Microchip Technology SMBG5351AE3/TR13
- Part No.:
- SMBG5351AE3/TR13
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG5351AE3/TR13.pdf
- Description:
- DIODE ZENER 14V 5W DO214AA
- Quantity:
- Payment:

- Shipping:

Inventory:9,461
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SMBG5351AE3/TR13 from Microsemi is a surface-mount 5 W Zener diode with nominal Zener voltage of 14 V, ±10% tolerance (A suffix), rated test current of 100 mA, dynamic impedance of 2.5 Ω at IZT, and maximum regulator current of 6.7 A - used for precision voltage regulation in power supply feedback loops and overvoltage protection circuits.
For engineers reviewing the SMBG5351AE3/TR13 datasheet, SMBG5351AE3/TR13 pinout, SMBG5351AE3/TR13 application, or SMBG5351AE3/TR13 equivalent, key selection criteria include Zener voltage accuracy, surge current capability (IZSM = 6.7 A), thermal resistance (RθJA = 90 °C/W), RoHS-compliant matte-tin plating, and DO-215AA gull-wing package compatibility with high-density PCB layouts.
Technical Context
This device operates in reverse-bias breakdown mode to maintain stable voltage across its terminals under varying load and temperature conditions. It exhibits minimal voltage variation versus current (low dynamic impedance) and withstands non-repetitive 8.3 ms half-sine surge currents up to 6.7 A.
The SMBG5351AE3/TR13 is thermally characterized with RθJL = 25 °C/W (junction-to-lead) and RθJA = 90 °C/W (junction-to-ambient on FR4 with recommended footprint), enabling reliable operation from –65 °C to +150 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 14 V ±10% - defines regulated output voltage at 100 mA test current, usable across 12.6–15.4 V range. |
| Power Dissipation (PD) | 5.0 W @ TL < 25 °C - maximum steady-state power handling with adequate lead heat sinking. |
| Dynamic Impedance (ZZT) | 2.5 Ω @ 100 mA - low AC impedance ensures tight voltage regulation under dynamic load changes. |
| Maximum Regulator Current (IZM) | 6.7 A - peak DC current before exceeding 5 W rating at upper VZ tolerance limit (15.4 V). |
| Surge Current (IZSM) | 6.7 A (8.3 ms half-sine) - supports transient overvoltage clamping without failure. |
| Reverse Leakage (IR) | 1.0 µA @ VR = 10.1 V - negligible leakage below knee voltage ensures low standby power loss. |
| Junction Temperature Range | –65 °C to +150 °C - validated for automotive, industrial, and telecom environments with wide thermal cycling. |
Pinout & Package
DO-215AA gull-wing surface-mount package with cathode indicated by band; anode and cathode terminals are accessible via two J-bend leads suitable for automated reflow soldering and visual inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry terminal in forward bias; reference node in reverse-bias regulation | Connected to lower-potential side of circuit; forms return path for Zener current during regulation. |
| Cathode | Current exit terminal in forward bias; regulated voltage output node in reverse bias | Banded end; held at stable 14 V relative to anode when reverse current ≥100 mA; connects to feedback node or clamp point. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC 1N5351B Equivalent | Identical electrical specs and testing to legacy through-hole 1N5351B, enabling drop-in replacement in upgraded SMT designs. |
| RoHS Compliant Matte-Tin Plating | e3 suffix confirms annealed matte-tin finish compliant with RoHS Directive 2011/65/EU, eliminating lead and supporting Pb-free assembly. |
| Moisture Sensitivity Level 1 | No dry pack required per IPC/JEDEC J-STD-020B - simplifies handling, storage, and reflow without baking preconditioning. |
| Gull-Wing Lead Geometry | DO-215AA package enables visible solder joints and reliable automated optical inspection (AOI) of solder fillets post-reflow. |
Applications
| Switch-Mode Power Supply Feedback | Overvoltage Clamp Circuit |
|---|---|
Use Scenario: Regulates output voltage in isolated flyback or forward converter feedback loop using optocoupler-coupled error amplifier. IC Role / Device Role / Timing Role: Zener reference element setting precise 14 V threshold for TL431 or similar shunt regulator input. Use Value: Maintains ±10% output regulation across line/load transients due to low ZZT (2.5 Ω) and stable VZ over temperature. | Use Scenario: Protects downstream IC inputs (e.g., microcontroller GPIO, ADC reference) from ESD or surge events exceeding 14 V. IC Role / Device Role / Timing Role: Fast-acting voltage clamp diverting excess energy to ground when reverse voltage exceeds 14 V. Use Value: Withstands 6.7 A non-repetitive surge (8.3 ms) without degradation, preserving system reliability during lightning-induced transients. |
| Industrial Sensor Signal Conditioning | DC-DC Converter Output Stabilization |
Use Scenario: Provides stable 14 V bias for analog front-end op-amps in 4–20 mA transmitter modules operating in harsh factory environments. IC Role / Device Role / Timing Role: Precision voltage reference source ensuring consistent gain and offset calibration across –40 °C to +85 °C. Use Value: Junction temperature range (–65 °C to +150 °C) and low IR (1.0 µA) minimize drift and leakage-induced errors in long-term deployments. | Use Scenario: Stabilizes 12 V rail in point-of-load buck converter for FPGA or ASIC core logic, compensating for load-step-induced droop. IC Role / Device Role / Timing Role: Secondary-side Zener shunt regulating feedback divider node to tighten output voltage tolerance. Use Value: High IZM (6.7 A) allows robust current sourcing during heavy load steps, reducing need for large bulk capacitance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener regulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N5351B | Axial-leaded T-18 package; identical VZ, IZT, ZZT, and IZM specs; non-RoHS (Sn/Pb plating). | Requires through-hole PCB assembly; unsuitable for high-density SMT layouts; no moisture sensitivity concerns but lacks gull-wing AOI visibility. | Select when legacy through-hole manufacturing or cost-sensitive prototyping is prioritized over RoHS compliance and automated inspection. |
