability and analog measurement via the ADC with selectable voltage dividers for 0–5 V or 0–18 V ranges.

What package type is used for SM912F634DV2AER2?

SM912F634DV2AER2 uses a 48-pin LQFP-EP (exposed pad) package (98ASA00173D), 7.0 mm × 7.0 mm footprint. The exposed thermal pad must be connected to PCB ground for optimal thermal dissipation in high-duty-cycle relay driving applications.

Is SM912F634DV2AER2 pin-compatible with SM912F634DV1AE?

Yes, SM912F634DV2AER2 and SM912F634DV1AE share identical 48-pin LQFP-EP packaging and pinout. However, functional differences exist: DV2AE omits the current sense module and limits wake-up inputs to L0–L3, whereas DV1AE enables L0–L5 and includes ISENSEL/ISENSEH. PCB layout is interchangeable, but firmware and external circuitry must align with Option 2 constraints.

SM912F634DV2AER2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP Exposed Pad
Series:
S/MM9
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S12
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
3
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SM912F634DV2AER2 FAQ

1.How can I place an order for SM912F634DV2AER2 through Aetrix?

Please submit a Request for Quotation (RFQ) for SM912F634DV2AER2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SM912F634DV2AER2 reliable?

The price and inventory of SM912F634DV2AER2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SM912F634DV2AER2 is usually 5 days.

3.What payment methods are accepted for SM912F634DV2AER2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SM912F634DV2AER2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SM912F634DV2AER2?

SM912F634DV2AER2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SM912F634DV2AER2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SM912F634DV2AER2?

For technical support, including SM912F634DV2AER2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SM912F634DV2AER2 requirements.

6.How does Aetrix verify that SM912F634DV2AER2 is sourced from the original manufacturer or authorized distributors?

All SM912F634DV2AER2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SM912F634DV2AER2 meets industry standards.

7.What is the process for return or replacement of SM912F634DV2AER2?

All SM912F634DV2AER2 units undergo pre-shipment inspection (PSI). If there is an issue with SM912F634DV2AER2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SM912F634DV2AER2 part is unused and in its original packaging.

Return procedure for SM912F634DV2AER2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SM912F634DV2AER2 Tags

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