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Microchip Technology SMBG5373C/TR13
- Part No.:
- SMBG5373C/TR13
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG5373C/TR13.pdf
- Description:
- DIODE ZENER 68V 5W DO214AA
- Quantity:
- Payment:
- Shipping:
Inventory:2,247
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Product details
Overview
SMBG5373C/TR13 from Microsemi is a surface-mount 5 W Zener diode with a nominal breakdown voltage of 68 V, ±2% tolerance (C suffix), and DO-215AA gull-wing package. It delivers stable voltage regulation across wide current and temperature ranges (-65 °C to +150 °C), supports 20 mA test current (IZT), exhibits 44 Ω dynamic impedance (ZZT), and withstands 500 A non-repetitive surge current (IZSM) - used in power supply overvoltage clamping and reference circuits.
For engineers reviewing the SMBG5373C/TR13 datasheet, SMBG5373C/TR13 pinout, SMBG5373C/TR13 application, or SMBG5373C/TR13 equivalent, key selection criteria include Zener voltage tolerance, thermal resistance (RθJL = 25 °C/W), maximum regulator current (IZM = 2.0 A), surge capability (IZSM = 500 A), and RoHS-compliant matte-tin plating.
Technical Context
This device operates as a precision voltage reference and transient clamp in DC power rails. Its 68 V Zener voltage is specified at 20 mA (IZT), with dynamic impedance of 44 Ω measured at 10% AC modulation superimposed on IZT - indicating low voltage variation under load changes. The DO-215AA gull-wing package enables visible solder joints and meets IPC/JEDEC J-STD-020B Level 1 moisture sensitivity.
It features cathode band polarity marking, 1.2 V forward voltage at 1.0 A, and thermal derating per Figure 1: full 5.0 W dissipation only when lead temperature (TL) ≤ 25 °C; power reduces linearly above that point. Maximum junction-to-ambient resistance is 90 °C/W on FR4 with recommended pad layout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 68 V ±2% at 20 mA - ensures tight regulation for 65–71 V reference or clamp applications. |
| Power Dissipation (PD) | 5.0 W at TL ≤ 25 °C - requires thermal management via PCB copper pour or heatsinking for sustained operation. |
| Dynamic Impedance (ZZT) | 44 Ω at IZT = 20 mA - low impedance minimizes output voltage shift under varying load currents. |
| Max Regulator Current (IZM) | 2.0 A - defines absolute DC current limit before thermal runaway under rated power conditions. |
| Surge Current (IZSM) | 500 A (8.3 ms half-sine) - enables robust protection against lightning-induced or inductive-switching transients. |
| Reverse Leakage (IR) | 0.5 µA at VR = 51 V - negligible leakage preserves efficiency in high-impedance bias networks. |
| Junction Temp Range | -65 °C to +150 °C - supports operation in automotive under-hood, industrial control, and telecom environments. |
Pinout & Package
DO-215AA gull-wing surface-mount package with two terminals: anode and cathode. Cathode identified by molded band; device operated with banded end positive relative to anode. Package dimensions: 4.06–4.57 mm length (B), 1.96–2.10 mm height (A), 3.30–3.94 mm width (C); weight: 0.1 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry terminal in forward bias; referenced ground in Zener mode | Connected to lower-potential node (e.g., ground or return path) during regulation/clamping. |
| Cathode | Current exit terminal in forward bias; Zener breakdown terminal | Banded end; connected to higher-potential rail (e.g., input voltage) to clamp or regulate. |
Key Features
| Feature | Design Value |
|---|---|
| RoHS-compliant matte-tin plating | Meets JEDEC 2026 solderability standards without lead; compatible with Pb-free reflow profiles up to 260 °C. |
| Gull-wing lead form (DO-215AA) | Enables visual post-solder inspection and improves mechanical reliability vs. J-bend packages under thermal cycling. |
| Moisture Sensitivity Level 1 | No dry pack or baking required prior to assembly - reduces manufacturing overhead and handling risk. |
| Non-ESD-sensitive design | Qualified to MIL-STD-750 Method 1020 - eliminates need for ESD-safe handling in standard production lines. |
| High surge current rating | 500 A peak (8.3 ms) supports single-event transient suppression without external TVS stacking. |
Applications
| Industrial Power Supply Clamp | Telecom Line Card Reference |
|---|---|
|
Use Scenario: Clamping 72 V DC input rail against surges in programmable logic controller (PLC) power modules. IC Role / Device Role / Timing Role: Zener diode operating in reverse breakdown to shunt excess energy to ground. Use Value: 68 V ±2% tolerance ensures clamping occurs within safe margin below 75 V system overvoltage threshold. |
Use Scenario: Providing stable 68 V reference for analog-to-digital converter (ADC) biasing in remote radio head (RRH) line cards. IC Role / Device Role / Timing Role: Precision voltage reference source with low dynamic impedance for ADC reference divider networks. Use Value: 44 Ω ZZT minimizes reference voltage drift under varying load currents from adjacent signal conditioning circuitry. |
| Automotive Body Control Module | Medical Imaging Power Rail Monitor |
|
Use Scenario: Overvoltage protection on 60 V battery-fed HVAC actuator driver stage in 48 V mild-hybrid vehicles. IC Role / Device Role / Timing Role: Transient voltage suppressor clamping spikes induced by relay switching or load dump. Use Value: 500 A IZSM rating handles ISO 7637-2 Pulse 5a load-dump energy without degradation. |
