Microchip Technology SMBG5352CE3/TR13
- Part No.:
- SMBG5352CE3/TR13
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG5352CE3/TR13.pdf
- Description:
- DIODE ZENER 15V 5W DO214AA
- Quantity:
- Payment:

- Shipping:

Inventory:8,697
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SMBG5352CE3/TR13 from Microsemi is a surface-mount 5 W Zener diode with nominal Zener voltage of 15 V, ±2% tolerance (C suffix), RoHS-compliant matte-tin plating, and DO-215AA gull-wing package-designed for precision voltage regulation in power supply feedback loops, overvoltage protection circuits, and reference voltage generation.
For engineers reviewing the SMBG5352CE3/TR13 datasheet, SMBG5352CE3/TR13 pinout, SMBG5352CE3/TR13 application, or SMBG5352CE3/TR13 equivalent, key selection criteria include verified 15 V ±2% VZ at 75 mA IZT, 2.5 Ω dynamic impedance (ZZT), 315 mA maximum regulator current (IZM), and thermal resistance of 25 °C/W junction-to-lead-critical for stable operation under sustained load and surge conditions.
Technical Context
This device operates as a two-terminal silicon Zener diode in reverse-biased breakdown mode, delivering regulated voltage across its cathode–anode terminals when reverse current exceeds the knee point (IZK = 1.0 mA). Its low dynamic impedance (2.5 Ω) ensures minimal voltage variation over operating current range (10–315 mA).
The DO-215AA gull-wing package enables visible solder joints and supports IPC/JEDEC Level 1 moisture sensitivity without dry pack. Thermal performance is defined by RθJL = 25 °C/W (junction-to-lead), enabling 5 W dissipation only when lead temperature (TL) remains ≤25 °C-requiring adequate PCB copper area or heatsinking for higher ambient conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 15 V ±2% at 75 mA test current-ensures tight regulation accuracy for feedback references and clamp thresholds. |
| Power Dissipation (PD) | 5.0 W at TL ≤ 25 °C-requires thermal management via PCB copper or heatsink to sustain full rating. |
| Dynamic Impedance (ZZT) | 2.5 Ω at 75 mA-minimizes output voltage deviation under varying load current. |
| Max Regulator Current (IZM) | 315 mA-defines absolute DC current limit before thermal runaway under proper heatsinking. |
| Reverse Leakage (IR) | 1.0 µA max at 10.8 V-guarantees low standby power loss in high-impedance bias networks. |
| Thermal Resistance (RθJL) | 25 °C/W-enables precise junction temperature estimation from measured lead temperature. |
| Surge Current (IZSM) | 6.3 A (8.3 ms half-sine)-supports transient overvoltage clamping without failure. |
Pinout & Package
DO-215AA gull-wing surface-mount package with cathode indicated by band; anode and cathode terminals are accessible via standard SMT reflow-compatible footprint per Microsemi pad layout (A = 8.13 mm, B = 2.16 mm, C = 2.79 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Reference/ground terminal in Zener regulation configuration | Connected to system ground or lower-potential node; defines polarity for reverse-bias operation. |
| Cathode | Regulated output terminal | Banded end; supplies stable 15 V reference when reverse current flows through external series resistor. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC 1N5352B equivalent | Identical electrical specs and test methods-enables drop-in replacement in legacy designs qualified to MIL-STD-750. |
| RoHS-compliant matte-tin plating | Meets IPC-J-STD-020B Level 1 moisture sensitivity-no dry pack required prior to assembly. |
| Gull-wing lead form | Enables visual solder joint inspection and reliable reflow yield on FR4 PCBs with recommended footprint. |
| High surge current rating | 6.3 A non-repetitive peak (8.3 ms) withstand capability-protects downstream circuitry from line transients. |
| Low dynamic impedance | 2.5 Ω at 75 mA-reduces output voltage drift across 10–315 mA operating range for stable reference generation. |
Applications
| Switching Power Supply Feedback | Overvoltage Protection Clamp |
|---|---|
|
Use Scenario: Integrated into optocoupler feedback loop of isolated DC-DC converter to regulate 15 V output rail. IC Role / Device Role / Timing Role: Precision voltage reference element setting error amplifier trip point. Use Value: ±2% VZ tolerance and 2.5 Ω ZZT ensure <±0.3% output voltage drift over load and temperature. |
Use Scenario: Placed across 12 V automotive bus to suppress load-dump spikes exceeding 24 V. IC Role / Device Role / Timing Role: Fast-acting shunt clamp activated during transient overvoltage events. Use Value: 6.3 A IZSM rating handles ISO 7637-2 Pulse 5a without degradation; 15 V clamping threshold protects 16 V-rated ICs. |
| Industrial Sensor Reference | Programmable Logic Controller Input Conditioning |
|
Use Scenario: Provides stable 15 V reference for 4–20 mA transmitter DAC and op-amp bias network. IC Role / Device Role / Timing Role: Low-drift voltage source maintaining analog signal integrity across -40 to +85 °C. Use Value: 25 °C/W RθJL allows direct thermal coupling to PCB ground plane, limiting ΔTJ to <10 °C at 2 W dissipation. |
Use Scenario: Used in PLC digital input module to clamp 24 V field signals and protect FPGA I/O pins. IC Role / Device Role / Timing Role: Primary overvoltage suppression element ahead of TVS and series resistor. Use Value: 1.0 µA IR at 10.8 V prevents false triggering in high-impedance sensing paths; DO-215AA footprint fits dense I/O layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener regulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N5352B | Same 15 V ±2% VZ, 5 W rating, but axial T-18 package with lead-forming requirements and higher RθJA (125 °C/W). | Requires through-hole assembly and larger board area; unsuitable for high-density SMT production. | Select 1N5352B only for prototyping or legacy through-hole systems where rework flexibility outweighs density constraints. |
