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Microchip Technology SMBG5373BE3/TR13
- Part No.:
- SMBG5373BE3/TR13
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG5373BE3/TR13.pdf
- Description:
- DIODE ZENER 68V 5W DO214AA
- Quantity:
- Payment:
- Shipping:
Inventory:9,268
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Product details
Overview
SMBG5373BE3/TR13 from Microsemi is a surface-mount 5 W Zener diode with nominal breakdown voltage of 68 V, ±5% tolerance (B suffix), RoHS-compliant matte-tin plating (e3), and gull-wing DO-215AA package. It regulates voltage across wide current and temperature ranges, supports surge currents up to 500 A (8.3 ms half-sine), and is used in overvoltage protection circuits for industrial power supplies and DC bus clamping.
For engineers reviewing the SMBG5373BE3/TR13 datasheet, SMBG5373BE3/TR13 pinout, SMBG5373BE3/TR13 application, or SMBG5373BE3/TR13 equivalent, key selection criteria include its 68 V Zener voltage at 20 mA test current, 44 Ω dynamic impedance at IZT, 0.5 µA reverse leakage at 49 V, and thermal resistance of 25 °C/W junction-to-lead - critical for high-reliability transient suppression in constrained PCB layouts.
Technical Context
This device operates as a precision voltage reference and clamp in reverse-biased mode, with cathode indicated by band and rated for continuous 5 W dissipation at lead temperature ≤25 °C. Its Zener voltage is specified at TL = 30 °C with 40 ±10 ms delay after current application, and dynamic impedance is measured using 1 kHz AC modulation at 10% of IZT.
The SMBG5373BE3/TR13 meets MIL-STD-750 method 1020 for ESD insensitivity and has IPC/JEDEC J-STD-020B moisture sensitivity level 1 - enabling standard reflow without dry pack. Its DO-215AA gull-wing footprint provides visible solder joints and supports automated optical inspection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 68 V at 20 mA test current - defines precise clamping threshold for overvoltage events. |
| Power Dissipation (PD) | 5.0 W at TL ≤ 25 °C - requires thermal management via copper pour or heatsink for sustained operation. |
| Dynamic Impedance (ZZT) | 44 Ω at IZT = 20 mA - determines regulation stability under varying load current. |
| Reverse Leakage (IR) | 0.5 µA max at VR = 49 V - ensures minimal standby power loss in high-impedance bias networks. |
| Surge Current (IZSM) | 500 A peak (8.3 ms half-sine) - enables robust transient energy absorption per IEEE C62.41. |
| Junction Temp Range | –65 to +150 °C - supports operation in automotive under-hood and industrial motor drive environments. |
| Thermal Resistance RθJL | 25 °C/W - quantifies thermal path efficiency from die to lead; critical for PCB copper area design. |
Pinout & Package
DO-215AA gull-wing surface-mount package with cathode identified by band; terminals are anode (unbanded end) and cathode (banded end). Designed for FR4 PCBs with recommended pad layout (A = 8.13 mm, B = 2.16 mm, C = 2.79 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry terminal in forward bias; connected to lower-potential node in Zener clamp configuration. | Must be routed to system ground or return path when used as shunt regulator or transient suppressor. |
| Cathode | Current exit terminal in forward bias; connected to higher-potential node in Zener clamp configuration. | Banded end connects to protected line (e.g., 48 V DC bus); clamps to 68 V during overvoltage events. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC 1N5373B equivalence | Identical electrical characteristics and testing to through-hole 1N5373B - enables drop-in replacement in legacy designs. |
| Gull-wing lead form | Enables AOI-compatible solder joint inspection and reduces tombstoning risk vs. J-bend packages. |
| Moisture Sensitivity Level 1 | No dry pack required - simplifies inventory handling and eliminates bake-out prior to reflow. |
| RoHS-compliant matte-tin plating | e3 suffix confirms lead-free finish compliant with EU Directive 2011/65/EU and JEDEC J-STD-609. |
| High surge current rating | 500 A non-repetitive peak supports IEC 61000-4-5 Level 4 surge immunity compliance. |
Applications
| Industrial Power Supply Protection | DC Bus Overvoltage Clamping |
|---|---|
|
Use Scenario: Protecting 48 V telecom rectifier outputs against lightning-induced transients and load dump spikes. IC Role / Device Role / Timing Role: Shunt Zener clamp placed across output capacitor to limit voltage excursion to 68 V. Use Value: Prevents damage to downstream DC-DC converters rated for 75 V max input by clamping surges within 100 ns. |
Use Scenario: Safeguarding motor drive DC link capacitors during regenerative braking events. IC Role / Device Role / Timing Role: Parallel-connected Zener absorbing excess energy when bus voltage exceeds 68 V. Use Value: Eliminates need for active crowbar circuitry while maintaining <1 µA leakage at 49 V operating point. |
| Automotive Body Control Module | Programmable Reference Voltage Source |
|
Use Scenario: Providing overvoltage protection on LIN bus transceiver supply lines in harsh automotive environments. IC Role / Device Role / Timing Role: Transient suppressor on 12 V rail feeding LIN physical layer ICs. Use Value: Withstands –65 to +150 °C junction temperature swing and passes ISO 7637-2 pulse 5a without degradation. |
Use Scenario: Generating stable 68 V reference for high-voltage sensor signal conditioning in test equipment. IC Role / Device Role / Timing Role: Precision Zener reference biased at 20 mA for low-drift analog front-end calibration. Use Value: Delivers 68 V ±5% tolerance with 44 Ω dynamic impedance - enabling <0.1% line regulation error over 5–50 mA current range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N5373B | Through-hole DO-41 package; identical VZ, IZT, ZZT, and PD specs; non-RoHS (Sn/Pb) plating. | Requires axial-leaded PCB footprint and wave solder process; unsuitable for high-density SMT assemblies. | Select when retrofitting legacy through-hole designs or where thermal mass of DO-41 improves surge energy handling. |
| SMBJ5373B | J-bend DO-214AA package; same VZ and tolerance but higher RθJA (100 °C/W vs. 90 °C/W); identical e3 RoHS option available. | Lower profile than SMBG but less visible solder joints; reduced thermal performance on FR4 without thermal pads. | Choose for space-constrained boards where gull-wing inspection is not required and lead count matches existing DO-214AA layout. |
Compared with SMBG5373BE3/TR13, 1N5373B offers mechanical robustness in through-hole mounting but lacks SMT scalability, while SMBJ5373B trades solder-joint visibility for smaller board area - making SMBG5373BE3/TR13 optimal for new designs requiring AOI validation and thermal reliability.