Use Scenario: Monitoring 68 V auxiliary supply in X-ray detector front-end ASIC power domain. IC Role / Device Role / Timing Role: Fail-safe voltage monitor element triggering shutdown if rail exceeds 71 V. Use Value: ±2% tolerance guarantees trip point accuracy; -65 °C to +150 °C range covers sterilization and cold-start conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N5373C | Axial-leaded T-18 package; identical electrical specs but higher RθJA (120 °C/W), no gull-wing visibility. | Requires through-hole assembly; unsuitable for high-density SMT layouts or automated optical inspection. | Select when legacy through-hole compatibility or manual prototyping is prioritized over board space or reflow process control. |
| SMBJ5373C | DO-214AA J-bend package; same VZ/IZT/IZM but RθJL = 30 °C/W (vs. 25 °C/W), slightly higher ZZT (48 Ω). | Limited solder joint visibility; less robust thermal conduction than gull-wing leads under repeated thermal cycling. | Choose when existing DO-214AA footprint reuse is critical, accepting minor thermal and impedance trade-offs. |
Compared with SMBG5373C/TR13, 1N5373C offers identical regulation but lacks SMT manufacturability, while SMBJ5373C fits alternate footprints at the cost of reduced thermal performance and surge margin - making SMBG5373C/TR13 optimal for new high-reliability SMT designs requiring visible solder joints and lowest RθJL.
Availability
SMBG5373C/TR13 is available at Aetrix Electronics and suitable for industrial power supply clamp, telecom line card reference, and automotive body control module applications requiring stable component supply, consistent RoHS compliance, and verified surge performance.
Supply support for SMBG5373C/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) designs high-reliability analog and mixed-signal semiconductors for aerospace, defense, and industrial markets.
The SMBG53xx series targets surface-mount Zener regulation in space-constrained, thermally demanding systems - emphasizing visible solder joints, moisture resilience, and surge survivability in harsh environments.
FAQ
What is the Zener voltage tolerance of SMBG5373C/TR13?
The "C" suffix in SMBG5373C/TR13 denotes ±2% Zener voltage tolerance at 20 mA test current. This means the actual breakdown voltage falls between 66.64 V and 69.36 V under specified conditions, enabling precise voltage reference and clamping where tight regulation is critical.
Does SMBG5373C/TR13 require dry packing before reflow soldering?
No - SMBG5373C/TR13 has IPC/JEDEC J-STD-020B Moisture Sensitivity Level 1 classification, meaning it can be stored and assembled without dry pack or baking. This simplifies handling and eliminates moisture-related popcorning risks during standard reflow profiles.
What is the maximum continuous power dissipation for SMBG5373C/TR13?
SMBG5373C/TR13 is rated for 5.0 W continuous power dissipation only when lead temperature (TL) is maintained at or below 25 °C. Above that, power must be derated linearly per Figure 1 in the datasheet - e.g., ~3.5 W at TL = 75 °C.
How does the DO-215AA gull-wing package benefit SMBG5373C/TR13 in production?
The DO-215AA gull-wing package of SMBG5373C/TR13 enables real-time visual inspection of solder fillets post-reflow, improving first-pass yield and reducing field failure risk. Its low RθJL (25 °C/W) also enhances thermal transfer to PCB copper compared to J-bend alternatives.
Is SMBG5373C/TR13 suitable for automotive applications?
Yes - SMBG5373C/TR13 operates from -65 °C to +150 °C, withstands 500 A surge current (ISO 7637-2 Pulse 5a compliant), and uses RoHS-compliant matte-tin plating. These attributes make it suitable for under-hood and battery-rail protection in 48 V mild-hybrid vehicle systems.
SMBG5373C/TR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- DO-215AA, SMB Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 68 V
- Tolerance:
- ±2%
- Power - Max:
- 5 W
- Impedance (Max) (Zzt):
- 44 Ohms
- Current - Reverse Leakage @ Vr:
- 500 nA @ 49 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 1 A
- Operating Temperature:
- -65°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG5373C/TR13 FAQ
1.How can I place an order for SMBG5373C/TR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG5373C/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG5373C/TR13 reliable?
The price and inventory of SMBG5373C/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5373C/TR13 is usually 5 days.
3.What payment methods are accepted for SMBG5373C/TR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5373C/TR13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG5373C/TR13?
SMBG5373C/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG5373C/TR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG5373C/TR13?
For technical support, including SMBG5373C/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5373C/TR13 requirements.
6.How does Aetrix verify that SMBG5373C/TR13 is sourced from the original manufacturer or authorized distributors?
All SMBG5373C/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5373C/TR13 meets industry standards.
7.What is the process for return or replacement of SMBG5373C/TR13?
All SMBG5373C/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5373C/TR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG5373C/TR13 part is unused and in its original packaging.
Return procedure for SMBG5373C/TR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG5373C/TR13 Tags
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