| SMBJ5352B | Same electrical specs but J-bend DO-214AA package; RθJL = 30 °C/W vs. 25 °C/W for SMBG5352CE3/TR13. | Lower thermal efficiency requires larger copper pour for equivalent power handling; less visible solder joint inspection. | Choose SMBJ5352B only if existing DO-214AA footprint reuse is mandatory and thermal margin permits 0.5 W derating at TL = 25 °C. |
Compared with 1N5352B and SMBJ5352B, SMBG5352CE3/TR13 delivers superior thermal performance (25 °C/W RθJL) and automated optical inspection compatibility in high-volume SMT lines-making it optimal for space-constrained, thermally demanding industrial and automotive power systems.
Availability
SMBG5352CE3/TR13 is available at Aetrix Electronics and suitable for switching power supply feedback, overvoltage protection clamp, and industrial sensor reference applications requiring stable component supply, consistent parametric performance, and RoHS-compliant manufacturing.
Supply support for SMBG5352CE3/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and RF solutions for aerospace, defense, and industrial markets.
The SMBG53xx series was designed specifically for surface-mount voltage regulation and transient suppression in harsh-environment power systems-emphasizing JEDEC equivalence, thermal robustness, and process-controlled Zener tolerance.
FAQ
What is the Zener voltage tolerance for SMBG5352CE3/TR13?
The SMBG5352CE3/TR13 has a Zener voltage tolerance of ±2%, denoted by the "C" suffix in the part number. This means its measured VZ falls between 14.7 V and 15.3 V when tested at 75 mA (IZT) and 25 °C. The tolerance is guaranteed per Microsemi's characterization and screening process, and applies across the full operating temperature range of –65 to +150 °C.
Can SMBG5352CE3/TR13 replace 1N5352B in existing designs?
Yes, SMBG5352CE3/TR13 is electrically equivalent to 1N5352B per Microsemi documentation, sharing identical VZ, IZT, ZZT, and IZM specifications. However, the SMBG5352CE3/TR13 uses a DO-215AA gull-wing package versus the axial T-18 of 1N5352B-requiring PCB footprint redesign but offering improved thermal performance (25 °C/W vs. 125 °C/W RθJA) and SMT compatibility.
What is the maximum continuous power dissipation for SMBG5352CE3/TR13?
The SMBG5352CE3/TR13 is rated for 5.0 W continuous power dissipation only when lead temperature (TL) is maintained at or below 25 °C. At higher lead temperatures, power must be linearly derated per the curve in Figure 1 of the datasheet-e.g., at TL = 75 °C, maximum allowable PD drops to approximately 2.8 W. Derating assumes mounting on FR4 with 1 oz copper and Microsemi's recommended pad layout.
Is SMBG5352CE3/TR13 suitable for surge protection applications?
Yes, SMBG5352CE3/TR13 supports non-repetitive surge currents up to 6.3 A (8.3 ms half-sine waveform), making it suitable for clamping transient overvoltages such as load dump or ESD-induced spikes. Its 15 V clamping threshold and low ZZT ensure fast response and minimal overshoot-though for sustained surges or repeated events, pairing with a series current-limiting resistor and/or upstream TVS is recommended.
Does SMBG5352CE3/TR13 require dry packing before reflow soldering?
No, SMBG5352CE3/TR13 has an IPC/JEDEC moisture sensitivity level (MSL) of Level 1, meaning it may be stored indefinitely at ≤30 °C/60% RH without dry pack or baking. This is confirmed by Microsemi's qualification per J-STD-020B and results from the void-free UL94V-0 epoxy encapsulation and RoHS-compliant matte-tin plating-eliminating moisture ingress risk during standard SMT reflow.
SMBG5352CE3/TR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- DO-215AA, SMB Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 15 V
- Tolerance:
- ±2%
- Power - Max:
- 5 W
- Impedance (Max) (Zzt):
- 2.5 Ohms
- Current - Reverse Leakage @ Vr:
- 1 µA @ 10.8 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 1 A
- Operating Temperature:
- -65°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG5352CE3/TR13 FAQ
1.How can I place an order for SMBG5352CE3/TR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG5352CE3/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG5352CE3/TR13 reliable?
The price and inventory of SMBG5352CE3/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5352CE3/TR13 is usually 5 days.
3.What payment methods are accepted for SMBG5352CE3/TR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5352CE3/TR13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG5352CE3/TR13?
SMBG5352CE3/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG5352CE3/TR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG5352CE3/TR13?
For technical support, including SMBG5352CE3/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5352CE3/TR13 requirements.
6.How does Aetrix verify that SMBG5352CE3/TR13 is sourced from the original manufacturer or authorized distributors?
All SMBG5352CE3/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5352CE3/TR13 meets industry standards.
7.What is the process for return or replacement of SMBG5352CE3/TR13?
All SMBG5352CE3/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5352CE3/TR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG5352CE3/TR13 part is unused and in its original packaging.
Return procedure for SMBG5352CE3/TR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG5352CE3/TR13 Tags

-
MMBZ5240B-7-F
Diodes Incorporated

-
BZT52C5V6T-7
Diodes Incorporated

-
MMSZ5231B-7-F
Diodes Incorporated

-
BZT52C15-7-F
Diodes Incorporated

-
BZX84C3V3LT1G
onsemi

-
MMSZ5245BS-7-F
Diodes Incorporated

-
MMSZ4682T1G
onsemi

-
BZT52C15S-7-F
Diodes Incorporated

-
MM5Z5V1ST1G
onsemi

-
SMAJ4744A-TP
Micro Commercial Co

-
BZT52C3V6LP-7
Diodes Incorporated

-
SMAZ12-13-F
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

