Microchip Technology SMBG5381CE3/TR13
- Part No.:
- SMBG5381CE3/TR13
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG5381CE3/TR13.pdf
- Description:
- DIODE ZENER 130V 5W DO214AA
- Quantity:
- Payment:

- Shipping:

Inventory:7,044
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SMBG5381CE3/TR13 from Microsemi is a surface-mount 5 W Zener diode with nominal Zener voltage of 130 V, ±2% tolerance (C suffix), rated test current of 10 mA, maximum dynamic impedance of 190 Ω at IZT, and maximum Zener surge current of 1250 A (8.3 ms half-sine). It operates in DO-215AA gull-wing package and is used for precision voltage regulation in power supply feedback loops and overvoltage protection circuits.
For engineers reviewing the SMBG5381CE3/TR13 datasheet, SMBG5381CE3/TR13 pinout, SMBG5381CE3/TR13 application, or SMBG5381CE3/TR13 equivalent, key selection criteria include Zener voltage accuracy, surge current capability, thermal resistance (RθJL = 25 °C/W), RoHS-compliant matte-tin plating, and compatibility with automated SMT assembly on FR4 boards.
Technical Context
This device functions as a two-terminal voltage reference operating in reverse breakdown, maintaining stable 130 V regulation across 10 mA to 36.6 mA dc current (IZM) with minimal voltage drift versus temperature (–65 to +150 °C junction range). Its low RθJL enables effective heat transfer to PCB leads under sustained 5 W dissipation at TL < 25 °C.
The SMBG5381CE3/TR13 exhibits 190 Ω dynamic impedance at 10 mA test current and 75 Ω knee impedance at 1 mA, ensuring tight regulation near the breakdown knee. It withstands non-repetitive 1250 A surges (8.3 ms half-sine) and maintains <0.5 µA reverse leakage at VR = 104 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 130 V ±2% at 10 mA - ensures precise clamping threshold for 120 V AC-derived rails or telecom line protection. |
| Power Dissipation (PD) | 5.0 W at TL < 25 °C - supports continuous regulation in compact layouts with adequate lead heatsinking. |
| Dynamic Impedance (ZZT) | 190 Ω at IZT = 10 mA - limits output voltage variation under load transients in feedback networks. |
| Max Surge Current (IZSM) | 1250 A (8.3 ms half-sine) - provides robust transient suppression for lightning or inductive switching events. |
| Thermal Resistance (RθJL) | 25 °C/W - allows direct thermal path from junction to PCB lead, critical for reliability in high-power pulse operation. |
| Reverse Leakage (IR) | <0.5 µA at VR = 104 V - minimizes standby power loss in high-impedance bias networks. |
| Junction Temperature Range | –65 to +150 °C - enables deployment in industrial and automotive under-hood environments. |
Pinout & Package
DO-215AA gull-wing surface-mount package with cathode band marking; terminals are anode (unbanded end) and cathode (banded end); RoHS-compliant matte-tin plating per MIL-STD-750 method 2026.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry terminal in forward bias; referenced ground in Zener regulation mode | Connected to lower-potential node (e.g., power rail return or error amplifier output) during regulation. |
| Cathode | Current exit terminal in forward bias; regulated output node in Zener mode | Banded end connects to higher-potential node (e.g., switcher feedback divider tap or protected line input). |
Key Features
| Feature | Design Value |
|---|---|
| ±2% Zener voltage tolerance (C suffix) | Enables tighter output voltage control in closed-loop DC/DC converters without trimming resistors. |
| RoHS-compliant matte-tin plating | Ensures solderability and intermetallic formation compatibility with Pb-free reflow profiles (260 °C, 10 s). |
| Moisture sensitivity Level 1 | Eliminates dry-pack requirement and floor-life constraints-ready for immediate SMT placement. |
| Gull-wing lead form (DO-215AA) | Provides visible solder joints for automated optical inspection (AOI) and reliable mechanical anchoring on FR4. |
| Non-sensitive to ESD (MIL-STD-750 Method 1020) | Reduces handling precautions and eliminates need for ESD-safe workstations during assembly. |
Applications
| Switch-Mode Power Supply Feedback | Telecom Line Overvoltage Protection |
|---|---|
|
Use Scenario: Regulates output voltage in isolated flyback converter by sensing secondary-side voltage via optocoupler feedback network. IC Role / Device Role / Timing Role: Precision voltage reference element setting feedback threshold for PWM controller error amplifier. Use Value: ±2% VZ tolerance reduces output voltage deviation to ±1.5% across line/load/temperature, eliminating post-production calibration. |
Use Scenario: Clamps induced surges on POTS telephone line interface before reaching SLIC or codec IC. IC Role / Device Role / Timing Role: Primary overvoltage clamp protecting analog front-end circuitry from lightning-induced transients. Use Value: 1250 A surge rating (8.3 ms) absorbs ITU-T K.20-compliant longitudinal surges without degradation. |
| Industrial Sensor Signal Conditioning | Programmable Logic Controller Input Protection |
|
Use Scenario: Stabilizes excitation voltage for 4–20 mA current loop transmitter using 24 V DC supply. IC Role / Device Role / Timing Role: Shunt regulator maintaining constant bias for precision op-amp and DAC reference stages. Use Value: 190 Ω ZZT ensures <20 mV output shift across 5–15 mA load variation, preserving current loop accuracy. |
Use Scenario: Protects digital input channel of PLC module from accidental 120 V AC miswiring or field wiring faults. IC Role / Device Role / Timing Role: Fail-safe shunt clamp diverting fault current away from input buffer IC and isolation barrier. Use Value: 130 V VZ exceeds 120 V RMS peak (170 V), providing 40 V safety margin while avoiding nuisance triggering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener regulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N5381C | Axial-leaded T-18 package; identical electrical specs but higher RθJA (150 °C/W vs. 90 °C/W) and no gull-wing visibility. | Requires through-hole assembly; unsuitable for high-density SMT layouts or AOI. | Select when legacy through-hole design or manual repair is required; not drop-in for SMBG5381CE3/TR13. |
