Microchip Technology SMBG5382AE3/TR13
- Part No.:
- SMBG5382AE3/TR13
- Manufacturer:
- Microchip Technology
- Category:
- Single Zener Diodes
- Package:
- DO-215AA, SMB Gull Wing
- Datasheet:
-
SMBG5382AE3/TR13.pdf
- Description:
- DIODE ZENER 140V 5W DO214AA
- Quantity:
- Payment:

- Shipping:

Inventory:2,264
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SMBG5382AE3/TR13 from Microsemi is a surface-mount 5 W Zener diode with nominal breakdown voltage of 140 V, ±10% tolerance (A suffix), and maximum Zener current IZM of 34 mA at TL < 25 °C. It uses DO-215AA gull-wing package, delivers dynamic impedance of 230 Ω at 10 mA test current, and operates across –65 °C to +150 °C junction temperature range. It serves as precision voltage reference and overvoltage clamp in DC power supply regulation circuits.
For engineers reviewing the SMBG5382AE3/TR13 datasheet, SMBG5382AE3/TR13 pinout, SMBG5382AE3/TR13 application, or SMBG5382AE3/TR13 equivalent, key selection criteria include its 140 V Zener voltage, 5 W power rating at lead temperature < 25 °C, ±10% voltage tolerance, DO-215AA gull-wing thermal performance (RθJL = 25 °C/W), and RoHS-compliant matte-tin plating.
Technical Context
This device functions as a silicon planar Zener diode operating in reverse-biased breakdown region, delivering stable reference voltage under controlled regulator current (IZT = 8.0 mA). Its design supports high-surge capability (IZSM = 1500 A for 8.3 ms half-sine) and low leakage (IR ≤ 0.5 µA at VR = 106 V).
The DO-215AA gull-wing package enables visible solder joints and meets IPC/JEDEC J-STD-020B Level 1 moisture sensitivity without dry pack. Thermal resistance from junction-to-lead is 25 °C/W, enabling effective heat conduction through PCB leads when mounted per recommended footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 140 V ±10% - Stable regulation point at IZT = 8.0 mA; high-voltage clamping for 120 VAC-derived supplies. |
| Power Dissipation (PD) | 5.0 W at TL < 25 °C - Requires thermal management via lead conduction; derates to 1.38 W at TA = 25 °C on FR4. |
| Dynamic Impedance (ZZT) | 230 Ω @ 8.0 mA - Low AC impedance ensures minimal voltage variation under load transients. |
| Max Reverse Current (IR) | ≤ 0.5 µA @ VR = 106 V - Ensures negligible leakage in high-impedance bias networks. |
| Junction Temperature Range | –65 °C to +150 °C - Suitable for industrial and automotive under-hood environments. |
| Thermal Resistance (RθJL) | 25 °C/W - Enables efficient heat transfer to PCB copper; critical for sustained 5 W operation. |
| Surge Current (IZSM) | 1500 A (8.3 ms half-sine) - Withstands lightning-induced or inductive-switching transients. |
Pinout & Package
DO-215AA gull-wing surface-mount package with cathode indicated by band; banded end must be held positive relative to anode during operation. Leads are RoHS-compliant annealed matte-tin plated and solderable per MIL-STD-750 Method 2026.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Reference/Return node | Connected to system ground or lower-potential rail; carries full Zener current during regulation. |
| Cathode | Regulated output node | Banded terminal; held at stable 140 V above anode; interfaces directly with feedback or clamp circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC 1N5382B equivalent | Identical electrical specs and testing to legacy axial 1N5382B - enables drop-in replacement in legacy designs. |
| Level 1 moisture sensitivity | No dry pack required - simplifies SMT handling and eliminates bake-out steps before reflow. |
| Gull-wing lead form | Visible solder joints - enables automated optical inspection (AOI) and improves process yield verification. |
| High surge robustness | 1500 A non-repetitive surge rating - protects downstream circuitry from ESD and inductive kick events. |