Availability
SMBG5373BE3/TR13 is available at Aetrix Electronics and suitable for industrial power supply protection, DC bus overvoltage clamping, and automotive body control module designs requiring stable component supply with full traceability and long-term lifecycle support.
Supply support for SMBG5373BE3/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and RF solutions for aerospace, defense, and industrial markets.
The SMBG53xxB series was designed specifically for surface-mount overvoltage protection in high-density power systems, emphasizing surge resilience, thermal stability, and JEDEC-compatibility with legacy 1N53xxB through-hole Zeners.
FAQ
What is the Zener voltage tolerance for SMBG5373BE3/TR13?
The 'B' suffix in SMBG5373BE3/TR13 indicates ±5% Zener voltage tolerance, meaning its breakdown voltage is guaranteed between 64.6 V and 71.4 V at 20 mA test current and TL = 30 °C. This tolerance is verified per JEDEC JESD201A stress testing and applies across the full –65 to +150 °C junction temperature range.
Does SMBG5373BE3/TR13 require dry packing before reflow soldering?
No, SMBG5373BE3/TR13 has IPC/JEDEC J-STD-020B moisture sensitivity level 1, confirmed in the official Microsemi datasheet. It may be stored and processed directly from ambient conditions without baking or dry pack - reducing manufacturing overhead and eliminating moisture-related popcorning risks during reflow.
What is the maximum surge current rating for SMBG5373BE3/TR13?
SMBG5373BE3/TR13 is rated for 500 A peak non-repetitive surge current (IZSM) under an 8.3 ms half-sine waveform, as specified in the Electrical Characteristics table on page 3 of the T4-LDS-0246-1 datasheet. This rating assumes proper PCB thermal design and validates compliance with IEC 61000-4-5 Level 4 surge immunity requirements.
How does the DO-215AA package of SMBG5373BE3/TR13 differ from DO-214AA?
The DO-215AA gull-wing package of SMBG5373BE3/TR13 features outward-bent leads enabling visual solder joint inspection, whereas DO-214AA uses J-bend leads. DO-215AA also has lower thermal resistance junction-to-lead (25 °C/W vs. ~30 °C/W for DO-214AA) and is mechanically optimized for high-volume SMT assembly with reduced tombstoning incidence.
Is SMBG5373BE3/TR13 compatible with lead-free reflow profiles?
Yes, SMBG5373BE3/TR13 carries the 'e3' suffix confirming RoHS-compliant annealed matte-tin plating, qualified for peak reflow temperatures up to 260 °C for 10 seconds per MIL-STD-750 method 2026. Its plastic body meets UL94V-0 flammability rating and withstands standard JEDEC J-STD-020D lead-free reflow profiles without delamination.
SMBG5373BE3/TR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- DO-215AA, SMB Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 68 V
- Tolerance:
- ±5%
- Power - Max:
- 5 W
- Impedance (Max) (Zzt):
- 44 Ohms
- Current - Reverse Leakage @ Vr:
- 500 nA @ 49 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 1 A
- Operating Temperature:
- -65°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG5373BE3/TR13 FAQ
1.How can I place an order for SMBG5373BE3/TR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG5373BE3/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG5373BE3/TR13 reliable?
The price and inventory of SMBG5373BE3/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5373BE3/TR13 is usually 5 days.
3.What payment methods are accepted for SMBG5373BE3/TR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5373BE3/TR13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG5373BE3/TR13?
SMBG5373BE3/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG5373BE3/TR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG5373BE3/TR13?
For technical support, including SMBG5373BE3/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5373BE3/TR13 requirements.
6.How does Aetrix verify that SMBG5373BE3/TR13 is sourced from the original manufacturer or authorized distributors?
All SMBG5373BE3/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5373BE3/TR13 meets industry standards.
7.What is the process for return or replacement of SMBG5373BE3/TR13?
All SMBG5373BE3/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5373BE3/TR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG5373BE3/TR13 part is unused and in its original packaging.
Return procedure for SMBG5373BE3/TR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG5373BE3/TR13 Tags
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MMBZ5240B-7-F
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SMAJ4744A-TP
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