| SMBJ5381C | DO-214AA J-bend package; same VZ, IZM, and surge rating, but RθJL = 30 °C/W and different pad layout. | Compatible with standard SMT pick-and-place but requires footprint redesign and has slightly reduced thermal performance. | Choose for designs already using DO-214AA footprints; verify thermal margin with 30 °C/W RθJL. |
Compared with 1N5381C and SMBJ5381C, SMBG5381CE3/TR13 delivers superior thermal transfer (25 °C/W RθJL), gull-wing visual inspection capability, and native RoHS compliance-making it optimal for new SMT power regulation designs requiring reliability and process efficiency.
Availability
SMBG5381CE3/TR13 is available at Aetrix Electronics and suitable for switch-mode power supplies, telecom line protection, industrial sensor conditioning, and PLC input protection requiring stable component supply, full traceability, and long-term lifecycle support.
Supply support for SMBG5381CE3/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal components for aerospace, defense, and industrial markets.
The SMBG53xxB series was designed specifically for surface-mount voltage regulation and transient suppression in space-constrained, high-surge industrial power systems-emphasizing thermal robustness, JEDEC compatibility, and process-ready packaging.
FAQ
What is the Zener voltage tolerance of SMBG5381CE3/TR13?
The SMBG5381CE3/TR13 has a Zener voltage tolerance of ±2%, indicated by the "C" suffix in its part number. This means its measured VZ falls within 127.4 V to 132.6 V when tested at 10 mA and 25 °C. This tight tolerance supports high-accuracy regulation in feedback networks where minimal output deviation is critical, such as in medical-grade power supplies or precision instrumentation.
Does SMBG5381CE3/TR13 require dry packing or moisture barrier bags?
No, SMBG5381CE3/TR13 does not require dry packing. It carries IPC/JEDEC J-STD-020B moisture sensitivity level 1, meaning it can be stored indefinitely at ambient conditions without desiccant or humidity-controlled packaging. This simplifies inventory handling and eliminates floor-life tracking during SMT assembly-directly usable from reel after opening.
What is the maximum continuous Zener current (IZM) for SMBG5381CE3/TR13?
The maximum continuous Zener current (IZM) for SMBG5381CE3/TR13 is 36.6 mA when operated at lead temperature (TL) below 25 °C. This value is derived from PD = 5.0 W and VZM = 132.6 V (upper limit of ±2% tolerance), per Note 3 in the datasheet. Exceeding this current risks thermal runaway unless additional heatsinking is applied.
Can SMBG5381CE3/TR13 be used in place of SMBG5381B?
Yes, SMBG5381CE3/TR13 is functionally compatible with SMBG5381B but offers tighter voltage tolerance (±2% vs. ±5%) and RoHS-compliant matte-tin plating (vs. Sn/Pb). Electrically, both share identical VZ nominal (130 V), IZT (10 mA), and surge rating (1250 A). The "E3" suffix confirms RoHS compliance, making SMBG5381CE3/TR13 the preferred choice for new environmentally compliant designs.
What is the thermal resistance from junction to ambient (RθJA) for SMBG5381CE3/TR13?
The thermal resistance from junction to ambient (RθJA) for SMBG5381CE3/TR13 is 90 °C/W when mounted on a standard FR4 PCB with 1 oz copper and the recommended footprint. This value assumes natural convection cooling; actual RθJA improves with added copper pour or forced airflow. For thermal design, use RθJL = 25 °C/W when heatsinking via leads is prioritized.
SMBG5381CE3/TR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- DO-215AA, SMB Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 130 V
- Tolerance:
- ±2%
- Power - Max:
- 5 W
- Impedance (Max) (Zzt):
- 190 Ohms
- Current - Reverse Leakage @ Vr:
- 500 nA @ 93.6 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 1 A
- Operating Temperature:
- -65°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG5381CE3/TR13 FAQ
1.How can I place an order for SMBG5381CE3/TR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG5381CE3/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG5381CE3/TR13 reliable?
The price and inventory of SMBG5381CE3/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5381CE3/TR13 is usually 5 days.
3.What payment methods are accepted for SMBG5381CE3/TR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5381CE3/TR13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG5381CE3/TR13?
SMBG5381CE3/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG5381CE3/TR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG5381CE3/TR13?
For technical support, including SMBG5381CE3/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5381CE3/TR13 requirements.
6.How does Aetrix verify that SMBG5381CE3/TR13 is sourced from the original manufacturer or authorized distributors?
All SMBG5381CE3/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5381CE3/TR13 meets industry standards.
7.What is the process for return or replacement of SMBG5381CE3/TR13?
All SMBG5381CE3/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5381CE3/TR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG5381CE3/TR13 part is unused and in its original packaging.
Return procedure for SMBG5381CE3/TR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG5381CE3/TR13 Tags

-
MMBZ5240B-7-F
Diodes Incorporated

-
BZT52C5V6T-7
Diodes Incorporated

-
MMSZ5231B-7-F
Diodes Incorporated

-
BZT52C15-7-F
Diodes Incorporated

-
BZX84C3V3LT1G
onsemi

-
MMSZ5245BS-7-F
Diodes Incorporated

-
MMSZ4682T1G
onsemi

-
BZT52C15S-7-F
Diodes Incorporated

-
MM5Z5V1ST1G
onsemi

-
SMAJ4744A-TP
Micro Commercial Co

-
BZT52C3V6LP-7
Diodes Incorporated

-
SMAZ12-13-F
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