| RoHS-compliant plating | e3 suffix denotes matte-tin finish - satisfies environmental compliance without sacrificing solderability. |
Applications
| Industrial Power Supply Regulation | Automotive ECU Voltage Clamping |
|---|---|
Use Scenario: Stabilizes reference voltage in isolated flyback auxiliary supplies powering control ICs. IC Role / Device Role / Timing Role: Zener voltage reference and overvoltage clamp protecting feedback optocoupler input. Use Value: Maintains 140 V regulation despite ±10% tolerance and 230 Ω dynamic impedance, ensuring consistent feedback loop behavior across temperature. |
Use Scenario: Suppresses load-dump transients on 12 V battery rails in engine control units. IC Role / Device Role / Timing Role: High-energy transient suppressor placed across microcontroller power pins. Use Value: Absorbs 1500 A surge (8.3 ms) without failure, preventing latch-up or damage to 5 V LDO regulators downstream. |
| Telecom Line Card Protection | Renewable Energy Inverter DC Bus Monitoring |
Use Scenario: Guards analog front-end inputs against induced surges on telecom line interface cards. IC Role / Device Role / Timing Role: Precision voltage clamp limiting input to ADC driver stage. Use Value: 0.5 µA leakage at 106 V ensures minimal offset error in high-impedance sensing paths. |
Use Scenario: Provides scaled-down voltage reference for DC bus monitoring in solar inverters (600–1000 V systems). IC Role / Device Role / Timing Role: High-voltage divider element enabling safe MCU-level sensing of bus voltage. Use Value: 140 V Zener voltage allows use in 10:1+ resistor dividers while maintaining tight regulation and low tempco. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener regulation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N5382B | Axial-leaded T-18 package; identical VZ, IZT, ZZT, and IR specs; no RoHS compliance (Sn/Pb plating). | Requires through-hole assembly; unsuitable for high-density SMT layouts. | Select when legacy through-hole manufacturing or cost-sensitive non-RoHS projects demand exact JEDEC form factor. |
| SMBJ5382B | DO-214AA J-bend package; same VZ, IZT, and electrical specs; RθJA = 90 °C/W vs. SMBG's 25 °C/W junction-to-lead path. | Limited thermal performance in high-power continuous operation due to higher thermal resistance to ambient. | Select when board space permits J-bend footprint and thermal load remains below 1.38 W at ambient conditions. |
Compared with SMBG5382AE3/TR13, 1N5382B requires through-hole assembly and lacks RoHS compliance, while SMBJ5382B offers identical Zener characteristics but inferior thermal conduction-making SMBG5382AE3/TR13 optimal for high-reliability, high-power SMT applications demanding visible solder joints and lead-based heat sinking.
Availability
SMBG5382AE3/TR13 is available at Aetrix Electronics and suitable for industrial power supply regulation, automotive ECU voltage clamping, and telecom line card protection requiring stable component supply, RoHS compliance, and verified surge robustness.
Supply support for SMBG5382AE3/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, RF, and discrete components for aerospace, defense, and industrial markets.
The SMBG53xxB series was designed to deliver JEDEC-equivalent Zener performance in surface-mount gull-wing packages, targeting high-density power regulation and transient protection where thermal conduction and visual solder inspection are critical.
FAQ
What is the Zener voltage tolerance of SMBG5382AE3/TR13?
The 'A' suffix in SMBG5382AE3/TR13 indicates a ±10% Zener voltage tolerance. At 25 °C, its nominal VZ is 140 V, meaning the actual measured breakdown voltage falls between 126 V and 154 V under specified test conditions (IZT = 8.0 mA). This tolerance is confirmed in the Electrical Characteristics table on page 3 of the Microsemi datasheet T4-LDS-0246-1.
Does SMBG5382AE3/TR13 require dry packing before reflow soldering?
