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Microchip Technology SMBG5352AE3/TR13

Part No.:
SMBG5352AE3/TR13
Manufacturer:
Microchip Technology
Category:
Single Zener Diodes
Package:
DO-215AA, SMB Gull Wing
Datasheet:
AetrixSMBG5352AE3/TR13.pdf
Description:
DIODE ZENER 15V 5W DO214AA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,784

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Product details

Overview

SMBG5352AE3/TR13 from Microsemi is a surface-mount 5 W Zener diode with nominal breakdown voltage of 15 V, ±10% tolerance (A-suffix), and DO-215AA gull-wing package. It delivers stable voltage regulation across wide current (75 mA IZT) and temperature (–65 °C to +150 °C) ranges, and is used in power supply overvoltage clamping and reference circuits.

For engineers reviewing the SMBG5352AE3/TR13 datasheet, SMBG5352AE3/TR13 pinout, SMBG5352AE3/TR13 application, or SMBG5352AE3/TR13 equivalent, key selection criteria include Zener voltage tolerance, thermal resistance (RθJL = 25 °C/W), surge current rating (6.3 A IZSM), and RoHS-compliant matte-tin plating.

Technical Context

This device operates as a precision voltage reference in reverse-biased breakdown mode, with dynamic impedance of 2.5 Ω at 75 mA test current and knee impedance of 315 Ω at 1 mA. Its low RθJL enables efficient heat transfer to the PCB lead frame under sustained 5 W dissipation at TL < 25 °C.

The DO-215AA gull-wing package ensures visible solder joints and IPC/JEDEC J-STD-020B Level 1 moisture sensitivity-no dry pack required. Cathode polarity is marked by a band; operation requires cathode-positive bias relative to anode.

Key Specifications

Parameter Value and Actual Design Meaning
Zener Voltage (VZ) 15 V ±10% at 75 mA - defines regulated output level with worst-case range 13.5–16.5 V
Power Dissipation (PD) 5.0 W @ TL < 25 °C - maximum steady-state power handling with adequate lead heatsinking
Dynamic Impedance (ZZT) 2.5 Ω @ 75 mA - low AC impedance ensures minimal voltage variation under load transients
Max Surge Current (IZSM) 6.3 A (8.3 ms half-sine) - supports transient overvoltage suppression without failure
Thermal Resistance (RθJL) 25 °C/W - enables direct thermal path from junction to PCB lead, critical for reliability at full power
Reverse Leakage (IR) 1.0 µA @ 10.8 V - confirms tight regulation near knee voltage with negligible standby loss
Junction Temp Range –65 °C to +150 °C - validated operation across industrial and automotive ambient extremes

Pinout & Package

DO-215AA gull-wing surface-mount package with cathode indicated by molded band; terminals are anode (unbanded end) and cathode (banded end).

Pin/Terminal Circuit Role Design Meaning
Anode Current entry terminal in forward bias; referenced ground node in Zener clamp configuration Connected to lower-potential side of protected circuit; establishes reference point for clamping threshold
Cathode Current exit terminal in forward bias; high-side connection in Zener regulator mode Banded terminal tied to input rail or voltage source; sets regulated output at cathode potential

Key Features

Feature Design Value
JEDEC 1N5352B equivalent Identical electrical specs and test methods - enables drop-in replacement in legacy designs
RoHS-compliant matte-tin plating e3 suffix confirms annealed tin finish meeting MIL-STD-750 Method 2026 solderability
Level 1 moisture sensitivity No dry pack or bake required before reflow - reduces manufacturing overhead and floor-life constraints
Gull-wing lead form Visible solder fillets per IPC-A-610 - enables automated optical inspection (AOI) of joint integrity
High IZM at 75 mA Supports robust regulation under sustained load without thermal runaway when mounted per recommended footprint

Applications

DC Power Supply Clamp Industrial Sensor Reference

Use Scenario: Protecting 15 V DC rails against transient spikes in PLC I/O modules.

IC Role / Device Role / Timing Role: Zener diode operating in reverse breakdown to clamp voltage above 16.5 V.

Use Value: Limits overvoltage to safe levels using 6.3 A non-repetitive surge capability and 2.5 Ω dynamic impedance.

Use Scenario: Providing stable 15 V reference for analog front-end amplifiers in factory-floor temperature sensors.

IC Role / Device Role / Timing Role: Precision voltage reference with ±10% tolerance and <1 µA leakage at 10.8 V.

Use Value: Maintains ADC accuracy across –40 °C to +85 °C ambient via low tempco Zener structure and Level 1 moisture rating.

Automotive ECU Protection Telecom Line Card Regulator

Use Scenario: Suppressing load-dump transients on 12 V battery-fed control units per ISO 7637-2 Pulse 5a.

IC Role / Device Role / Timing Role: Primary overvoltage clamp with cathode tied to battery rail and anode grounded.

Use Value: Withstands 6.3 A surge without degradation, leveraging 5 W power rating and 25 °C/W junction-to-lead thermal path.

Use Scenario: Generating local 15 V bias for op-amps in DSL line interface cards exposed to lightning-induced surges.

IC Role / Device Role / Timing Role: Low-impedance shunt regulator stabilizing supply during fast transients.