| SMBJ5351B | Same DO-214AA (J-bend) package; identical electrical specs; RoHS-compliant; differs only in lead frame geometry and thermal resistance (RθJA ≈ 100 °C/W vs. 90 °C/W). | Compatible with same footprint class but requires adjusted pad layout; slightly lower thermal efficiency may reduce margin in high-ambient environments. | Select when DO-214AA footprint is already standardized in design; verify thermal derating at full 5 W in target enclosure. |
Compared with SMBG5351AE3/TR13, the 1N5351B offers identical regulation performance but mandates through-hole assembly and lacks RoHS compliance, while the SMBJ5351B matches SMT requirements but trades 10 °C/W higher junction-to-ambient resistance for J-bend form factor - making SMBG5351AE3/TR13 optimal for space-constrained, RoHS-mandated, and thermally demanding applications.
Availability
SMBG5351AE3/TR13 is available at Aetrix Electronics and suitable for switch-mode power supplies, overvoltage protection circuits, and industrial sensor signal conditioning requiring stable component supply and RoHS-compliant manufacturing.
Supply support for SMBG5351AE3/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and RF solutions for aerospace, defense, and industrial markets.
The SMBG53xx series was designed specifically for high-density, surface-mount voltage regulation and transient suppression in power conversion and protection systems where JEDEC compatibility, thermal robustness, and RoHS compliance are mandatory.
FAQ
What is the Zener voltage tolerance for SMBG5351AE3/TR13?
The SMBG5351AE3/TR13 has a Zener voltage tolerance of ±10%, denoted by the "A" suffix in the part number. This means its measured VZ at 100 mA test current falls within 12.6 V to 15.4 V at TL = 25 °C. The tolerance is verified per JEDEC test methods and applies across the full operating temperature range of –65 °C to +150 °C.
Does SMBG5351AE3/TR13 require dry packing before reflow soldering?
No, SMBG5351AE3/TR13 does not require dry packing prior to reflow soldering. Its moisture sensitivity level is rated IPC/JEDEC J-STD-020B Level 1, meaning it can be stored and processed indefinitely at ≤30 °C/60% RH without baking. This eliminates pre-reflow bake cycles and reduces manufacturing overhead in high-volume SMT lines.
What is the maximum surge current rating for SMBG5351AE3/TR13?
The SMBG5351AE3/TR13 is rated for a non-repetitive peak surge current (IZSM) of 6.7 A, defined as the maximum amplitude of an 8.3 ms half-sine waveform. This rating is validated per Microsemi's internal surge test protocol and supports transient clamping in power supply input stages and interface protection circuits without parametric shift or failure.
How does the DO-215AA package of SMBG5351AE3/TR13 differ from DO-214AA?
The DO-215AA package of SMBG5351AE3/TR13 features gull-wing leads for visible solder joints and improved thermal conduction via shorter lead paths, whereas DO-214AA uses J-bend leads. DO-215AA has RθJA = 90 °C/W (vs. ~100 °C/W for DO-214AA) on FR4, offering better thermal performance in compact layouts - critical for sustained 5 W operation in confined enclosures.
Is SMBG5351AE3/TR13 compatible with lead-free reflow profiles?
Yes, SMBG5351AE3/TR13 is fully compatible with standard lead-free reflow profiles. Its matte-tin (e3) plating supports peak temperatures up to 260 °C for 10 seconds, meeting IPC/JEDEC J-STD-020D requirements. The device passes thermal shock and intermetallic growth validation for SnAgCu solder alloys, ensuring long-term joint integrity in RoHS-compliant production.
SMBG5351AE3/TR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- DO-215AA, SMB Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 14 V
- Tolerance:
- ±10%
- Power - Max:
- 5 W
- Impedance (Max) (Zzt):
- 2.5 Ohms
- Current - Reverse Leakage @ Vr:
- 1 µA @ 10.1 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 1 A
- Operating Temperature:
- -65°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG5351AE3/TR13 FAQ
1.How can I place an order for SMBG5351AE3/TR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG5351AE3/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG5351AE3/TR13 reliable?
The price and inventory of SMBG5351AE3/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5351AE3/TR13 is usually 5 days.
3.What payment methods are accepted for SMBG5351AE3/TR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5351AE3/TR13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG5351AE3/TR13?
SMBG5351AE3/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG5351AE3/TR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG5351AE3/TR13?
For technical support, including SMBG5351AE3/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5351AE3/TR13 requirements.
6.How does Aetrix verify that SMBG5351AE3/TR13 is sourced from the original manufacturer or authorized distributors?
All SMBG5351AE3/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5351AE3/TR13 meets industry standards.
7.What is the process for return or replacement of SMBG5351AE3/TR13?
All SMBG5351AE3/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5351AE3/TR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG5351AE3/TR13 part is unused and in its original packaging.
Return procedure for SMBG5351AE3/TR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG5351AE3/TR13 Tags

-
MMBZ5240B-7-F
Diodes Incorporated

-
BZT52C5V6T-7
Diodes Incorporated

-
MMSZ5231B-7-F
Diodes Incorporated

-
BZT52C15-7-F
Diodes Incorporated

-
BZX84C3V3LT1G
onsemi

-
MMSZ5245BS-7-F
Diodes Incorporated

-
MMSZ4682T1G
onsemi

-
BZT52C15S-7-F
Diodes Incorporated

-
MM5Z5V1ST1G
onsemi

-
SMAJ4744A-TP
Micro Commercial Co

-
BZT52C3V6LP-7
Diodes Incorporated

-
SMAZ12-13-F
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