No, SMBG5382AE3/TR13 does not require dry packing. Its moisture sensitivity level is IPC/JEDEC J-STD-020B Level 1, meaning it can be stored indefinitely at standard ambient conditions (≤30 °C / 60% RH) without baking. This is explicitly stated in the "MECHANICAL and PACKAGING" section on page 2 of the Microsemi datasheet.
What is the maximum surge current rating for SMBG5382AE3/TR13?
SMBG5382AE3/TR13 has a maximum non-repetitive Zener surge current (IZSM) of 1500 A for an 8.3 ms half-sine waveform, as specified in the Electrical Characteristics table on page 3 of the Microsemi datasheet. This rating applies only to single-event transients and must not be exceeded repeatedly without thermal recovery time.
How does the thermal resistance of SMBG5382AE3/TR13 compare between junction-to-lead and junction-to-ambient?
SMBG5382AE3/TR13 has RθJL = 25 °C/W and RθJA = 90 °C/W (on FR4 with recommended footprint). The 25 °C/W junction-to-lead path enables effective heat conduction through PCB copper traces, while the higher RθJA reflects limited natural convection cooling-confirming that lead conduction is the primary thermal path for sustained 5 W operation.
Is SMBG5382AE3/TR13 compatible with lead-free reflow profiles?
Yes, SMBG5382AE3/TR13 is qualified for lead-free reflow with a peak solder temperature of 260 °C for 10 seconds, as documented in the "MAXIMUM RATINGS" table on page 1. Its RoHS-compliant matte-tin (e3) plating ensures reliable wetting and intermetallic formation under standard Pb-free reflow profiles (e.g., JEDEC J-STD-020).
SMBG5382AE3/TR13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- DO-215AA, SMB Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 140 V
- Tolerance:
- ±10%
- Power - Max:
- 5 W
- Impedance (Max) (Zzt):
- 230 Ohms
- Current - Reverse Leakage @ Vr:
- 500 nA @ 101 V
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 1 A
- Operating Temperature:
- -65°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AA (SMBG)
SMBG5382AE3/TR13 FAQ
1.How can I place an order for SMBG5382AE3/TR13 through Aetrix?
Please submit a Request for Quotation (RFQ) for SMBG5382AE3/TR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMBG5382AE3/TR13 reliable?
The price and inventory of SMBG5382AE3/TR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMBG5382AE3/TR13 is usually 5 days.
3.What payment methods are accepted for SMBG5382AE3/TR13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMBG5382AE3/TR13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMBG5382AE3/TR13?
SMBG5382AE3/TR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMBG5382AE3/TR13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMBG5382AE3/TR13?
For technical support, including SMBG5382AE3/TR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMBG5382AE3/TR13 requirements.
6.How does Aetrix verify that SMBG5382AE3/TR13 is sourced from the original manufacturer or authorized distributors?
All SMBG5382AE3/TR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMBG5382AE3/TR13 meets industry standards.
7.What is the process for return or replacement of SMBG5382AE3/TR13?
All SMBG5382AE3/TR13 units undergo pre-shipment inspection (PSI). If there is an issue with SMBG5382AE3/TR13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMBG5382AE3/TR13 part is unused and in its original packaging.
Return procedure for SMBG5382AE3/TR13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMBG5382AE3/TR13 Tags

-
MMBZ5240B-7-F
Diodes Incorporated

-
BZT52C5V6T-7
Diodes Incorporated

-
MMSZ5231B-7-F
Diodes Incorporated

-
BZT52C15-7-F
Diodes Incorporated

-
BZX84C3V3LT1G
onsemi

-
MMSZ5245BS-7-F
Diodes Incorporated

-
MMSZ4682T1G
onsemi

-
BZT52C15S-7-F
Diodes Incorporated

-
MM5Z5V1ST1G
onsemi

-
SMAJ4744A-TP
Micro Commercial Co

-
BZT52C3V6LP-7
Diodes Incorporated

-
SMAZ12-13-F
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