Use Value: 2.5 Ω ZZT minimizes output deviation during 100 ns–1 µs events, supported by visible gull-wing solder joints for reliability validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener regulation applications.

Alternative Part Technical Difference Application Difference Selection Advice
1N5352B Same 15 V ±10%, 5 W, DO-41 axial package; higher RθJA (120 °C/W vs. 90 °C/W) Requires through-hole mounting and larger board area; less suitable for high-density SMT layouts Select 1N5352B only if legacy through-hole assembly or manual repair is required.
SMBJ5352B Same electrical specs but DO-214AA J-bend package; RθJL not specified; no gull-wing visual inspection capability Compatible with standard SMT pick-and-place but lacks solder-fillet visibility for AOI validation Choose SMBJ5352B when footprint compatibility with existing DO-214AA designs is mandatory.

Compared with SMBG5352AE3/TR13, 1N5352B trades SMT density and thermal performance for through-hole serviceability, while SMBJ5352B retains surface-mount compatibility but sacrifices gull-wing inspection advantages and published thermal metrics.

Availability

SMBG5352AE3/TR13 is available at Aetrix Electronics and suitable for DC power supply clamp, industrial sensor reference, and automotive ECU protection requiring stable component supply with RoHS compliance and visible solder joint assurance.

Supply support for SMBG5352AE3/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal components for aerospace, defense, and industrial markets.

The SMBG53xx series was designed specifically for high-density, high-surge surface-mount voltage regulation-emphasizing visible gull-wing solder joints, Level 1 moisture robustness, and JEDEC 1N53xx equivalence.

FAQ

What is the Zener voltage tolerance of SMBG5352AE3/TR13?

The SMBG5352AE3/TR13 has a Zener voltage tolerance of ±10%, denoted by the "A" suffix in its part number. This means its measured VZ falls between 13.5 V and 16.5 V at 75 mA test current and 25 °C. The tolerance is verified per JEDEC test methods and applies across the full operating temperature range of –65 °C to +150 °C.

Does SMBG5352AE3/TR13 require dry packing before reflow soldering?

No, SMBG5352AE3/TR13 does not require dry packing. It carries IPC/JEDEC J-STD-020B moisture sensitivity level (MSL) 1, meaning it can be stored indefinitely at ≤30 °C/60% RH without baking. This eliminates pre-reflow bake cycles and simplifies SMT line logistics compared to MSL 2a or higher devices.

What is the maximum surge current rating for SMBG5352AE3/TR13?

The SMBG5352AE3/TR13 has a maximum non-repetitive peak surge current (IZSM) of 6.3 A, specified for an 8.3 ms half-sine waveform. This rating is validated per Microsemi's test methodology and supports transient suppression in automotive load-dump and industrial surge environments without parametric shift or failure.

How does the DO-215AA package of SMBG5352AE3/TR13 differ from DO-214AA?

The DO-215AA package of SMBG5352AE3/TR13 uses gull-wing leads enabling visible solder fillets for AOI, whereas DO-214AA (used in SMBJ5352B) employs J-bend leads with hidden solder joints. DO-215AA also specifies RθJL = 25 °C/W, a thermal metric not published for DO-214AA variants of this series.

Is SMBG5352AE3/TR13 compatible with lead-free reflow profiles?

Yes, SMBG5352AE3/TR13 features RoHS-compliant matte-tin plating (e3 suffix) qualified for lead-free reflow up to 260 °C for 10 seconds. Its thermosetting epoxy body meets UL94V-0 flammability rating, and the device passes solderability testing per MIL-STD-750 Method 2026 under standard Pb-free thermal profiles.

SMBG5352AE3/TR13 Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
DO-215AA, SMB Gull Wing
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Voltage - Zener (Nom) (Vz):
15 V
Tolerance:
±10%
Power - Max:
5 W
Impedance (Max) (Zzt):
2.5 Ohms
Current - Reverse Leakage @ Vr:
1 µA @ 10.8 V
Voltage - Forward (Vf) (Max) @ If:
1.2 V @ 1 A
Operating Temperature:
-65°C ~ 150°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DO-214AA (SMBG)

SMBG5352AE3/TR13 FAQ

1.How can I place an order for SMBG5352AE3/TR13 through Aetrix?

Please submit a Request for Quotation (RFQ) for SMBG5352AE3/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SMBG5352AE3/TR13 reliable?

The price and inventory of SMBG5352AE3/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5352AE3/TR13 is usually 5 days.

3.What payment methods are accepted for SMBG5352AE3/TR13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5352AE3/TR13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SMBG5352AE3/TR13?

SMBG5352AE3/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SMBG5352AE3/TR13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SMBG5352AE3/TR13?

For technical support, including SMBG5352AE3/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5352AE3/TR13 requirements.

6.How does Aetrix verify that SMBG5352AE3/TR13 is sourced from the original manufacturer or authorized distributors?

All SMBG5352AE3/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5352AE3/TR13 meets industry standards.

7.What is the process for return or replacement of SMBG5352AE3/TR13?

All SMBG5352AE3/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5352AE3/TR13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SMBG5352AE3/TR13 part is unused and in its original packaging.

Return procedure for SMBG5352AE3/TR13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SMBG5352AE3/TR13 Tags

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